Patents by Inventor Ming-Hung Cheng

Ming-Hung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990440
    Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai-Jun Zhan, Yung-Sheng Lin
  • Publication number: 20240136317
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Publication number: 20240128219
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
  • Patent number: 11961817
    Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240096787
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Ming-Da CHENG, Wei-Hung LIN, Hui-Min HUANG, Chang-Jung HSUEH, Po-Hao TSAI, Yung-Sheng LIN
  • Publication number: 20240088119
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • Publication number: 20240075449
    Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.
    Type: Application
    Filed: March 30, 2023
    Publication date: March 7, 2024
    Inventors: Ming-Hung CHENG, Fuh-Yih SHIH, Shih-Ming YEH, Wen-Yi WANG
  • Publication number: 20230192501
    Abstract: The present invention relates to silicon-based powders and a method for producing the silicon-based powders. The method for producing the silicon-based powders includes a hydrolysis step of a silicon precursor having an alkoxy group, a condensation step and a drying step. By a specific weight ratio of water to the silicon precursor having the alkoxy group and a silicon precursor having a secondary amino group and an alkyl group, in the method for producing the silicon-based powders, the condensation step can be performed without organic solvents, and a modification on silicon-based gels can be performed to enhance a safety of processes and a hydrophobicity of the resulted silicon-based powders, and decrease a thermal conductivity and a bulk density of the resulted silicon-based powders.
    Type: Application
    Filed: December 16, 2022
    Publication date: June 22, 2023
    Inventors: Wen-Bee KUO, Ming-Hung CHENG, Wan-Tun HUNG, Yu-Cheng CHEN, Wen-Hung TSENG, Kuo-Ming HUANG, Wen-Chieh LAI, Shang-Shih LI, Wen-Yuan CHEN, Hsin TSENG, Hsun-Ku LEE, Yu-Hsin CHEN
  • Publication number: 20230192541
    Abstract: The present invention relates to a fiber composite material and a method for producing the fiber composite material. The method for producing the fiber composite material includes a hydrolysis step of a silicon precursor having an alkoxy group, an in-situ condensation step and a drying step. A specific silicon precursor having a secondary amino group and alkyl groups is used therein, as well as a specific weight ratio of the silicon precursor to a fiber material, the in-situ condensation step can be performed in the absence of organic solvents in the method for producing the fiber composite material, and a hydrophobic modification on silicon-based gels can be performed, thereby simplifying the process, decreasing a thermal conductivity of the resulted fiber composite material and preventing drop dust of the resulted fiber composite material.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Inventors: Wen-Bee KUO, Ming-Hung CHENG, Wan-Tun HUNG, Yu-Cheng CHEN, Wen-Hung TSENG, Kuo-Ming HUANG, Wen-Chieh LAI, Shang-Shih LI, Wen-Yuan CHEN, Hsin TSENG, Hsun-Ku LEE, Yu-Hsin CHEN
  • Publication number: 20220241759
    Abstract: A regeneration method of a nitrogen-containing carbon catalyst includes the following steps: roasting the nitrogen-containing carbon catalyst in a nitrogen-containing atmosphere to obtain a regenerated nitrogen-containing carbon catalyst. The method is a universal method, which is suitable for nitrogen-doped carbon catalysts and can be used to regenerate a nitrogen-containing carbon catalyst for producing vinyl chloride (VC) through 1,2-dichloroethane cracking. The method can greatly reduce the production cost of the catalyst and increase the service life of the catalyst, and a regeneration process thereof is fast, simple, and controllable, and does not require high temperatures.
    Type: Application
    Filed: November 26, 2020
    Publication date: August 4, 2022
    Applicants: DALIAN INSTITUTE OF CHEMICAL PHYSICS, CHINESE ACADEMY OF SCIENCES, FORMOSA PLASTICS CORPORATION
    Inventors: Sisi FAN, Jinming XU, Yanqiang HUANG, Hongmin DUAN, Tao ZHANG, MING-HUNG CHENG, Wan-tun HUNG, Yu-Cheng CHEN, Chien-Hui WU, Ya-Wen CHENG, Ming-Hsien WEN, Chao-Chin CHANG, Tsao-Cheng HUANG, Lu-Chen YEH
  • Patent number: 11111863
    Abstract: A fuel economizer for an internal combustion engine includes a computer assembly, a battery, an operation setting system, a lead sensing fan, and an air intake fan motor. The lead sensing fan is mounted on the front of the traffic vehicle. The air intake fan motor is connected to an air inlet port of the internal combustion engine. The lead sensing fan is rotated during movement of the traffic vehicle. When the rotation speed of the lead sensing fan reaches a preset value, the lead sensing fan transmits a signal to the computer assembly which regulates the rotation speed of the air intake fan motor according to a speed grade preset by the operation setting system so as to control the air flow rate of the air inlet port of the internal combustion engine.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 7, 2021
    Inventor: Ming-Hung Cheng
  • Publication number: 20210131362
    Abstract: A fuel economizer for an internal combustion engine includes a computer assembly, a battery, an operation setting system, a lead sensing fan, and an air intake fan motor. The lead sensing fan is mounted on the front of the traffic vehicle. The air intake fan motor is connected to an air inlet port of the internal combustion engine. The lead sensing fan is rotated during movement of the traffic vehicle. When the rotation speed of the lead sensing fan reaches a preset value, the lead sensing fan transmits a signal to the computer assembly which regulates the rotation speed of the air intake fan motor according to a speed grade preset by the operation setting system so as to control the air flow rate of the air inlet port of the internal combustion engine.
