Patents by Inventor Ming-Hua Yang

Ming-Hua Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948971
    Abstract: A method includes forming isolations extending into a semiconductor substrate, recessing the isolation regions, wherein a semiconductor region between the isolation regions forms a semiconductor fin, forming a first dielectric layer on the isolation regions and the semiconductor fin, forming a second dielectric layer over the first dielectric layer, planarizing the second dielectric layer and the first dielectric layer, and recessing the first dielectric layer. A portion of the second dielectric layer protrudes higher than remaining portions of the first dielectric layer to form a protruding dielectric fin. A portion of the semiconductor fin protrudes higher than the remaining portions of the first dielectric layer to form a protruding semiconductor fin. A portion of the protruding semiconductor fin is recessed to form a recess, from which an epitaxy semiconductor region is grown. The epitaxy semiconductor region expands laterally to contact a sidewall of the protruding dielectric fin.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jeng-Wei Yu, Tsz-Mei Kwok, Tsung-Hsi Yang, Li-Wei Chou, Ming-Hua Yu
  • Publication number: 20240096847
    Abstract: A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package component includes a second dielectric layer including a second dielectric material different from the first dielectric material. The second dielectric material comprises silicon and an element selected from the group consisting of carbon, nitrogen, and combinations thereof. An annealing process is performed to bond the first dielectric layer to the second dielectric layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Hua Yu, Wen-Chih Chiou, Ku-Feng Yang, Ming-Tsu Chung
  • Patent number: 11788129
    Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: October 17, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Min-Yuan Chou, Kuang-Chi Cheng, Ming-Hua Yang, Jiun-Lin Guo
  • Publication number: 20220267828
    Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).
    Type: Application
    Filed: December 10, 2021
    Publication date: August 25, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Min-Yuan CHOU, Kuang-Chi CHENG, Ming-Hua YANG, Jiun-Lin GUO
  • Patent number: 8758756
    Abstract: An anti-human epidermal growth factor receptor (EGFR) antibody including an amino acid sequence as set forth in SEQ ID No. 3 is provided. The antibody binding to a labeling agent and used for labeling cells is also provided. A novel method for screening an anti-EGFR antibody is further provided.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: June 24, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Hsiang-Ching Wang, Ming-Hua Yang, Ling-Mei Wang, Min-Yuan Chou, Jyuan-Jyuan Syu
  • Patent number: 8663598
    Abstract: One embodiment of the disclosure provides an amino sequence of an anti-human transferrin receptor antibody, including: an amino sequence of a heavy chain variable region which is represented by SEQ ID NO.: 1 or SEQ ID NO.: 2, wherein the anti-human transferrin receptor antibody is capable of specifically binding to a human transferrin receptor.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: March 4, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hua Yang, Min-Yuan Chou, Hsiang-Ching Wang
  • Publication number: 20130171174
    Abstract: An anti-human epidermal growth factor receptor (EGFR) antibody including an amino acid sequence as set forth in SEQ ID No. 3 is provided. The antibody binding to a labeling agent and used for labeling cells is also provided. A novel method for screening an anti-EGFR antibody is further provided.
    Type: Application
    Filed: September 12, 2012
    Publication date: July 4, 2013
    Inventors: Hsiang-Ching WANG, Ming-Hua Yang, Ling-Mei Wang, Min-Yuan Chou, Jyuan-Jyuan Syu
  • Publication number: 20130171061
    Abstract: One embodiment of the disclosure provides an amino sequence of an anti-human transferrin receptor antibody, including: an amino sequence of a heavy chain variable region which is represented by SEQ ID NO.: 1 or SEQ ID NO.: 2, wherein the anti-human transferrin receptor antibody is capable of specifically binding to a human transferrin receptor.
    Type: Application
    Filed: September 11, 2012
    Publication date: July 4, 2013
    Inventors: Ming-Hua YANG, Min-Yuan Chou, Hsiang-Ching Wang
  • Patent number: 5269043
    Abstract: The invention is a pneumatic hinge which makes use of the air pressure action and counter balance to produce a spring-free hinge structuring to improve the ability to interrupt an opening or closing door at one's disposal of the traditional spring hinge, to eliminate its disadvantage as well as to produce more practical value.
    Type: Grant
    Filed: July 23, 1992
    Date of Patent: December 14, 1993
    Inventor: Ming-Hua Yang