Patents by Inventor Ming-Hsun Lee

Ming-Hsun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250064345
    Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 27, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Je-Ping Hu, Keng-Hsun Lin, Shih-Fang Yang Mao, Pin-Chou Li, Jian-Hong Wu, Szu-Ju Li, Hui-Yu Cho, Yu-Chang Chen, Yen-Nien Lu, Jyun-Siang Hsu, Nien-Ya Lee, Kuan-Ting Ho, Ming-Chieh Tsai, Ching-Yu Huang
  • Publication number: 20250039764
    Abstract: In an electronic device provided in the disclosure, an external antenna device includes at least one directional antenna, a wireless communication module is electrically connected to the external antenna device, and a processing circuit is electrically connected to the wireless communication module.
    Type: Application
    Filed: November 5, 2023
    Publication date: January 30, 2025
    Inventors: Jui-Ting CHUANG, Tz-Shiang HUNG, Kai-Min LIN, Yu-Chen LEE, Ming-Hung CHUNG, Yao-Hsun HUANG
  • Publication number: 20240223913
    Abstract: An image acquisition device includes an optical sensor and a dimmer. The optical sensor includes a photosensitive area configured to convert optical signal into image signal. The dimmer is on a side of the optical sensor that receives the optical signal. The dimmer completely covers the photosensitive area. The dimmer is configured for modulating intensity of the optical signal projected onto the optical sensor. The dimmer includes dimming blocks. Each dimming block is configured for modulating intensity of light projected onto a portion of the photosensitive area. An electronic device and an image acquisition method are also provided.
    Type: Application
    Filed: July 24, 2023
    Publication date: July 4, 2024
    Inventors: MING-HSUN LEE, YEN-LIN PENG
  • Publication number: 20240219817
    Abstract: A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.
    Type: Application
    Filed: August 24, 2023
    Publication date: July 4, 2024
    Inventors: MING-HSUN LEE, YI-WAN WANG
  • Publication number: 20240107666
    Abstract: A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 28, 2024
    Inventors: MING-HSUN LEE, CHEN-EN LIN
  • Patent number: 11852944
    Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: December 26, 2023
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Ming-Hsun Lee, Yen-Lin Peng
  • Patent number: 11736785
    Abstract: A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: August 22, 2023
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventor: Ming-Hsun Lee
  • Publication number: 20230074175
    Abstract: A method for controlling a concentration of donors in an Al-alloyed gallium oxide crystal structure includes implanting a Group IV element as a donor impurity into the crystal structure with an ion implantation process and annealing the implanted crystal structure to activate the Group IV element to form an electrically conductive region. The method may further include depositing one or more electrically conductive materials on at least a portion of the implanted crystal structure to form an ohmic contact. Examples of semiconductor devices are also disclosed and include a layer of an Al-alloyed gallium oxide crystal structure, at least one region including the crystal structure implanted with a Group IV element as a donor impurity with an ion implantation process and annealed to activate the Group IV element, an ohmic contact including one or more electrically conductive materials deposited on the at least one region.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 9, 2023
    Inventors: Rebecca L. PETERSON, Ming-Hsun LEE, Alan G. JACOBS, Marko J. TADJER
  • Patent number: 11573784
    Abstract: An electronic device for updating on-board data of power off status is provided, which combines a rewritable memory, an embedded controller, and a second network socket onto a motherboard. The rewritable memory includes a target storage area. The embedded controller includes a second network interface electrically connected to the second network socket, for receiving a writing command and a binary file. After receiving power of a standby mode, the embedded controller executes a data writing program to receive the writing command and the binary file via the second network socket and the second network interface, and writes the binary data file into the target storage area of the rewritable memory by using the data writing program.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: February 7, 2023
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih-Jen Hou, Hsin-Teng Fu, Ming-Hsun Lee, Shang-Wen Wu, Dee-Lun Tsai
  • Publication number: 20220232147
    Abstract: A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 21, 2022
    Inventor: MING-HSUN LEE
  • Publication number: 20220019116
    Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.
