Patents by Inventor Ming-Hsiung Wei
Ming-Hsiung Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9150769Abstract: Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath.Type: GrantFiled: April 9, 2012Date of Patent: October 6, 2015Assignee: National Chung-Shan Institute of Science and TechnologyInventors: Yi-Hsiuan Yu, Ping-Szu Tsai, Tsung-Hsien Tsai, Bao-Yann Lin, Ming-Hsiung Wei
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Patent number: 9000098Abstract: Polymer spheres are fabricated. Dispersing polymerization and a two-stage swelling procedure are processed. The polymer spheres fabricated have uniform granular sizes and are highly cross-linking. Thus, the polymer spheres are heat-resistant and solvent-resistant.Type: GrantFiled: May 14, 2012Date of Patent: April 7, 2015Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National DefenseInventors: Ming-Hsiung Wei, Yu-Wei Hou, Hui Chen, Chun-Lan Tseng
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Patent number: 8808583Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.Type: GrantFiled: June 30, 2010Date of Patent: August 19, 2014Assignee: Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D.Inventors: Yi-Hsiuan Yu, Bao-Yann Lin, Ming-Hsiung Wei, Lea-Hwung Leu, Gou-Hong Yiin, Chen-Chi M Ma
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Publication number: 20130303703Abstract: Polymer spheres are fabricated. Dispersing polymerization and a two-stage swelling procedure are processed. The polymer spheres fabricated have uniform granular sizes and are highly cross-linking. Thus, the polymer spheres are heat-resistant and solvent-resistant.Type: ApplicationFiled: May 14, 2012Publication date: November 14, 2013Applicant: Chung-Shan Institute of Science and Technology, Armaments,Bureau, Ministry of National DefenseInventors: Ming-Hsiung Wei, Yu-Wei Hou, Hui Chen, Chun-Lan Tseng
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Publication number: 20130264513Abstract: Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath.Type: ApplicationFiled: April 9, 2012Publication date: October 10, 2013Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National DefenseInventors: Yi-Hsiuan Yu, Ping-Szu Tsai, Tsung-Hsien Tsai, Bao-Yann Lin, Ming-Hsiung Wei
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Publication number: 20130052276Abstract: Disclosed is a method for making an antimicrobial material from 1D nanometer silver that does not accumulate in a human body. At first, 1D nanometer silver is mixed in hydrophilic solution to produce 1D nanometer silver solution. Then, adhesive is blended in the 1D nanometer silver solution to produce the antimicrobial material. The antimicrobial material may be used in antimicrobial liquid, antimicrobial dressing or antimicrobial composite. Human skin can easily block the 1D nanometer silver. Therefore, the 1D nanometer silver does not enter or accumulate in the human body. Yet, the antimicrobial material exhibits a high bactericidal rate.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: Chung-Shan Institute of Science and Technology Armaments, Bureau, ministry of National DefenceInventors: Yi-Hsiuan Yu, Ming-Hsiung Wei, Lea-Hwung Leu, Kai-Yai Chang, Shen-fey Yeh, Fen-Yu Chung, Chen-Chi Ma
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Publication number: 20120280168Abstract: A thermo-interface material composite uses a thermo-interface material containing silver nanowires. The silver nanowires have high aspect ratios, high thermo-conductivity coefficients and good anti-oxidation capabilities. Hence, an amount of silver nanowires can be added fewer than that of a traditional metal or ceramic powder. In this way, defects on device surface can be speckled during a dispersal process for improving adhesion between devices. Thus, a thermo-interface material is fabricated to obtain a high thermo-conductivity coefficient for further forming a thermo-channel.Type: ApplicationFiled: May 3, 2011Publication date: November 8, 2012Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National DefenseInventors: Chen-Chi Ma, Ming-Hsiung Wei, Yi-Hsiuan Yu, Chih-Chun Teng
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Patent number: 8241815Abstract: A solid oxide fuel cell (SOFC) device having a gradient interconnect is provided, including a first gradient interconnect having opposing first and second surfaces, a first trench formed over the first surface of the first gradient interconnect, a second trench formed over the second surface of the first gradient interconnect, and an interconnecting tunnel formed in the first gradient interconnect for connecting the first and second trenches. A first porous conducting disc is placed in the first trench and partially protrudes over the first surface of the first gradient interconnect. A first sealing layer is placed over the first surface of the first gradient interconnect and surrounds the first trench. A membrane electrode assembly (MEA) is placed over the first surface of the first gradient interconnect and contacted with the first porous conducting disc and the first sealing layer.Type: GrantFiled: April 2, 2010Date of Patent: August 14, 2012Assignee: National Taiwan University of Science and TechnologyInventors: Dong-Hau Kuo, Ren-Kae Shiue, Hung-Li Hsu, Ming-Hsiung Wei
