Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: A sensing element for electromagnetic wave detection, electrical radiography imaging system applying the element and method thereof is provided. The sensing element may include a substrate, an active component on the substrate, a plurality of first electrodes on the substrate, a plurality of second electrodes on the substrate, a first blocking layer, a photo-conversion layer on the first blocking layer, and a third electrode on the photo-conversion layer. The plurality of first electrodes is coupled together. The plurality of first electrodes is interlaced with the plurality of second electrodes and is coupled together. The first blocking layer is on the active component, the plurality of first electrodes, and the plurality of second electrodes. The photo-conversion layer is for absorbing electromagnetic wave transmitted through an object being imaged by a radiography imaging system and generates electric charges collected by the plurality of first and second electrodes, and the third electrodes.

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract: A sensing element for electromagnetic wave detection, electrical radiography imaging system applying the element and method thereof is provided. The sensing element may include a substrate, an active component on the substrate, a plurality of first electrodes on the substrate, a plurality of second electrodes on the substrate, a first blocking layer, a photo-conversion layer on the first blocking layer, and a third electrode on the photo-conversion layer. The plurality of first electrodes is coupled together. The plurality of first electrodes is interlaced with the plurality of second electrodes and is coupled together. The first blocking layer is on the active component, the plurality of first electrodes, and the plurality of second electrodes. The photo-conversion layer is for absorbing electromagnetic wave transmitted through an object being imaged by a radiography imaging system and generates electric charges collected by the plurality of first and second electrodes, and the third electrodes.

Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract: A display device includes a first substrate, at least a first protrusion, a first electrode, a second substrate, at least a second protrusion, a second electrode and a display medium. The first protrusion is disposed on the first substrate. The first electrode is disposed on the first protrusion. The second substrate is disposed opposite to the first substrate. The second protrusion is disposed on the second substrate. The second electrode is disposed on the second protrusion, wherein the first electrode and the second electrode are displaced in a horizontal direction so as to form a lateral electric field therebetween. The display medium is sandwiched between the first and the second substrates.

Abstract: A pixel unit of an electrochromic display panel and a driving method thereof are described. The pixel unit includes a first substrate; a first electrode and a second electrode, on the first substrate; a first auxiliary counter electrode, on the first substrate and disposed between the first electrode and the second electrode; a first electrochromic material, on the first electrode; a second electrochromic material, on the second electrode; a second substrate, opposite to the first substrate; a third electrode, on the second substrate; a third electrochromic material, on the third electrode; and an electrolyte layer, between the first substrate and the second substrate.

Abstract: A display device includes a first substrate, at least a first protrusion, a first electrode, a second substrate, at least a second protrusion, a second electrode and a display medium. The first protrusion is disposed on the first substrate. The first electrode is disposed on the first protrusion. The second substrate is disposed opposite to the first substrate. The second protrusion is disposed on the second substrate. The second electrode is disposed on the second protrusion, wherein the first electrode and the second electrode are displaced in a horizontal direction so as to form a lateral electric field therebetween. The display medium is sandwiched between the first and the second substrates.

Abstract: An extendable display device including an extendable substrate, and microcapsule display film. The microcapsule display film is located on the extendable substrate. The microcapsule display film includes a microcapsule display material and a plasticizer.

Abstract: A pixel unit of an electrochromic display panel and a driving method thereof are described. The pixel unit includes a first substrate; a first electrode and a second electrode, on the first substrate; a first auxiliary counter electrode, on the first substrate and disposed between the first electrode and the second electrode; a first electrochromic material, on the first electrode; a second electrochromic material, on the second electrode; a second substrate, opposite to the first substrate; a third electrode, on the second substrate; a third electrochromic material, on the third electrode; and an electrolyte layer, between the first substrate and the second substrate.

Abstract: A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

Abstract: A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

Abstract: A fabrication method of a radio frequency identification (RFID) antenna coil is provided. First, a substrate is processed by a surface modified procedure, to form a self-assembly membranes (SAMs) on a surface of the substrate. A catalyst is sprayed on the SAMs of the substrate according to patterning. After that, the first electroless plating procedure is first carried out for the substrate to generate a magnetic metal layer corresponding to the wiring pattern on the catalyst, and the second electroless plating procedure is then carried out for the substrate to generate the metal layer on the magnetic metal layer.

Abstract: A method for calculating ink-jet printing data is disclosed. A preset pattern is first obtained. Ink-jet points required for the preset pattern are calculated to select a filtering mode. A filtering operation is implemented on the preset pattern according to the filtering mode, resulting in an applicable number of ink-jet points for the preset pattern. The preset pattern is printed on a base board based on the resulting ink-jet points.

Abstract: A method for forming miniature wires by printing or dispensing a solution on a substrate, the solution comprising a solute being capable of being etched and forming an inner and outer region on the substrate, each region having a thickness. After an etching process is applied on the substrate, the region inner region is removed so the outer region remains as desired wires. A line width of thus formed wires is narrowed to reach micron-scale wires.

Abstract: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.

Abstract: A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.

Abstract: An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.