    Type: Application
    Filed: September 30, 2020
    Publication date: May 6, 2021
    Inventor: Ming-Hung Cheng
  • Patent number: 10984251
    Abstract: A person re-identification method, a person re-identification system and an image screening method are provided. The person re-identification method includes the following steps. A plurality of identified images of an identified person are analyzed to obtain an interrelated array, which records a plurality of degrees of association among the identified images. The interrelated array is converted to a directed graph having at least one connected group. A representative path of each connected group is obtained. According to each representative path, a part of the identified images are outputted as at least one representative image set for performing a person re-identification process on an image to be identified.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 20, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Chin Yang, Ming-Hung Cheng, Chih-Chung Kao
  • Publication number: 20200302186
    Abstract: A person re-identification method, a person re-identification system and an image screening method are provided. The person re-identification method includes the following steps. A plurality of identified images of an identified person are analyzed to obtain an interrelated array, which records a plurality of degrees of association among the identified images. The interrelated array is converted to a directed graph having at least one connected group. A representative path of each connected group is obtained. According to each representative path, a part of the identified images are outputted as at least one representative image set for performing a person re-identification process on an image to be identified.
    Type: Application
    Filed: July 24, 2019
    Publication date: September 24, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Chin Yang, Ming-Hung Cheng, Chih-Chung Kao
  • Patent number: 10767578
    Abstract: An energy saving device includes a control box, a battery, an operation setting system, a car speed sensor assembly, and an air intake fan motor. Thus, the IC chip of the car speed sensor assembly identifies the car speed information detected by the five car speed sensors of the car speed sensor assembly, and transmits the car speed information to the IC circuit board of the control box, and the IC circuit board controls and regulates the rotation speed of the air intake fan motor according to the grades of the car speed preset by the operation setting system, such that the rotation speed of the air intake fan motor increases the air flow rate by a grade when the car speed is increased by a predetermined constant value.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: September 8, 2020
    Inventor: Ming-Hung Cheng
  • Publication number: 20200003138
    Abstract: An energy saving device includes a control box, a battery, an operation setting system, a car speed sensor assembly, and an air intake fan motor. Thus, the IC chip of the car speed sensor assembly identifies the car speed information detected by the five car speed sensors of the car speed sensor assembly, and transmits the car speed information to the IC circuit board of the control box, and the IC circuit board controls and regulates the rotation speed of the air intake fan motor according to the grades of the car speed preset by the operation setting system, such that the rotation speed of the air intake fan motor increases the air flow rate by a grade when the car speed is increased by a predetermined constant value.
    Type: Application
    Filed: December 20, 2018
    Publication date: January 2, 2020
    Inventor: Ming-Hung Cheng
  • Patent number: 9634389
    Abstract: A multipath switching system comprising of an adjustable phase shift array includes, an adjustable phase shift array module and a control module. The adjustable phase shift array module receives a radio-frequency (RF) signal, and includes at least one RF switch, at least one coupler and at least one phase shifter. The at least one RF switch, the at least one coupler and the at least one phase shifter form a number of transmission paths. The transmission paths respectively produce the processed transmission RF signals corresponding to different phase shifts to an antenna array. The control module controls the at least one RF switch and the at least one phase shifter of the adjustable phase shift array module, so that the antenna array radiates a wireless signal whose direction is corresponding to a predetermined angle in space polar coordinates.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: April 25, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Chien Tseng, Ming-Hung Cheng, Hsin-Piao Lin, Ching-Jen Chang
  • Patent number: 9555751
    Abstract: A fuel-saving and energy-saving car controller includes a power supercharge control box (51) electrically connected with a direct-current brushless motor (41) of a power supercharger (40). The power supercharge control box includes a communication module which reads data in the on-board diagnostics (8) and the car computer (7) so as to detect a rotation speed of the engine (20). Thus, the communication module transmits a signal to the single-chip control circuit (1) which drives the motor actuating circuit (42) which controls the direct-current brushless motor to regulate a rotation speed of the air inlet fan (44).
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: January 31, 2017
    Assignee: Dong Di Technology Co., Ltd.
    Inventor: Ming-Hung Cheng
  • Patent number: 8934777
    Abstract: According to one embodiment of a method for interference suppression in radio-over-fiber communication systems, the method uses a mode selection module to continuously update real time information of at least two mobile stations and determine to enter a cross mode or a single mode. In the single mode, when a mobile station approaches a switching point, a single mode command is issued to control at least one first specific remote antenna unit (RAU). In the cross mode, when an immediate cross condition is a new cross condition, a new cross mode table is generated, and when the position of any one mobile station of the at least two mobile stations cross a threshold, a cross mode command is issued to control at least one second specific RAU according to a corresponding cross mode table.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: January 13, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Hsien-Wen Chang, Ming-Chien Tseng, Ming-Hung Cheng