Patents by Inventor Ming-Hung Huang
Ming-Hung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967272Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.Type: GrantFiled: December 9, 2022Date of Patent: April 23, 2024Assignees: AUO Corporation, National Cheng-Kung UniversityInventors: Chih-Lung Lin, Yi-Chen Huang, Chih-I Liu, Po-Cheng Lai, Ming-Yang Deng, Chia-En Wu, Ming-Hung Chuang, Chia-Tien Peng
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Publication number: 20240128219Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
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Publication number: 20240126341Abstract: Smart rings and methods of manufacturing smart rings are provided. A waterproof design and method of manufacturing of a smart ring, in accordance with one implementation, includes a band having at least an outer surface and an inner surface. The inner surface of the band includes features configured to support electronic components. The waterproofing design and method of manufacturing includes a laser etching a portion of the inner surface and subsequent to the laser etching of the portion, applying an epoxy over the electronic components and over the laser etched portion of the inner surface. Prior to the laser etching, forming an edge rib on the portion of the inner surface, wherein the laser etching is subsequently on the edge rib. Furthermore, the laser etched portion includes an increased contact area for bonding with the epoxy for the waterproof design.Type: ApplicationFiled: February 3, 2023Publication date: April 18, 2024Inventors: Ming-Tsung Su, Hao-Hsiu Huang, Chun Hung Liu
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Patent number: 11961817Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.Type: GrantFiled: July 8, 2021Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
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Publication number: 20240115616Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
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Patent number: 11955507Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.Type: GrantFiled: September 9, 2021Date of Patent: April 9, 2024Assignee: AU OPTRONICS CORPORATIONInventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
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Patent number: 11942433Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.Type: GrantFiled: January 17, 2022Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang
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Publication number: 20240096787Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Ming-Da CHENG, Wei-Hung LIN, Hui-Min HUANG, Chang-Jung HSUEH, Po-Hao TSAI, Yung-Sheng LIN
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Patent number: 11935804Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
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Patent number: 11931456Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: GrantFiled: November 16, 2022Date of Patent: March 19, 2024Assignee: MegaPro Biomedical Co. Ltd.Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Patent number: 11935871Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.Type: GrantFiled: August 30, 2021Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
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Publication number: 20240088119Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
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Patent number: 10696783Abstract: A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.Type: GrantFiled: December 28, 2017Date of Patent: June 30, 2020Assignees: ITEQ CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Hsi Cheng, Ming-Hung Huang
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Publication number: 20190390061Abstract: A multi-layered structure is provided, which includes a carrier and a resin coating on the carrier, wherein the resin coating is formed by magnetically aligning and drying a resin composition. The resin composition includes 1 part by weight of (a) crosslinkable monomer with a biphenyl group, 1.0 to 20.0 parts by weight of (b) polyphenylene oxide, 0.1 to 10.0 parts by weight of (c) hardener, and 0.1 to 80.0 parts by weight of (d) magnetic filler. (d) Magnetic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof, with a surface modified by iron-containing oxide. (d) Magnetic filler is sheet-shaped or needle-shaped.Type: ApplicationFiled: June 22, 2018Publication date: December 26, 2019Applicants: ITEQ Corporation, Industrial Technology Research InstituteInventors: Chen-Hsi CHENG, Ming-Hung HUANG
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Publication number: 20190194383Abstract: A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.Type: ApplicationFiled: December 28, 2017Publication date: June 27, 2019Applicants: ITEQ Corporation, Industrial Technology Research InstituteInventors: Chen-Hsi CHENG, Ming-Hung HUANG
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Publication number: 20170277149Abstract: A control device with automatic adjustment includes: an ambient light illumination sensor for sensing ambient light illumination information; and a microcontroller unit coupled to the ambient light illumination sensor. The microcontroller unit analyzes respective ambient illumination information at each of a plurality of time sessions. The microcontroller unit controls a controlled device based on the respective ambient illumination information at the time sessions.Type: ApplicationFiled: June 13, 2017Publication date: September 28, 2017Inventors: Ming-Hung HUANG, Hung-Chun Li
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Patent number: 9771456Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.Type: GrantFiled: July 1, 2013Date of Patent: September 26, 2017Assignee: ITEQ CorporationInventors: Chao-Hui Kuo, Ming-Hung Huang, Po-Hsun Lee, Shun-Cheng Wang
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Patent number: 9392674Abstract: An environment detection device and an environment detection method suitable for a street lamp are provided. The environment detection method comprises the following steps. Latitude and longitude of the position of the street lamp is provided. A weather information at the position of the street lamp is detected. A first network packet is generated according to the weather information and the latitude and longitude. The first network packet is transmitted to a server.Type: GrantFiled: October 24, 2014Date of Patent: July 12, 2016Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Ching-Hsien Lin, Ming-Hung Huang, Chia-Ming Hung
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Publication number: 20150173159Abstract: An environment detection device and an environment detection method suitable for a street lamp are provided. The environment detection method comprises the following steps. Latitude and longitude of the position of the street lamp is provided. A weather information at the position of the street lamp is detected. A first network packet is generated according to the weather information and the latitude and longitude. The first network packet is transmitted to a server.Type: ApplicationFiled: October 24, 2014Publication date: June 18, 2015Inventors: Ching-Hsien LIN, Ming-Hung HUANG, Chia-Ming HUNG
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Publication number: 20150112455Abstract: A control device with automatic adjustment includes: a GPS module, for receiving a GPS satellite information; and a microcontroller unit, coupled to the GPS module. The microcontroller unit updates a control setting value based on the GPS satellite information from the GPS module, and the microcontroller unit controls a controlled device based on the control setting value.Type: ApplicationFiled: July 11, 2014Publication date: April 23, 2015Inventors: Ching-Hsien LIN, Ming-Hung HUANG, Chia-Ming Hung