Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.

Abstract: The present invention relates to silicon-based powders and a method for producing the silicon-based powders. The method for producing the silicon-based powders includes a hydrolysis step of a silicon precursor having an alkoxy group, a condensation step and a drying step. By a specific weight ratio of water to the silicon precursor having the alkoxy group and a silicon precursor having a secondary amino group and an alkyl group, in the method for producing the silicon-based powders, the condensation step can be performed without organic solvents, and a modification on silicon-based gels can be performed to enhance a safety of processes and a hydrophobicity of the resulted silicon-based powders, and decrease a thermal conductivity and a bulk density of the resulted silicon-based powders.

Abstract: The present invention relates to a fiber composite material and a method for producing the fiber composite material. The method for producing the fiber composite material includes a hydrolysis step of a silicon precursor having an alkoxy group, an in-situ condensation step and a drying step. A specific silicon precursor having a secondary amino group and alkyl groups is used therein, as well as a specific weight ratio of the silicon precursor to a fiber material, the in-situ condensation step can be performed in the absence of organic solvents in the method for producing the fiber composite material, and a hydrophobic modification on silicon-based gels can be performed, thereby simplifying the process, decreasing a thermal conductivity of the resulted fiber composite material and preventing drop dust of the resulted fiber composite material.

Abstract: A regeneration method of a nitrogen-containing carbon catalyst includes the following steps: roasting the nitrogen-containing carbon catalyst in a nitrogen-containing atmosphere to obtain a regenerated nitrogen-containing carbon catalyst. The method is a universal method, which is suitable for nitrogen-doped carbon catalysts and can be used to regenerate a nitrogen-containing carbon catalyst for producing vinyl chloride (VC) through 1,2-dichloroethane cracking. The method can greatly reduce the production cost of the catalyst and increase the service life of the catalyst, and a regeneration process thereof is fast, simple, and controllable, and does not require high temperatures.

Abstract: A fuel economizer for an internal combustion engine includes a computer assembly, a battery, an operation setting system, a lead sensing fan, and an air intake fan motor. The lead sensing fan is mounted on the front of the traffic vehicle. The air intake fan motor is connected to an air inlet port of the internal combustion engine. The lead sensing fan is rotated during movement of the traffic vehicle. When the rotation speed of the lead sensing fan reaches a preset value, the lead sensing fan transmits a signal to the computer assembly which regulates the rotation speed of the air intake fan motor according to a speed grade preset by the operation setting system so as to control the air flow rate of the air inlet port of the internal combustion engine.

Abstract: A fuel economizer for an internal combustion engine includes a computer assembly, a battery, an operation setting system, a lead sensing fan, and an air intake fan motor. The lead sensing fan is mounted on the front of the traffic vehicle. The air intake fan motor is connected to an air inlet port of the internal combustion engine. The lead sensing fan is rotated during movement of the traffic vehicle. When the rotation speed of the lead sensing fan reaches a preset value, the lead sensing fan transmits a signal to the computer assembly which regulates the rotation speed of the air intake fan motor according to a speed grade preset by the operation setting system so as to control the air flow rate of the air inlet port of the internal combustion engine.

Abstract: A person re-identification method, a person re-identification system and an image screening method are provided. The person re-identification method includes the following steps. A plurality of identified images of an identified person are analyzed to obtain an interrelated array, which records a plurality of degrees of association among the identified images. The interrelated array is converted to a directed graph having at least one connected group. A representative path of each connected group is obtained. According to each representative path, a part of the identified images are outputted as at least one representative image set for performing a person re-identification process on an image to be identified.

Abstract: A person re-identification method, a person re-identification system and an image screening method are provided. The person re-identification method includes the following steps. A plurality of identified images of an identified person are analyzed to obtain an interrelated array, which records a plurality of degrees of association among the identified images. The interrelated array is converted to a directed graph having at least one connected group. A representative path of each connected group is obtained. According to each representative path, a part of the identified images are outputted as at least one representative image set for performing a person re-identification process on an image to be identified.

Abstract: An energy saving device includes a control box, a battery, an operation setting system, a car speed sensor assembly, and an air intake fan motor. Thus, the IC chip of the car speed sensor assembly identifies the car speed information detected by the five car speed sensors of the car speed sensor assembly, and transmits the car speed information to the IC circuit board of the control box, and the IC circuit board controls and regulates the rotation speed of the air intake fan motor according to the grades of the car speed preset by the operation setting system, such that the rotation speed of the air intake fan motor increases the air flow rate by a grade when the car speed is increased by a predetermined constant value.

Abstract: An energy saving device includes a control box, a battery, an operation setting system, a car speed sensor assembly, and an air intake fan motor. Thus, the IC chip of the car speed sensor assembly identifies the car speed information detected by the five car speed sensors of the car speed sensor assembly, and transmits the car speed information to the IC circuit board of the control box, and the IC circuit board controls and regulates the rotation speed of the air intake fan motor according to the grades of the car speed preset by the operation setting system, such that the rotation speed of the air intake fan motor increases the air flow rate by a grade when the car speed is increased by a predetermined constant value.

Abstract: A multipath switching system comprising of an adjustable phase shift array includes, an adjustable phase shift array module and a control module. The adjustable phase shift array module receives a radio-frequency (RF) signal, and includes at least one RF switch, at least one coupler and at least one phase shifter. The at least one RF switch, the at least one coupler and the at least one phase shifter form a number of transmission paths. The transmission paths respectively produce the processed transmission RF signals corresponding to different phase shifts to an antenna array. The control module controls the at least one RF switch and the at least one phase shifter of the adjustable phase shift array module, so that the antenna array radiates a wireless signal whose direction is corresponding to a predetermined angle in space polar coordinates.

Abstract: A fuel-saving and energy-saving car controller includes a power supercharge control box (51) electrically connected with a direct-current brushless motor (41) of a power supercharger (40). The power supercharge control box includes a communication module which reads data in the on-board diagnostics (8) and the car computer (7) so as to detect a rotation speed of the engine (20). Thus, the communication module transmits a signal to the single-chip control circuit (1) which drives the motor actuating circuit (42) which controls the direct-current brushless motor to regulate a rotation speed of the air inlet fan (44).

Abstract: According to one embodiment of a method for interference suppression in radio-over-fiber communication systems, the method uses a mode selection module to continuously update real time information of at least two mobile stations and determine to enter a cross mode or a single mode. In the single mode, when a mobile station approaches a switching point, a single mode command is issued to control at least one first specific remote antenna unit (RAU). In the cross mode, when an immediate cross condition is a new cross condition, a new cross mode table is generated, and when the position of any one mobile station of the at least two mobile stations cross a threshold, a cross mode command is issued to control at least one second specific RAU according to a corresponding cross mode table.

Abstract: An electronic car supercharger includes a housing, an air inlet pipe connected with the housing and an engine chamber, a filtering net connected with the housing, a motor cabinet mounted in the housing, a brushless motor mounted on the motor cabinet, an air inlet fan connected with the brushless motor, a circuit board electrically connected with the brushless motor, a battery electrically connected with the circuit board, and a control switch electrically connected with the circuit board and an accelerator pedal. Thus, when the accelerator pedal is released from a driver's foot, the control switch is detached from the accelerator pedal, and the brushless motor stops operating by control of the control switch to stop operation of the air inlet fan to prevent the air inlet fan from producing noise under the idling operation of the car engine.