Abstract: The present disclosure provides a substrate structure including a substrate, a first electrode, a second electrode, a first signal line, and a second signal line. The substrate includes a functional region and a peripheral region, and the peripheral region is adjacent to the functional region. The first electrode and the second electrode are disposed on the substrate and arranged along a first direction. The first signal line and the second signal line are arranged on the substrate and along the first direction and extend along a second direction perpendicular to the first direction. The first signal line is electrically connected to the first electrode, and the second signal line is electrically connected to the second electrode. The first signal line and the second signal line are electrically connected to each other in the peripheral region.

Abstract: The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.

Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A suspension bracket and an installing method thereof are provided. The suspension bracket includes a first bracket, a support pole, a positioning member, and a second bracket. The first bracket has an opening and includes a first connecting structure. The support pole is pierced through the opening and configured to be disposed on a preset location, and one end of the support pole abuts against an outer side of the opening. The positioning member is disposed on the support pole and abuts against another outer side of the opening to retain the first bracket. The first bracket is rotatable relative to the positioning member and the support pole. The second bracket includes a second connecting structure, which can be detachably connected to the first connecting structure of the first bracket to form an accommodating space for containing an article.

Abstract: An electronic device and a coupler of the electronic device are provided. The coupler is adapted to be connected to a power source and a rotatable member. The coupler includes a plate body and a coupler protrusion. A coupler groove is formed on the plate body, and the power source is adapted to be wedged into the coupler groove. The coupler protrusion is disposed on the plate body and adapted to be wedged into the rotatable member.

Abstract: The present invention relates to a monitoring method for a furnace apparatus. The monitoring method includes powering on the furnace apparatus to a specific power value; recording the rate of increase of the temperature of the furnace apparatus; and comparing the rate of increase of the temperature with a predetermined threshold value, wherein the furnace apparatus is to be replaced when the rate of increase of the temperature of the furnace apparatus is less than the predetermined threshold value.