Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: An electronic apparatus shell cover includes a body, a dust blocking screen, and a plurality of structural ribs. The body includes an opening and a plurality of assembling grooves. The opening penetrates through the body. The assembling grooves are on a second surface of the body and adjacent to the opening. The dust blocking screen includes a screen surface and a plurality of assembling parts. The screen surface is mounted in the opening and coplanar with a first surface of the body. The assembling parts are disposed in the assembling grooves. The structural ribs are connected to the first surface of the body and on the dust blocking screen. The dust blocking screen is coplanar with the first surface, and the internal accommodating space of the electronic apparatus shell cover is increased. Furthermore, the structural ribs can increase mechanical strength of the shell cover, can enhance heat exchange efficiency.

Abstract: An electronic apparatus shell cover includes a body, a dust blocking screen, and a plurality of structural ribs. The body includes an opening and a plurality of assembling grooves. The opening penetrates through the body. The assembling grooves are on a second surface of the body and adjacent to the opening. The dust blocking screen includes a screen surface and a plurality of assembling parts. The screen surface is mounted in the opening and coplanar with a first surface of the body. The assembling parts are disposed in the assembling grooves. The structural ribs are connected to the first surface of the body and on the dust blocking screen. The dust blocking screen is coplanar with the first surface, and the internal accommodating space of the electronic apparatus shell cover is increased. Furthermore, the structural ribs can increase mechanical strength of the shell cover, can enhance heat exchange efficiency.

Abstract: A laptop keyboard structure includes a keycap assembly and a key shaft assembly. The keycap assembly includes a keycap positioning plate, a plurality of stroke limiting structures and a plurality of keycaps. The stroke limiting structures are respectively disposed on the keycap positioning plate. The keycaps are respectively connected to the stroke limiting structure. The key shaft assembly, detachably assembled to one side of the keycap assembly, includes a circuit substrate and a plurality of key switches. The key switches are disposed on the circuit substrate and used to abut the keycap. A manufacturing method of the laptop keyboard structure is mainly to prepare the keycap assembly first, then to prepare the key shaft assembly, and finally to mount detachably the key shaft assembly to the keycap assembly by having the key switches respectively to penetrate the switch and further abut the keycap.