Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A metallic ferroelectric metal (MFM) field effect transistor (FET) is disclosed. The metallic ferroelectric metal (MFM) field effect transistor (FET) includes an MFM, a first FET and a second FET. The MFM has a first electrode. The first FET is electrically connected to the first electrode, and has a first gate electrode, wherein the first gate electrode has a first area. The second FET is electrically connected to the first electrode, and has a second gate electrode, wherein the second gate electrode has a second area, and the first area and the second area have a ratio therebetween ranging from 1:50 to 1:2.

Abstract: A key generation technology of the present disclosure does not additionally set a combinational logic circuit on an original path of a scanning flip-flop, but utilizes a plurality of existing combinational logic circuits in a circuit system to generate multiple values of a key. Correspondingly, a key generation unit used in the key generation technology has two data flip-flops. One of the data flip-flops is used as a data flip-flop in one of a plurality of scanning flip-flops. The other data flip-flop is to obtain a node data signal of a node in the corresponding combinational logic circuit as one of the values of the key.

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: A cascade extension device and a cascade system having the cascade extension device are provided. The cascade extension device includes a control module, a buffer module, a storage module, and a selecting output module. The cascade system includes a processor and a plurality of extension devices. The processor may simultaneously control the plurality of extension devices through judging the data packet received as a write command, a read command, or a bypass command by a plurality of extension devices.

Abstract: A neuron circuit and an artificial neural network chip are provided. The neuron circuit includes a memristor and an integrator. The memristor generates a pulse train having an oscillation frequency when an applied voltage exceeds a predetermined threshold. The integrator is connected in parallel to the memristor for receiving and accumulating input pulses transmitted by a previous layer network at different times, and driving the memristor to transmit the pulse train to a next layer network when a voltage of the accumulated input pulses exceeds the predetermined threshold.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A cascade extension device and a cascade system having the cascade extension device are provided. The cascade extension device includes a control module, a buffer module, a storage module, and a selecting output module. The cascade system includes a processor and a plurality of extension devices. The processor may simultaneously control the plurality of extension devices through judging the data packet received as a write command, a read command, or a bypass command by a plurality of extension devices.

Abstract: A neuron circuit and an artificial neural network chip are provided. The neuron circuit includes a memristor and an integrator. The memristor generates a pulse train having an oscillation frequency when an applied voltage exceeds a predetermined threshold. The integrator is connected in parallel to the memristor for receiving and accumulating input pulses transmitted by a previous layer network at different times, and driving the memristor to transmit the pulse train to a next layer network when a voltage of the accumulated input pulses exceeds the predetermined threshold.

Abstract: An integrated circuit (IC) is provided. The IC includes a specific pin, a pull-down circuit and a voltage detector coupled to the specific pin, and a controller. The pull-down circuit includes a pull-down resistor corresponding to a driving voltage level, and is configured to selectively couple the pull-down resistor to the specific pin according to a control signal. The voltage detector is configured to detect the specific pin to obtain a detected voltage value. The controller is configured to determine whether the detected voltage value is the same as the driving voltage level, so as to provide the control signal. When the detected voltage value is greater or less than the driving voltage level, the controller is configured to provide the control signal to the pull-down circuit, so that the pull-down resistor is electrically separated from the specific pin.

Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: An integrated circuit (IC) is provided. The IC includes a specific pin, a pull-down circuit and a voltage detector coupled to the specific pin, and a controller. The pull-down circuit includes a pull-down resistor corresponding to a driving voltage level, and is configured to selectively couple the pull-down resistor to the specific pin according to a control signal. The voltage detector is configured to detect the specific pin to obtain a detected voltage value. The controller is configured to determine whether the detected voltage value is the same as the driving voltage level, so as to provide the control signal. When the detected voltage value is greater or less than the driving voltage level, the controller is configured to provide the control signal to the pull-down circuit, so that the pull-down resistor is electrically separated from the specific pin.