Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.

Abstract: A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.

Abstract: A wireless charging device includes a casing, a wireless charging module, and an air-flow generator. The casing includes a housing part and a carrier plate disposed in the housing part to divide internal space of the housing part into a first accommodation space and a second accommodation space. The casing has an air inlet, an air outlet, and an opening. The carrier plate has a through hole. The air inlet, the air outlet, the opening, and the through hole are in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the first accommodation space for charging a mobile device supported by the carrier plate. The air-flow generator is located in the first accommodation space for creating an airflow flowing through the air inlet, the second accommodation space, the through hole, the first accommodation space, and the air outlet.

Abstract: A quick-release combination structure includes a panel and a water-proof cover. The panel includes a groove and a sliding channel. The groove is recessed from a surface of the panel. The sliding channel is connected to the groove and runs through the panel. The water-proof cover includes a cover body and a guiding plate. The cover body is configured to be at least partially accommodated in the groove and cover the sliding channel. The guiding plate is connected to the cover body and slidably inserted in the sliding channel. A thickness of the guiding plate is smaller than a distance of an inner wall of the sliding channel in a thickness direction of the guiding plate, thereby allowing two ends of the guiding plate to seesaw in the thickness direction relative to the panel.

Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.

Abstract: An antenna device includes a housing, a masking frame, and antennas. The housing includes a side wall, a bottom wall, a heat dissipation structure, and bumps. The side wall surrounds the heat dissipation structure. The bottom wall connects to an edge of the side wall and extends outwards relative to the side wall. Each one of the bumps is disposed on one of the side wall and the bottom wall. The masking frame is removably fastened on the housing and defines an accommodation space with the side wall and the bottom wall. The antennas are disposed in the accommodation space and covered by the masking frame. The bumps contact the antennas, respectively.

Abstract: A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.

Abstract: A wireless charger is configured to charge a mobile device and be connected to an air conditioner. The wireless charger includes a casing, a wireless charging module, and a valve assembly. The casing includes a first accommodation space, a second accommodation space, and an air inlet. The first accommodation space is in fluid communication with the second accommodation space, the first accommodation space is configured to accommodate the mobile device, and the air inlet is in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the second accommodation space and configured to charge the mobile device. The valve assembly is mounted to the air inlet and configured to be connected to the air conditioner.

Abstract: The present disclosure discloses a pixel structure, an array substrate and a display panel. The pixel structure includes a first data line; a first gate line and a second gate line; a first pixel unit and a second pixel unit. The first pixel units and second pixel units arranged along a second direction; a first pixel electrode relative to the second pixel electrode is close to the first data line, a first thin film transistor and second thin film transistors are arranged close to the first data line; first connecting trace is set between the first drain electrode and the first pixel electrode, a second connecting trace is set between the second drain electrode and the second pixel electrode to make a capacitance of the first pixel unit matching with a capacitance of the second pixel unit.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: The present disclosure discloses a pixel structure, an array substrate and a display panel. The pixel structure includes a first data line; a first gate line and a second gate line; a first pixel unit and a second pixel unit. The first pixel units and second pixel units arranged along a second direction; a first pixel electrode relative to the second pixel electrode is close to the first data line, a first thin film transistor and second thin film transistors are arranged close to the first data line; first connecting trace is set between the first drain electrode and the first pixel electrode, a second connecting trace is set between the second drain electrode and the second pixel electrode to make a capacitance of the first pixel unit matching with a capacitance of the second pixel unit.

Abstract: An electronic assembly and a heat dissipation assembly thereof. The electronic assembly includes a circuit board and a heat dissipation assembly. The circuit board includes a plate body and a heat source disposed on the plate body. The heat dissipation assembly includes a fin assembly, a mounting plate body, and a heat dissipation pillar. The mounting plate body is fixed to the fin assembly and includes a mounting hole. The heat dissipation pillar is engaged in the mounting hole of the mounting plate body. One end of the heat dissipation pillar is in thermal contact with the fin assembly, and another end of the heat dissipation pillar is in thermal contact with the heat source of the circuit board.

Abstract: A supporting member includes a body portion, at least one first fixing portion, and at least one second fixing portion. The first fixing portion is connected to a side of the body portion and bends relative to the body portion. The first fixing portion is configured to be fixed to a first circuit board. The second fixing portion is connected to another side of the body portion and bends relative to the body portion. The second fixing portion is configured to be fixed to a second circuit board.

Abstract: A plate for at least partially covering a first circuit board includes a body portion, at least one first fixing post, at least one second fixing post, and at least one crossing region. The body portion is configured to cover the first circuit board. The first fixing post is connected to a side of the body portion and protrudes from the body portion. The first fixing post is configured to be fixed to the first circuit board. The second fixing post is connected to another side of the body portion and protrudes from the body portion. The second fixing post is configured to be fixed to a second circuit board. The crossing region is disposed on the body portion. The crossing region is configured to allow at least one electronic component on the first circuit board to pass through.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: A supporting member includes a body portion, at least one first fixing portion, and at least one second fixing portion. The first fixing portion is connected to a side of the body portion and bends relative to the body portion. The first fixing portion is configured to be fixed to a first circuit board. The second fixing portion is connected to another side of the body portion and bends relative to the body portion. The second fixing portion is configured to be fixed to a second circuit board.

Abstract: An electronic device comprises a housing, and a fan connection member. The housing comprises a bottom plate having a motherboard mounting area. The fan connection member is disposed on the bottom plate, and an orthogonal projection of the fan connection member onto the bottom plate partially overlaps with the motherboard mounting area. The fan connection member includes a fan base and a fan seat pivoted on the fan base. The orthogonal projection of the fan connection member has a first overlap area on the motherboard mounting area at a working state of the fan connection member. The orthogonal projection of the fan connection member has a second overlap area on the motherboard mounting area at a maintenance state of the fan connecting member. The first overlap area is larger than the second overlap area.

Abstract: A thin film transistor (TFT) array substrate and a display panel are provided. The TFT array substrate includes multiple pixels arranged in an array. Each pixel includes first through third sub-pixels sequentially arranged along a first direction. The first through third sub-pixels are connected to a same scan line. The TFT array substrate further includes first through third data lines sequentially arranged along the first direction. The first through third data lines respectively are for driving the first through third sub-pixels. The first sub-pixel includes first and second areas, the second sub-pixel includes third and fourth areas, and the third sub-pixel includes fifth and sixth areas, arranged along a second direction. A voltage difference between a sub-pixel electrode in the sixth area and a common electrode is different from a voltage difference between a sub-pixel electrode in the fifth area and the common electrode.

Abstract: A thin film transistor (TFT) array substrate and a display panel are provided. The TFT array substrate includes multiple pixels arranged in an array. Each pixel includes first through third sub-pixels sequentially arranged along a first direction. The first through third sub-pixels are connected to a same scan line. The TFT array substrate further includes first through third data lines sequentially arranged along the first direction. The first through third data lines respectively are for driving the first through third sub-pixels. The first sub-pixel includes first and second areas, the second sub-pixel includes third and fourth areas, and the third sub-pixel includes fifth and sixth areas, arranged along a second direction. A voltage difference between a sub-pixel electrode in the sixth area and a common electrode is different from a voltage difference between a sub-pixel electrode in the fifth area and the common electrode.