Abstract: A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.

Abstract: An image acquisition device includes an optical sensor and a dimmer. The optical sensor includes a photosensitive area configured to convert optical signal into image signal. The dimmer is on a side of the optical sensor that receives the optical signal. The dimmer completely covers the photosensitive area. The dimmer is configured for modulating intensity of the optical signal projected onto the optical sensor. The dimmer includes dimming blocks. Each dimming block is configured for modulating intensity of light projected onto a portion of the photosensitive area. An electronic device and an image acquisition method are also provided.

Abstract: A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.

Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.

Abstract: A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.

Abstract: A method for controlling a concentration of donors in an Al-alloyed gallium oxide crystal structure includes implanting a Group IV element as a donor impurity into the crystal structure with an ion implantation process and annealing the implanted crystal structure to activate the Group IV element to form an electrically conductive region. The method may further include depositing one or more electrically conductive materials on at least a portion of the implanted crystal structure to form an ohmic contact. Examples of semiconductor devices are also disclosed and include a layer of an Al-alloyed gallium oxide crystal structure, at least one region including the crystal structure implanted with a Group IV element as a donor impurity with an ion implantation process and annealed to activate the Group IV element, an ohmic contact including one or more electrically conductive materials deposited on the at least one region.

Abstract: An electronic device for updating on-board data of power off status is provided, which combines a rewritable memory, an embedded controller, and a second network socket onto a motherboard. The rewritable memory includes a target storage area. The embedded controller includes a second network interface electrically connected to the second network socket, for receiving a writing command and a binary file. After receiving power of a standby mode, the embedded controller executes a data writing program to receive the writing command and the binary file via the second network socket and the second network interface, and writes the binary data file into the target storage area of the rewritable memory by using the data writing program.

Abstract: A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.

Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.

Abstract: An image processing device able to receive image and other data wirelessly for more reliable communication includes at least one a camera module and at least one a processing module. The camera module includes a lens, an image sensor configured for converting the captured light into electrical signals and a first integrated unit. The at least one processing module includes a processor configured for generating signals of an image according to the electrical signals, and a second integrated unit. The first integrated unit and the second integrated unit establish a non-contact wireless communication connection therebetween, thereby realizing communicating between the camera module and the processing module.

Abstract: An electronic device for updating on-board data of power off status is provided, which combines a rewritable memory, an embedded controller, and a second network socket onto a motherboard. The rewritable memory includes a target storage area. The embedded controller includes a second network interface electrically connected to the second network socket, for receiving a writing command and a binary file. After receiving power of a standby mode, the embedded controller executes a data writing program to receive the writing command and the binary file via the second network socket and the second network interface, and writes the binary data file into the target storage area of the rewritable memory by using the data writing program.

Abstract: A camera system includes a lens unit, an image sensor, a sensing unit, an adjustment unit, a memory, and a controller. The lens unit focuses reflected light to form an image. The image sensor converts the image formed by the lens unit into a digital image. The sensing unit senses an internal temperature of the camera system and an external temperature outside the camera system. The adjustment unit adjusts the lens unit. The memory stores preset adjustment amounts for adjusting the lens unit according to different internal temperatures of the camera system operating at different external temperatures. The controller receives the internal temperature and the external temperature sensed by the sensing unit, retrieves the corresponding preset adjustment amount from the memory according to the sensed temperatures, and controls the adjustment unit to adjust the lens unit according to the preset adjustment amount.

Abstract: A composite wall assembly has an auxiliary wall and an inner wall. The auxiliary wall has a hollow space and a first supporting pillar having multiple first through holes. The inner wall is attached to the auxiliary wall and forms a depositing space. The inner wall has a first wall member, a second wall member, and a second supporting pillar having multiple second through holes. The depositing space is formed between the first wall member and the second wall member. The auxiliary wall provides a cushion effect and is not damaged easily in the earthquake for protecting the pipelines in the hollow space. The interior ambient temperature of the building is lowered by the hollow space of the auxiliary wall.

Abstract: A composite wall assembly has an auxiliary wall and an inner wall. The auxiliary wall has a hollow space and a first supporting pillar having multiple first through holes. The inner wall is attached to the auxiliary wall and forms a depositing space. The inner wall has a first wall member, a second wall member, and a second supporting pillar having multiple second through holes. The depositing space is formed between the first wall member and the second wall member. The auxiliary wall provides a cushion effect and is not damaged easily in the earthquake for protecting the pipelines in the hollow space. The interior ambient temperature of the building is lowered by the hollow space of the auxiliary wall.

Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

Abstract: A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.

Abstract: A method of fabricating a semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package may include one or more semiconductor die having die attach pads along a single side. The leadframe may include a plurality of elongated electrical leads, extending from a first side of the leadframe, beneath the die, and terminating at a second side of the leadframe adjacent to the bond pads along the single edge of the die. The leadframe may further include a dielectric spacer layer on the elongated leads. Spacing the semiconductor die from the elongated leads using the spacer layer reduces the parasitic capacitance and/or inductance of the semiconductor package formed thereby.

Abstract: A method of fabricating a semiconductor leadframe package from a strip including multiply encapsulated leadframe packages, and a leadframe package formed thereby are disclosed. An entire row or column of leadframes gets encapsulated together. Encapsulating an entire row or column reduces the keep-out area between adjacent leadframe packages, which allows the internal leads of each leadframe and the semiconductor die coupled thereto to be lengthened.

Abstract: A method of fabricating a semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package may include a leadframe having one or more semiconductor die and one or more passive components affixed thereon. The one or more passive components may be affixed by soldering with a solder material. In embodiments, in order to prevent bleeding of the solder material during a solder reflow process, barricades are formed on the surface of the leadframe, at least partially surrounding the one or more passive components.