Abstract: A wireless communication device includes a casing having a wireless signal penetrating area, an antenna sending a wireless signal through the wireless signal penetrating area, and an electromagnetic lens assembly including a lens barrel and a lens. The lens barrel has a first end and a second end. The first end is closer to the wireless signal penetrating area than the second end. The lens disposed in the lens barrel has an incident surface and an emission surface on an axis of the lens. The incident surface is a flat surface facing the first end. The emission surface is a convex surface and has a curvature, which is not equal to 0, from a perspective of a first axis perpendicular to the axis of the lens, and has a curvature of 0 from a perspective of a second axis perpendicular to the axis of the lens and the first axis.

Abstract: A wireless communication device includes a casing having a wireless signal penetrating area, an antenna sending a wireless signal through the wireless signal penetrating area, and an electromagnetic lens assembly including a lens barrel and a lens. The lens barrel has a first end and a second end. The first end is closer to the wireless signal penetrating area than the second end. The lens disposed in the lens barrel has an incident surface and an emission surface on an axis of the lens. The incident surface is a flat surface facing the first end. The emission surface is a convex surface and has a curvature, which is not equal to 0, from a perspective of a first axis perpendicular to the axis of the lens, and has a curvature of 0 from a perspective of a second axis perpendicular to the axis of the lens and the first axis.

Abstract: A multi-chips Stacked package structure, wherein a plurality of chips are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each chip on the substrate can all be exposed; a plurality of metal wires are provided for electrically connecting the plurality of metal pads on the plurality of chips with the plurality metallic ends on the substrate in one wire bonding process; then an encapsulate is provided for covering the plurality of stacked chips, a plurality of metal wires and the plurality of metallic ends on the substrate.

Abstract: A thin IC package to enhance heat dissipation from the back surface of a chip, comprises a substrate, the chip, and an encapsulant where the substrate has an upper surface, a lower surface, and an opening to accommodate the chip. The chip is disposed in the opening of the substrate where the chip has an active surface, a back surface, and a plurality of bonding pads disposed on the active surface to electrically connect to the substrate. At least a slot is formed on the back surface of the chip. Preferably, a plurality of the slots on the back surface of the chip form a plurality of integral thermal fins therefrom. The encapsulant are formed on the upper surface of the substrate and in the opening to embed the chip with the back surface and the slots being exposed from the encapsulant to enhance the heat dissipation from the back surface of the chip and to enhance chip strength.

Abstract: A glide head with mounted PZT sensor is used to obtain a glide avalanche curve. The glide head is subsequently gradually decreased until the signal is extremely high. First, at least one resonance frequency of the glide head is determined. The frequency component of the PZT glide signal to each specific irregular peak is analyzed by using the speed of the glide head divided by the bump spacing, multiplied by a factor, m, where m is an integer number. The next step of the present invention is to determine a glide avalanche break point of the recording medium. Then, the glide avalanche point is determined in the region which is between the irregular peaks and the extremely high signal.

Abstract: A wet etching method for making calibration bump disks for use in providing quality control of production run magnetic hard disks is disclosed. It includes the steps of: (a) coating a layer of bump material on a substrate; (b) coating a photoresist layer on the layer of bump material; (c) exposing the photoresist layer to a light source under a photomask; (d) developing the photoresist layer using a developer solution to form an undeveloped photoresist layer; (e) etching the substrate containing the layer of bump material and the undeveloped photoresist layer to remove portions of the layer of bump material not covered by the undeveloped photoresist layer; and (f) stripping the undeveloped photoresist layer to leave at least a bump on the substrate which was originally covered by the undeveloped photoresist layer. The wet etching method eliminates many of the problems observed from the conventional metal mask method, including the elimination of the convex-shaped bump surface.