Abstract: A force sensing method, applied to a force sensing system comprising a plurality of force sensors and a touch sensing surface, comprising: (a) determining a first location of a first object on the touch sensing surface; (b) defining a first force sensing region according to the first location; and (c) computing a first system sensing force which the first object causes to the touch sensing surface according to the first location, and according to at least one sensor sensing force of a first part of the force sensors corresponding to the first force sensing region. The present invention also discloses a force sensing system which uses the above-mentioned force sensing method, and an efficient force sensor calibration method. Noises can be reduced and power consumption can be decreased, since only sensor sensing forces of force sensors near the object are used for computing the system sensing force.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A keyboard and a key structure capable of displaying instant image thereof are provided. The key structure includes a display unit, a circuit membrane, an elastic member, a key seat, a first supporting frame, a second supporting frame, and a translucent keycap. The first supporting frame has two first arms and two axle portions. The ends of the first arms are slidably disposed on an accommodation portion of the key seat. The second supporting frame has two second arms and two linking holes. The ends of the second arms are pivotally connected to the accommodation portion. The linking hole is elongated-shaped. When the translucent keycap is not pressed, the axle portion abuts against one hole-end of the linking hole. When the translucent keycap is pressed, the axle portion abuts against another one hole-end of the linking hole.

Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.

Abstract: The present disclosure relates to a novel class of anti-CD20 monoclonal antibodies comprising a homogeneous population of anti-CD20 IgG molecules having the same N-glycan on each of Fc. The antibodies of the invention can be produced from anti-CD20 monoclonal antibodies by Fc glycoengineering. Importantly, the antibodies of the invention have improved therapeutic values with increased ADCC activity and increased Fc receptor binding affinity compared to the corresponding monoclonal antibodies that have not been glycoengineered.

Abstract: A power distribution component includes a wavelength converter, a connecting portion, a first power distribution portion and a second power distribution portion. The wavelength converter has an input end and a connection end. The connecting portion includes a first connecting end and a second connecting end, and the first connecting end is connected to the connection end. The first power distribution portion includes a first output port and a first end, and the first end is connected to the second connecting end. The second power distribution portion includes a second output port and a second end, and the second end is connected to the second connecting end. The first power distribution portion and the second power distribution portion are symmetrically disposed on opposite sides of the connecting portion by regarding the connecting portion as a mirror axis. Additionally, a wireless transceiver including a power distribution component is also provided.

Abstract: An antenna module includes a first board, a connecting board, a second board, an antenna radiator, and a circuit reference ground. The first board at least includes a first end. The connecting board has a first and a second connection end. The second board includes a second end and a bottom end. The second board and the connecting board are made of different materials. The antenna radiator extends along the extending direction of the connecting board and the second board, and defines a first and a second radiation end. The circuit reference ground extends along the extending direction of the first board, the connecting board, and the second board, and defines a first reference end formed on the first board and a second reference formed on the second board. The circuit reference ground and the antenna radiator are spaced apart and form an interval.

Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. In response to determining at least a portion of a first memory block passed a program verify operation associated with a last programming level of the set of programming levels, the control logic executes a first program sub-operation to terminate the programming operation with respect to a first subset of one or more memory planes of the set of memory planes that passed the program verify operation associated with the last programming level and identify a second subset of one or more memory planes that failed the program verify operation associated with the last programming level. The control logic executes a second program sub-operation to apply a trim set to the second subset of one or more memory planes that failed the program verify operation of the last programming level.

Abstract: A memory device comprising a memory array and control logic operatively coupled with the memory array. The control logic is to: detect a program operation directed at a selected wordline of multiple wordlines of the memory array; determine, during an initial phase of the program operation, whether a program voltage being applied to the selected wordline satisfies a threshold program voltage; add, in response to the program voltage not satisfying the threshold program voltage, a base offset voltage to an initial pass voltage to generate a higher pass voltage, the initial pass voltage being a percentage of an initial program voltage; and cause the higher pass voltage to be applied to a remainder of the multiple wordlines other than the selected wordline.

Abstract: A force sensing method, applied to a force sensing system comprising a plurality of force sensors and a touch sensing surface, comprising: (a) determining a first location of a first object on the touch sensing surface; (b) defining a first force sensing region according to the first location; and (c) computing a first system sensing force which the first object causes to the touch sensing surface according to the first location, and according to at least one sensor sensing force of a first part of the force sensors corresponding to the first force sensing region. The present invention also discloses a force sensing system which uses the above-mentioned force sensing method, and an efficient force sensor calibration method. Noises can be reduced and power consumption can be decreased, since only sensor sensing forces of force sensors near the object are used for computing the system sensing force.

Abstract: Control logic in a memory device initiates a first loop of a program operation, the first loop comprising (a) a program phase where a plurality of memory cells associated with a selected wordline in a block of the memory array are programmed to respective ones of a plurality of programming levels and (b) a corresponding program verify phase. The control logic further identifies memory cells of the plurality of memory cells associated with a first sub-set of the plurality of programming levels to be verified during the program verify phase, the first sub-set comprising two or more dynamically selected programming levels comprising at least a lowest programming level and a second lowest programing level of the respective ones of the plurality of programming levels.

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: An electronic device with a function of detecting a touch state, comprising: at least one first electrode, configured to generate a first capacitance reflecting a distance between the first electrode and an object; at least one second electrode, configured to generate a second capacitance reflecting a distance between the second electrode and the object, and wherein a first distance between the first electrode and the object is smaller than a second distance between the second electrode and the object when the electronic is in a wearing state; a capacitance calculating circuit, configured to calculate the first capacitance and the second capacitance; and a processing circuit, configured to determine if the electronic device is in the wearing state based on a capacitance difference between the first capacitance and the second capacitance. Via such structure, the touch state of the electronic device can be precisely acquired.

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: An electronic device with a function of detecting a touch state, comprising: at least one first electrode, configured to generate a first capacitance reflecting a distance between the first electrode and an object; at least one second electrode, configured to generate a second capacitance reflecting a distance between the second electrode and the object, and wherein a first distance between the first electrode and the object is smaller than a second distance between the second electrode and the object when the electronic is in a wearing state; a capacitance calculating circuit, configured to calculate the first capacitance and the second capacitance; and a processing circuit, configured to determine if the electronic device is in the wearing state based on a capacitance difference between the first capacitance and the second capacitance. Via such structure, the touch state of the electronic device can be precisely acquired.