Patents by Inventor Ming-Hui Lu
Ming-Hui Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071656Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.Type: ApplicationFiled: January 13, 2023Publication date: February 29, 2024Inventors: Chien Hui WU, Yung-Hsien CHANG, Cheng-Yu TUNG, Ming-Hsun LU, Yi-An SHA
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Patent number: 10501660Abstract: Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.Type: GrantFiled: March 11, 2019Date of Patent: December 10, 2019Assignee: UWIZ Technology Co., Ltd.Inventors: Yun-Lung Ho, Chung-Wei Chiang, Song-Yuan Chang, Ming-Hui Lu, Ming-Che Ho
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Publication number: 20190203073Abstract: Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.Type: ApplicationFiled: March 11, 2019Publication date: July 4, 2019Applicant: UWIZ Technology Co., Ltd.Inventors: Yun-Lung Ho, Chung-Wei Chiang, Song-Yuan Chang, Ming-Hui Lu, Ming-Che Ho
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Publication number: 20170253766Abstract: Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.Type: ApplicationFiled: June 8, 2016Publication date: September 7, 2017Inventors: Yun-Lung Ho, Chung-Wei Chiang, Song-Yuan Chang, Ming-Hui Lu, Ming-Che Ho
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Patent number: 9718991Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.Type: GrantFiled: May 28, 2015Date of Patent: August 1, 2017Assignee: UWIZ TECHNOLOGY CO., LTD.Inventors: Yi Han Yang, Wen Cheng Liu, Ming Che Ho, Ming Hui Lu, Song Yuan Chang
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Publication number: 20160347971Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.Type: ApplicationFiled: May 28, 2015Publication date: December 1, 2016Applicant: UWIZ TECHNOLOGY CO.,LTD.Inventors: YI HAN YANG, WEN CHENG LIU, MING CHE HO, MING HUI LU, SONG YUAN CHANG
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Patent number: 9493678Abstract: A polishing composition comprising abrasive particles, a compound having hexavalent molybdenum or pentavalent vanadium, an anionic additive, a halogen oxides compound or salts thereof, and a carrier solvent is provided herein. The polishing composition is suitable for chemical mechanical polishing process of SiGe, Si and SiO2 substrates. The compound having hexavalent molybdenum or pentavalent can effectively raise the removal rate for SiGe and Si substrates, and increase the polishing selectivity of SiGe and Si relative to SiO2, simultaneously.Type: GrantFiled: January 15, 2015Date of Patent: November 15, 2016Assignee: UWiZ Technology Co., Ltd.Inventors: Yun Lung Ho, Chun Chieh Lee, Song Yuan Chang, Ming Hui Lu, Ming Che Ho
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Publication number: 20160208141Abstract: A polishing composition comprising abrasive particles, a compound having hexavalent molybdenum or pentavalent vanadium, an anionic additive, a halogen oxides compound or salts thereof, and a carrier solvent is provided herein. The polishing composition is suitable for chemical mechanical polishing process of SiGe, Si and SiO2 substrates. The compound having hexavalent molybdenum or pentavalent can effectively raise the removal rate for SiGe and Si substrates, and increase the polishing selectivity of SiGe and Si relative to SiO2, simultaneously.Type: ApplicationFiled: January 15, 2015Publication date: July 21, 2016Applicant: UWIZ TECHNOLOGY CO.,LTD.Inventors: Yun Lung Ho, Chun Chieh Lee, Song Yuan Chang, Ming Hui Lu, Ming Che Ho
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Patent number: 9165760Abstract: A cleaning composition is provided. The cleaning composition includes at least one polyamino-polycarboxylic acid or at least one salt thereof, at least one solvent, at least one substituted or non-substituted phenethylamine and water. The solvent is selected from a group consisting of glycols.Type: GrantFiled: October 16, 2013Date of Patent: October 20, 2015Assignee: UWIZ Technology Co., Ltd.Inventors: Yu-Chi Fu, Wen-Tsai Tsai, Ming-Hui Lu, Song-Yuan Chang
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Patent number: 9039925Abstract: Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R—(OCH2CH2)x—OH??formula (1) wherein x is an integer from 1 to 50, and R is selected from a group consisting of a C3-C50 alkyl group, a C6-C55 benzylalkyl group and a C6-C55 phenylalkyl group.Type: GrantFiled: August 7, 2012Date of Patent: May 26, 2015Assignee: UWIZ Technology Co., Ltd.Inventors: Wei-Jung Chen, Wen-Tsai Tsai, Ho-Ying Wu, Song-Yuan Chang, Ming-Hui Lu
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Patent number: 8901001Abstract: A slurry composition has an amount of 100% and includes abrasives, an acid-base pH adjustor, an oxidant and water. A content of the abrasives is 10 wt % to 40 wt %, and a polydisperse index of the abrasives sizes is greater than 1.8. A content of the acid-base pH adjustor is 0.01 wt % to 10 wt %. A content of the oxidant is 0.01 wt % to 10 wt %. A remaining portion of the slurry composition is water.Type: GrantFiled: August 25, 2009Date of Patent: December 2, 2014Assignee: UWIZ Technology Co., Ltd.Inventors: Song-Yuan Chang, Wen-Tsai Tsai, Ming-Hui Lu, Po-Yuan Shen
