Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: Provided is a multi-axis force sensing device, including a central portion, an outer ring portion, multiple measurement shafts, and multiple sensing groups. The outer ring portion surrounds the central portion. The measurement shafts are respectively connected between the central portion and the outer ring portion. The measurement shafts are equally disposed on an outer side of the central portion. A first surface and a second surface of each measurement shaft are respectively disposed with one of the sensing groups. Each sensing group includes a first strain sensing element and a second strain sensing element. The first strain sensing element is disposed on a first central line of symmetry on the first surface or on a second central line of symmetry on the second surface. The second strain sensing element is disposed on the first surface or the second surface.

Abstract: A joint actuator of a robot includes a casing, a driving device, a driving shaft, a reducer, and a sensor. The driving device is disposed in the casing. The driving shaft is disposed in the casing and connected to the driving device, and the driving device is adapted to drive the driving shaft to rotate. The reducer is disposed in the casing and includes a power input component and a power output component. The power input component and the power output component are sleeved around the driving shaft, and the power input component is connected between the driving shaft and the power output component. The sensor is disposed on the power input component or the casing.

Abstract: A torsion sensor, configured to sense torque generated or received by a joint actuator, is provided. The torsion sensor includes an inner ring, an outer ring, multiple radial bridging portions, multiple overload structures, and multiple strain sensing units. The inner ring and the outer ring are disposed on the same axis and are separated from each other. The torque enables the inner ring and the outer ring to relatively rotate with reference to the axis. The radial bridging portions are disposed at intervals and each radial bridging portion is connected between the inner ring and the outer ring along a radial direction, and each radial bridging portion has at least one depression. Each overload structure extends from the inner ring toward the outer ring along the radial direction and has at least one gap with the outer ring. The strain sensing units are respectively disposed on the radial bridging portions.

Abstract: A joint actuator of a robot including a driving device, a driving shaft, a reducer, a torsion sensor, and a dual encoder is provided. The driving shaft is connected to the driving device. The driving device is configured to drive the driving shaft to rotate. The reducer includes a motive power input component and a motive power output component. The motive power input component and the motive power output component are sleeved on the driving shaft. The motive power input component is disposed between the driving shaft and the motive power output component. The torsion sensor is connected to the motive power output component of the reducer. The dual encoder is connected to the driving device and the driving shaft. The driving device is located between the dual encoder and the reducer.

Abstract: 5-methoxy-7-hydroxyflavan compound (I) was isolated and purified from Dragon's Blood resin. The purification process involves 50% ethanol soxhletion overnight and then fraction through silica column with a series of solvent elution. The purified compound (I) was crystallized in benzene: hexane (1:1). The pure compound was identified by instruments including IR, NMR, FAB-MS, and GC-MS and acetylation reaction to confirm the structure. This compound was found to be a strong antifungal chemical with broad spectra against Fusarium oxysporium fsp. niveum, Phytophora capsici, Phoma asparagi, Pythium spinosum, Pythium aphanidermatum, Phthium sylvaticum, Sclerotium rolfsii, and Sclerotinia sclerotiorum . For whole plant in vivo testes, it was found that compound (I) significantly protected mung bean and cabbage from being infested and damaged by Sclerotium rolfsii and Pythium aphanidermatum respectively.