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Patent number: 8220695Abstract: Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.Type: GrantFiled: December 16, 2011Date of Patent: July 17, 2012Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National DefenseInventors: Ming-Hsiung Wei, Dong-Hau Kuo, Ren-Kae Shiue, Kai-Ting Yeh
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Publication number: 20120001130Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Applicant: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.Inventors: Yi-Hsiuan Yu, Bao-Yann Lin, Ming-Hsiung Wei, Lea-Hwung Leu, Gou-Hong Yiin, Chen-Chi M. Ma
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Patent number: 8029700Abstract: The invention provides a compound of silver nanowire with polymer. The compound comprises a resin, a dispersant, and a plurality of silver nanowires. The dispersant is capable of copolymerizing with the resin. The dispersant has a plurality of functional groups capable of connecting with the silver nanowires respectively. Therefore, the silver nanowires could disperse in the resin by means of the functional groups of the dispersant.Type: GrantFiled: April 30, 2009Date of Patent: October 4, 2011Assignee: Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National DefenseInventors: Ming-Hsiung Wei, Kuo-Chu Hwang, Chieh-Lin Kuo, Kai-Yia Chang
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Publication number: 20100291468Abstract: A solid oxide fuel cell (SOFC) device having a gradient interconnect is provided, including a first gradient interconnect having opposing first and second surfaces, a first trench formed over the first surface of the first gradient interconnect, a second trench formed over the second surface of the first gradient interconnect, and an interconnecting tunnel formed in the first gradient interconnect for connecting the first and second trenches. A first porous conducting disc is placed in the first trench and partially protrudes over the first surface of the first gradient interconnect. A first sealing layer is placed over the first surface of the first gradient interconnect and surrounds the first trench. A membrane electrode assembly (MEA) is placed over the first surface of the first gradient interconnect and contacted with the first porous conducting disc and the first sealing layer.Type: ApplicationFiled: April 2, 2010Publication date: November 18, 2010Applicant: NATIONAL TAIWAN UNIVERSITY OF SCIENCE & TECHNOLOGYInventors: Dong-Hau Kuo, Ren-Kae Shiue, Hung-Li Hsu, Ming-Hsiung Wei
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Publication number: 20100276648Abstract: The invention provides a compound of silver nanowire with polymer. The compound comprises a resin, a dispersant, and a plurality of silver nanowires. The dispersant is capable of copolymerizing with the resin. The dispersant has a plurality of functional groups capable of connecting with the silver nanowires respectively. Therefore, the silver nanowires could disperse in the resin by means of the functional groups of the dispersant.Type: ApplicationFiled: April 30, 2009Publication date: November 4, 2010Inventors: MING-HSIUNG WEI, Kuo-Chu Hwang, Chieh-Lin Kuo, Kai-Yia Chang
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Publication number: 20100242679Abstract: The invention discloses a method for continuously fabricating silver nanowires. The method mixes a glycol solution of a silver salt and a glycol solution of a polyvinyl pyrrolidone, and the mixed solution reacts in a temperature range and a time range to form the silver nanowires. The polyvinyl pyrrolidone has high boiling point and reduction ability so as to reduce the silver salt to the silver nanoparticles, and simultaneously, the polyvinyl pyrrolidone can provide barriers for limiting the particle growth. Besides, the oxygen functional groups on the long chains of the polyvinyl pyrrolidone can keep the stably one-dimensional growth of the silver nanoparticles to form the silver nanowires during the aging process.Type: ApplicationFiled: March 29, 2009Publication date: September 30, 2010Inventors: YI-HSIUAN YU, Bao-Yann Lin, Ming-Hsiung Wei, Cheng-En Shen, Lea-Hwung Leu, Kai-Yai Chang, Chen-Chim Ma