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Patent number: 8747693Abstract: A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon.Type: GrantFiled: September 13, 2012Date of Patent: June 10, 2014Assignee: UWIZ Technology Co., Ltd.Inventors: Yun-Lung Ho, Song-Yuan Chang, Ming-Hui Lu, Chung-Wei Chiang
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Publication number: 20140107008Abstract: A cleaning composition is provided. The cleaning composition includes at least one polyamino-polycarboxylic acid or at least one salt thereof, at least one solvent, at least one substituted or non-substituted phenethylamine and water. The solvent is selected from a group consisting of glycols.Type: ApplicationFiled: October 16, 2013Publication date: April 17, 2014Applicant: UWIZ Technology Co., Ltd.Inventors: Yu-Chi Fu, Wen-Tsai Tsai, Ming-Hui Lu, Song-Yuan Chang
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Patent number: 8641920Abstract: A polishing composition of the present invention at least comprises about 750 ppm to less than 5000 ppm by weight of abrasive particles, hydrogen peroxide, an accelerator, a dual-corrosion inhibitor and water, wherein the dual-corrosion inhibitor contains a first and a second corrosion inhibitor. The dual-corrosion inhibitor is applied to the planarization of metal layers so as to maintain a high removal rate of metal layers as well as suppress etching of the metal, thus capable of reducing polishing defects such as dishing, erosion and the like.Type: GrantFiled: June 11, 2009Date of Patent: February 4, 2014Assignee: UWiZ Technology Co., Ltd.Inventors: Song-Yuan Chang, Ming-Che Ho, Ming-hui Lu
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Publication number: 20130264515Abstract: Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R-(OCH2CH2)x—OH ??formula (1) wherein x is an integer from 1 to 50.Type: ApplicationFiled: August 7, 2012Publication date: October 10, 2013Applicant: UWIZ TECHNOLOGY CO., LTD.Inventors: Wei-Jung Chen, Wen-Tsai Tsai, Ho-Ying Wu, Song-Yuan Chang, Ming-Hui Lu
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Publication number: 20130068995Abstract: A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon.Type: ApplicationFiled: September 13, 2012Publication date: March 21, 2013Applicant: UWIZ TECHNOLOGY CO., LTD.Inventors: Yun-Lung Ho, Song-Yuan Chang, Ming-Hui Lu, Chung-Wei Chiang
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Publication number: 20110160112Abstract: A cleaning composition including a polyamino carboxylic salt, an acid and water is provided. The content of the polyamino carboxylic salt is 0.01 wt % to 0.5 wt %. The content of the acid is 0.01 wt % to 0.5 wt %. The remaining portion of the cleaning composition is water.Type: ApplicationFiled: October 5, 2010Publication date: June 30, 2011Applicant: UWiZ Technology Co., Ltd.Inventors: Song-Yuan Chang, Po-Yuan Shen, Wen-Tsai Tsai, Ming-Hui Lu, Cheng-Hsun Chan
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Publication number: 20100255681Abstract: A slurry composition has an amount of 100% and includes abrasives, an acid-base pH adjustor, an oxidant and water. A content of the abrasives is 10 wt % to 40 wt %, and a polydisperse index of the abrasives sizes is greater than 1.8. A content of the acid-base pH adjustor is 0.01 wt % to 10 wt %. A content of the oxidant is 0.01 wt % to 10 wt %. A remaining portion of the slurry composition is water.Type: ApplicationFiled: August 25, 2009Publication date: October 7, 2010Applicant: UWiZ Technology Co., Ltd.Inventors: Song-Yuan Chang, Wen-Tsai Tsai, Ming-Hui Lu, Po-Yuan Shen
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Publication number: 20100193728Abstract: An inhibitor composition according to the present invention at least comprises an imidazoline compound or a triazole compound or combinations thereof, and sarcosine and salt compounds thereof or combinations thereof. The inhibitor composition is applicable to chemical mechanical polishing so as to maintain a high removal rate of metal layers as well as suppress metal etching, thereby reducing polishing defects such as dishing, erosion and the like.Type: ApplicationFiled: August 5, 2008Publication date: August 5, 2010Inventors: Song-Yuan CHANG, Ming-hui Lu, Ming-Che Ho
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Patent number: 7763577Abstract: An acidic post-CMP cleaning composition includes at least one polyamino-polycarboxylic acid, or salt thereof; at least one hydroxycarboxylic acid, or salt thereof; and the remainder being substantially water. The acidic cleaning composition also includes a surfactant. The acidic post-CMP cleaning composition has a pH of 1 to 5, and is useful for removing the contaminants from the wafer surface after a CMP process without making roughness worse.Type: GrantFiled: February 27, 2009Date of Patent: July 27, 2010Assignee: Uwiz Technology Co., Ltd.Inventors: Song-Yuan Chang, Ming-Hui Lu, Wen-Jsai Jsai, Po-Yuan Shen