Abstract: Embodiments of the invention are directed to data replication in an active-active databases having a source site and a target site. Aspects include creating a subscription activation message in a capture address space, the subscription activation message having a timestamp after a latest committed timestamp of the active-active databases and transmitting the subscription activation message to a subscription activation module of the target site of the active-active databases. Based on a determination that one or more tables associated with the subscription activation message are inactive, aspects also include repairing the one or more tables. Based on a determination that all tables associated with the subscription activation message are active, aspects include initiate replication of the capture address space from the source site to the target site with a timestamp of the latest committed timestamp.

Abstract: An electronic device includes two speakers, a single functional chip, a parameter extraction circuit, an audio processing module, a gain adjusting circuit and a current detecting unit. The current detecting unit is disposed in the functional chip for detecting the driving current of the two speakers. The functional chip provides the driving voltage of the two speakers based on an output signal and converts the analogue current/voltages of the two speakers into digital current/voltages. The parameter extraction circuit acquires the parameter of each speaker based on the digital current/voltages. The audio processing module acquires the gains of various physical quantities based on the parameter of each speaker and determines the final gain of each physical quantity. The gain adjusting circuit provides the output signal by adjusting the gain of an input signal based on the final gain of each physical quantity.

Abstract: A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; forming a hard mask layer over the substrate; forming protected portions and unprotected portions of the hard mask layer; performing a first etching process, a second etching process, and a third etching process on the unprotected portions of the hard mask layer, wherein the first etching process partially removes the unprotected portions of the hard mask layer, the second etching process treats the unprotected portions of the hard mask layer, and the third etching process removes the remaining unprotected portions of the hard mask layer; and performing a fourth etching process to remove the protected portions of the hard mask layer.