Patents by Inventor Ming -Ji Lii

Ming -Ji Lii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240047397
    Abstract: A semiconductor device includes a substrate, one or more wiring layers disposed over the substrate, a passivation layer disposed over the one or more wiring layers, a first conductive layer disposed over the passivation layer, a second conductive layer disposed over the first conductive layer, an isolation structure formed in the first and second conductive layers to isolate a part of the first and second conductive layers, and a first metal pad disposed over the isolation structure and the part of the first and second conductive layers. In one or more of the foregoing or following embodiments, the semiconductor device further includes a second metal pad disposed over the second conductive layer and electrically isolated from the first metal pad.
    Type: Application
    Filed: March 20, 2023
    Publication date: February 8, 2024
    Inventors: Bo-Yu CHIU, Pei-Wei LEE, Fu Wei LIU, Yun-Chung WU, Hao Chun YANG, Chin-Yu KU, Ming-Da CHENG, Ming-Ji LII
  • Publication number: 20240034619
    Abstract: A method includes forming an interconnect structure over a semiconductor substrate. The interconnect structure includes a plurality of dielectric layers, and the interconnect structure and the semiconductor substrate are in a wafer. A plurality of metal pads are formed over the interconnect structure. A plurality of through-holes are formed to penetrate through the wafer. The plurality of through-holes include top portions penetrating through the interconnect structure, and middle portions underlying and joining to the top portions. The middle portions are wider than respective ones of the top portions. A metal layer is formed to electrically connect to the plurality of metal pads. The metal layer extends into the top portions of the plurality of through-holes.
    Type: Application
    Filed: January 9, 2023
    Publication date: February 1, 2024
    Inventors: Pei-Wei Lee, Fu Wei Liu, Szu-Hsien Lee, Yun-Chung Wu, Chin-Yu Ku, Ming-Da Cheng, Ming -Ji Lii