Patents by Inventor MING-JHE LEE

MING-JHE LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure and manufacturing method thereof
    Patent number: 9786619
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: October 10, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chau Chen, Shih-Pei Chou, Ming-Jhe Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai, Yeur-Luen Tu
  • SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170194273
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
    Type: Application
    Filed: May 17, 2016
    Publication date: July 6, 2017
    Inventors: SHENG-CHAU CHEN, SHIH-PEI CHOU, MING-JHE LEE, KUO-MING WU, CHENG-HSIEN CHOU, CHENG-YUAN TSAI, YEUR-LUEN TU