Abstract: Apparatus and methods for multi-cathode barrier seed deposition for high aspect ratio features in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber. The pedestal rotates with a workpiece on it. The PVD chamber includes a lid assembly includes a first target and a second target of a same target material, where a first surface of the first target defines a first zone of the processing region a first distance from the upper surface of the pedestal, and a second surface of the second target defines a second zone of the processing region a second distance from the plane of the upper surface of the pedestal. A system controller is configured to simultaneously control a first voltage bias for the first target and a second voltage bias for the second target.

Abstract: A method for preparing a surface for bonding leverages multiple treatment processes to increase bonding strength. The method may include performing a first treatment process on a surface of a material using a first plasma process to promote diffusion into the first surface of a diffusion layer deposited after the first treatment process where the first treatment process uses capacitively coupled plasma (CCP) or a combination including both CCP and inductively coupled plasma (ICP) simultaneously, forming the diffusion layer on the surface of the material, performing a second treatment process using a second plasma process to increase diffusion of the diffusion layer into the surface of the material where the second treatment process uses CCP, and performing a third treatment process using a third plasma process to form dangling bonds on the diffusion layer where the third treatment process uses ICP or a combination including both CCP and ICP simultaneously.

Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a process kit for a substrate support includes: a dielectric plate having a lower surface configured to cover a support surface of the substrate support and an upper surface configured to support a substrate; and a dielectric deposition ring surrounding the dielectric plate and configured to cover a portion of the substrate support disposed radially outward of the support surface.

Abstract: A method for preparing a surface for bonding leverages multiple treatment processes to increase bonding strength. The method may include performing a first treatment process on a surface of a material using a first plasma process to promote diffusion into the first surface of a diffusion layer deposited after the first treatment process where the first treatment process uses capacitively coupled plasma (CCP) or a combination including both CCP and inductively coupled plasma (ICP) simultaneously, forming the diffusion layer on the surface of the material, performing a second treatment process using a second plasma process to increase diffusion of the diffusion layer into the surface of the material where the second treatment process uses CCP, and performing a third treatment process using a third plasma process to form dangling bonds on the diffusion layer where the third treatment process uses ICP or a combination including both CCP and ICP simultaneously.

Abstract: Apparatus and methods for multi-cathode barrier seed deposition for high aspect ratio features in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber. The pedestal rotates with a workpiece on it. The PVD chamber includes a lid assembly includes a first target and a second target of a same target material, where a first surface of the first target defines a first zone of the processing region a first distance from the upper surface of the pedestal, and a second surface of the second target defines a second zone of the processing region a second distance from the plane of the upper surface of the pedestal. A system controller is configured to simultaneously control a first voltage bias for the first target and a second voltage bias for the second target.

Abstract: Apparatus and methods for multi-cathode barrier seed deposition for high aspect ratio features in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber. The pedestal rotates with a workpiece on it. The PVD chamber includes a lid assembly includes a first target and a second target of a same target material, where a first surface of the first target defines a first zone of the processing region a first distance from the upper surface of the pedestal, and a second surface of the second target defines a second zone of the processing region a second distance from the plane of the upper surface of the pedestal. A system controller is configured to simultaneously control a first voltage bias for the first target and a second voltage bias for the second target.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: Apparatus and methods for multi-cathode barrier seed deposition for high aspect ratio features in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber. The pedestal rotates with a workpiece on it. The PVD chamber includes a lid assembly includes a first target and a second target of a same target material, where a first surface of the first target defines a first zone of the processing region a first distance from the upper surface of the pedestal, and a second surface of the second target defines a second zone of the processing region a second distance from the plane of the upper surface of the pedestal. A system controller is configured to simultaneously control a first voltage bias for the first target and a second voltage bias for the second target.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.

Abstract: A disposable lens applied to electronic operation device for recognition includes a substrate, a lens and a fix adhesive. It is only necessary for the user to fix the disposable lens to the electronic operation device provided with an image-capturing unit and enable the image-capturing unit to align with a recognized unit to be recognized through the lens, such that the image of the recognized unit is expanded through the lens through optical properties. Thus, the image signal captured by the image-capturing unit is clearer, and then processed by the electronic operation device. Not only compactness with portability enabling the user to recognize the recognized unit immediately, but also the effect of low-priced material are provided due to simple structure of the disposable lens of the present invention. Thereby, relative advantages in volume, convenience and cost are all obtained.

Abstract: A disposable lens applied to electronic operation device for recognition includes a substrate, a lens and a fix adhesive. It is only necessary for the user to fix the disposable lens to the electronic operation device provided with an image-capturing unit and enable the image-capturing unit to align with a recognized unit to be recognized through the lens, such that the image of the recognized unit is expanded through the lens through optical properties. Thus, the image signal captured by the image-capturing unit is clearer, and then processed by the electronic operation device. Not only compactness with portability enabling the user to recognize the recognized unit immediately, but also the effect of low-priced material are provided due to simple structure of the disposable lens of the present invention. Thereby, relative advantages in volume, convenience and cost are all obtained.

Abstract: A biochemical detection apparatus includes an electronic computing device and an optical device. The optical device includes a main body. The main body includes an accommodating space provided in the main body, and an insertion slot, an optical lens and an opening that are in communication with the accommodating space. The optical lens and the opening are disposed on a same plane of the main body, and the optical lens is located above an image capturing unit of the electronic computing device. The optical device may be installed at a handheld electronic computing device commonly carried by an individual, and is capable of immediately performing detection for an environmental parameter or a biological parameter by a biochemical sheet. The optical device having a simple structure is small in volume, convenient and low in cost, and may replace expensive precision detection apparatuses.