Patents by Inventor Ming Jong

Ming Jong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11223166
    Abstract: An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: January 11, 2022
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Publication number: 20200287331
    Abstract: An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
    Type: Application
    Filed: April 20, 2020
    Publication date: September 10, 2020
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Patent number: 10770839
    Abstract: A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: September 8, 2020
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Publication number: 20200067236
    Abstract: A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 27, 2020
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Patent number: 6884119
    Abstract: A connector has a plastic housing (10) with a plurality of cavities or holes (13) for accepting “chips” (3), i.e., electrical elements such as transient suppression diodes, capacitors, metal oxide varisters, spark gap devices, and so on, connected between the a contact (20) and ground for RFI or EMI suppression or the like. The contacts have shoulders with chip-contacting areas (23), preferably one surface of an annular flange (21). This allows numerous cavities to be arrayed around the axis of the contact (which can be radially symmetrical) so that numerous chips can be put in parallel between the contact and ground. In the case of capacitor chips, for example, this allows increasing the capacitance or varying the capacitance from one contact to the next.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: April 26, 2005
    Assignee: Amphenol Corporation
    Inventors: John Leslie Brooks, John Peter van den Enden, Valeria Caraiani, Barbara Heather Marten, Peter Ervin Jay, Ming Jong, Karen Anne Gibson
  • Publication number: 20020042231
    Abstract: A connector has a plastic housing (10) with a plurality of cavities or holes (13) for accepting “chips” (3), i.e., electrical elements such as transient suppression diodes, capacitors, metal oxide varisters, spark gap devices, and so on, connected between the a contact (20) and ground for RFI or EMI suppression or the like. The contacts have shoulders with chip-contacting areas (23), preferably one surface of an annular flange (21). This allows numerous cavities to be arrayed around the axis of the contact (which can be radially symmetrical) so that numerous chips can be put in parallel between the contact and ground. In the case of capacitor chips, for example, this allows increasing the capacitance or varying the capacitance from one contact to the next.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 11, 2002
    Inventors: John Leslie Brooks, John Peter Van den Enden, Valeria Caraiani, Barbara Heather Marten, Peter Ervin Jay, Ming Jong, Karen Anne Gibson