Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: The speed of the network address translation translated with software is generally slower than the speed of transmitting packet in the network, so that the data stored in memory is affected. In this invention, the network address translation is translated by hardware, and a plurality of comparing engines is employed to accelerate the translating speed. Therefore, even in the worst case scenario, the time needed for translating the network address is shorter than the time needed for storing the packet into memory, so that the operation of the network address translation is assured not to affect the data transmission in the network.

Abstract: The speed of the network address translation translated with software is generally slower than the speed of transmitting packet in the network, so that the data stored in memory is affected. In this invention, the network address translation is translated by hardware, and a plurality of comparing engines is employed to accelerate the translating speed. Therefore, even in the worst case scenario, the time needed for translating the network address is shorter than the time needed for storing the packet into memory, so that the operation of the network address translation is assured not to affect the data transmission in the network.