Abstract: A method for forming a semiconductor structure includes the steps of forming a stacked structure on a substrate, forming an insulating layer on the stacked structure, forming a passivation layer on the insulating layer, performing an etching process to form an opening through the passivation layer and the insulating layer to expose a portion of the stacked structure and an extending portion of the insulating layer, and forming a contact structure filling the opening and directly contacting the stacked structure, wherein the extending portion of the insulating layer is adjacent to a surface of the stacked structure directly contacting the contact structure.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A liquid crystal display (LCD) panel adapted to alleviate the separation issue between the pixel array substrate and the opposite substrate is provided. The LCD panel includes a pixel array substrate, a first sealant pattern, a liquid crystal layer, a second sealant pattern and an opposite substrate. The pixel array substrate has an active region and a peripheral region surrounding the active region. The first sealant pattern surrounds the active region. The liquid crystal layer is located on the active region and is located inside the first sealant pattern. The second sealant pattern is located outside the first sealant pattern, and the second sealant pattern includes at least one two-dimensional extending structure. The at least one two-dimensional extending structure is located outside a sidewall corresponding to the first sealant pattern, and includes a plurality of turning structures. The opposite substrate faces the pixel array substrate.

Abstract: The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400° C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.

Abstract: The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400° C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.

Abstract: The present disclosure provides an optical readout imaging system may include first electrode, a thin film disposed on the first electrode, a biomolecule transfer layer disposed on the thin film, and a second electrode disposed on the biomolecule transfer layer. The present disclosure also provides a biochemical detection method using the optical readout imaging system.

Abstract: A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact pad is T, and a width of the at least one recess is B, The ACF is disposed on the contact pad and includes a plurality of conductive particles; each of the conductive particles is disposed in the at least one recess. A diameter of the conductive particles is A, and A is larger than B and T and satisfies B?2(AT?T2)1/2. The contact structure is disposed on the ACF and electrically connected to the contact pad via the conductive particles. The disclosure also provides a flexible device including a substrate, a patterned insulating layer, at least one contact pad, ACF, and a contact structure.

Abstract: A quantum dot-containing wavelength converter includes a matrix layer and quantum dots dispersed in the matrix layer. Each of the quantum clots includes a core of a compound M1A1, an inner shell, and a multi-pod-structured outer shell of a compound M1A2 or M2A2. Each of M1 and M2 is a metal selected from Zn, Sn, Pb, Cd, In, Ga, Ge, Mn, Co, Fe, Al, Mg, Ca, Sr, Ba, Ni, Ag, Ti and Cu, and each of A1 and A2 is an element selected from Se, S, Te, P, As, N, I, and O. The inner shell contains a compound M1xM21-xAlyA21-y, wherein M2 is different from M1 and A2 is different from A1. The multi-pod-structured outer shell has a base portion and protrusion portions that extend from the base portion in a direction away from the inner shell.

Abstract: The present disclosure provides an optical readout imaging system may include first electrode, a thin film disposed on the first electrode, a biomolecule transfer layer disposed on the thin film, and a second electrode disposed on the biomolecule transfer layer. The present disclosure also provides a biochemical detection method using the optical readout imaging system.

Abstract: Disclosed is a flexible radiation detector including a substrate, a switching device on the substrate, an energy conversion layer on the switching device, a top electrode layer on the energy conversion layer, a first phosphor layer on the top electrode layer, and a second phosphor layer under the substrate.

Abstract: Disclosed is a flexible radiation detector including a substrate, a switching device on the substrate, an energy conversion layer on the switching device, a top electrode layer on the energy conversion layer, a first phosphor layer on the top electrode layer, and a second phosphor layer under the substrate.

Abstract: A human-machine interface device suitable for being electrically connected to an electronic device. The human-machine interface device includes a flexible carrier having at least one flexible portion, a bending sensor, and a control module. The bending sensor is disposed on the flexible portion of the flexible carrier. The control module is disposed on the carrier, connected to the bending sensor, and electrically connected to the electronic device. A first operation signal from the bending sensor is transmitted to the electronic device through the control module so that the electronic device performs according to the first operation signal.

Abstract: A touch panel and an electronic device thereof are provided. The touch panel includes a film, a substrate and a plurality of dot spacers. The dot spacers are disposed on a surface of the substrate, and the surface faces the film. In addition, the height of the dot spacers in each unit size of the substrate progressively decreases from the vertical-axis direction of the center of the substrate to the horizontal axis direction thereof.

Abstract: A touch panel and an electronic device thereof are provided. The touch panel includes a film, a substrate and a plurality of dot spacers. The dot spacers are disposed on a surface of the substrate, and the surface faces the film. In addition, the number of/the volume of the dot spacers in each unit size of the substrate progressively decreases from the vertical-axis direction of the center of the substrate to the horizontal axis direction thereof.