    Type: Application
    Filed: July 14, 2021
    Publication date: January 20, 2022
    Inventors: MING-HSUN LEE, YEN-LIN PENG
  • Publication number: 20200344368
    Abstract: An image processing device able to receive image and other data wirelessly for more reliable communication includes at least one a camera module and at least one a processing module. The camera module includes a lens, an image sensor configured for converting the captured light into electrical signals and a first integrated unit. The at least one processing module includes a processor configured for generating signals of an image according to the electrical signals, and a second integrated unit. The first integrated unit and the second integrated unit establish a non-contact wireless communication connection therebetween, thereby realizing communicating between the camera module and the processing module.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 29, 2020
    Inventors: YING-LIN CHEN, MING-HSUN LEE
  • Publication number: 20200201623
    Abstract: An electronic device for updating on-board data of power off status is provided, which combines a rewritable memory, an embedded controller, and a second network socket onto a motherboard. The rewritable memory includes a target storage area. The embedded controller includes a second network interface electrically connected to the second network socket, for receiving a writing command and a binary file. After receiving power of a standby mode, the embedded controller executes a data writing program to receive the writing command and the binary file via the second network socket and the second network interface, and writes the binary data file into the target storage area of the rewritable memory by using the data writing program.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 25, 2020
    Inventors: Chih-Jen Hou, Hsin-Teng Fu, Ming-Hsun Lee, Shang-Wen Wu, Dee-Lun Tsai
  • Patent number: 10623646
    Abstract: A camera system includes a lens unit, an image sensor, a sensing unit, an adjustment unit, a memory, and a controller. The lens unit focuses reflected light to form an image. The image sensor converts the image formed by the lens unit into a digital image. The sensing unit senses an internal temperature of the camera system and an external temperature outside the camera system. The adjustment unit adjusts the lens unit. The memory stores preset adjustment amounts for adjusting the lens unit according to different internal temperatures of the camera system operating at different external temperatures. The controller receives the internal temperature and the external temperature sensed by the sensing unit, retrieves the corresponding preset adjustment amount from the memory according to the sensed temperatures, and controls the adjustment unit to adjust the lens unit according to the preset adjustment amount.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: April 14, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Ming-Hsun Lee, Yen-Lin Peng
  • Patent number: 9909305
    Abstract: A composite wall assembly has an auxiliary wall and an inner wall. The auxiliary wall has a hollow space and a first supporting pillar having multiple first through holes. The inner wall is attached to the auxiliary wall and forms a depositing space. The inner wall has a first wall member, a second wall member, and a second supporting pillar having multiple second through holes. The depositing space is formed between the first wall member and the second wall member. The auxiliary wall provides a cushion effect and is not damaged easily in the earthquake for protecting the pipelines in the hollow space. The interior ambient temperature of the building is lowered by the hollow space of the auxiliary wall.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: March 6, 2018
    Inventor: Ming-Hsun Lee
  • Publication number: 20170362823
    Abstract: A composite wall assembly has an auxiliary wall and an inner wall. The auxiliary wall has a hollow space and a first supporting pillar having multiple first through holes. The inner wall is attached to the auxiliary wall and forms a depositing space. The inner wall has a first wall member, a second wall member, and a second supporting pillar having multiple second through holes. The depositing space is formed between the first wall member and the second wall member. The auxiliary wall provides a cushion effect and is not damaged easily in the earthquake for protecting the pipelines in the hollow space. The interior ambient temperature of the building is lowered by the hollow space of the auxiliary wall.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 21, 2017
    Inventor: Ming-Hsun Lee
  • Patent number: 8575739
    Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: November 5, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Ming Hsun Lee, Hem Takiar
  • Publication number: 20120280378
    Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 8, 2012
    Inventors: Suresh Upadhyayula, Ming Hsun Lee, Hem Takiar
  • Patent number: 8097495
    Abstract: A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 17, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Ming Hsun Lee, Chih-Chin Liao, Cheemen Yu, Hem Takiar
  • Patent number: 7728411
    Abstract: A method of fabricating a semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package may include one or more semiconductor die having die attach pads along a single side. The leadframe may include a plurality of elongated electrical leads, extending from a first side of the leadframe, beneath the die, and terminating at a second side of the leadframe adjacent to the bond pads along the single edge of the die. The leadframe may further include a dielectric spacer layer on the elongated leads. Spacing the semiconductor die from the elongated leads using the spacer layer reduces the parasitic capacitance and/or inductance of the semiconductor package formed thereby.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: June 1, 2010
    Assignee: SanDisk Corporation
    Inventors: Ming Hsun Lee, Cheemen Yu, Hem Takiar