Patents by Inventor Ming KE
Ming KE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12250455Abstract: A dual purpose camera is provided. The dual purpose camera has a doccam mode and a webcam mode. The dual purpose camera includes a base, a supporting member, and a camera. The supporting member is detachably or rotatably coupled to the base. The camera is rotatably or detachably coupled to the supporting member. The camera rotates with respect to a reference plane of the dual purpose camera between a first position and a second position. When it is detected that the camera is attached to the base and the camera rotates from the first position to the second position, the camera automatically outputs a 180 degree rotated image.Type: GrantFiled: January 12, 2023Date of Patent: March 11, 2025Assignee: Qisda CorporationInventors: Chia-Hsin Ou, Wen-Ming Wu, Yu-Shuo Fan, Shu-Fen Ke, Yu-Chia Chen
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Patent number: 12238864Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.Type: GrantFiled: March 24, 2022Date of Patent: February 25, 2025Assignee: Industrial Technology Research InstituteInventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
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Publication number: 20250034526Abstract: A method for preparing an engineered microvessel is provided. The method includes: obtaining a first dispersion by mixing a thrombin solution, a vascular endothelial cell suspension, a cardiomyocyte suspension, and a portion of a mixed culture medium, and obtaining a second dispersion by mixing a fibrinogen solution, a collagen solution, and another portion of the mixed culture medium, wherein the mixed culture medium includes a vascular endothelial cell culture medium and a cardiomyocyte culture medium; obtaining a gel pre-polymerisation solution by mixing the first dispersion and the second dispersion, and obtaining a cellular entity by curing the gel pre-polymerisation solution; and obtaining an engineered microvascular entity by placing the cellular entity in the mixed culture medium at a static status for static culture, and then placing the cellular entity in the mixed culture medium at a flowing status for dynamic culture.Type: ApplicationFiled: October 14, 2024Publication date: January 30, 2025Applicant: ARMY MEDICAL UNIVERSITYInventors: Chuhong ZHU, Ming KE
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Publication number: 20240404962Abstract: A package structure is provided, and includes a first bonding film formed on a first substrate, and a first alignment mark formed in the first bonding film. The first alignment mark includes a plurality of first patterns spaced apart from each other. The package structure includes a second bonding film formed on a second substrate and bonded to the first bonding film, and a second alignment mark formed in the second bonding film. The second alignment mark includes a plurality of second patterns spaced apart from each other. In a top view, the first alignment mark is spaced apart from the second alignment mark, and the distance between adjacent first patterns is less than the distance between the first alignment mark and the second alignment mark.Type: ApplicationFiled: June 5, 2023Publication date: December 5, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pei-Hsuan LO, Chih-Ming KE, Jeng-Nan HUNG, Chung-Jung WU, Yu-Yi HUANG
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Publication number: 20240329336Abstract: In some embodiments, a photonic device includes a photonic interconnect structure that includes a first cladding layer; a waveguide over the first cladding layer; a second cladding layer disposed over the waveguide; a transparent material in the first cladding layer and the second cladding layer, the transparent material includes a first sidewall adjacent to the waveguide and a second sidewall tilted with respect to the first sidewall of the transparent material; and a first reflective film over the second sidewall of the transparent material. In some embodiments, the photonic device also includes a light-receiving structure that includes a transparent protrusion above the transparent material, the transparent protrusion including a first sidewall and a second sidewall opposite to the second sidewall of the transparent protrusion; and a second reflective film over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.Type: ApplicationFiled: March 27, 2023Publication date: October 3, 2024Inventors: Tung-Liang Shao, Hsing-Kuo Hsia, Chen-Hua Yu, Chih-Ming Ke, Chih-Wei Tseng, You-Rong Shaw
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Patent number: 12079985Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for computer aided diagnosis of a medical image. One of the methods includes processing the medical image through a machine learning (ML) model to provide a first feature representation of the medical image, wherein the ML model includes an input layer and a pooling layer, wherein the first feature representation is an output from the pooling layer, generating, by the ML model, a sequence of second feature representations of the medical image from the first feature representation of the medical image, wherein each second feature representation in the sequence of the second feature representations having a lower dimension than the first feature representation, and generating, by the ML model, an output as a last second feature representation in the sequence of the second feature representations.Type: GrantFiled: June 22, 2021Date of Patent: September 3, 2024Assignee: Acer Medical Inc.Inventors: Ming-ke Chen, Chin-Han Tsai
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Patent number: 12062582Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.Type: GrantFiled: October 30, 2020Date of Patent: August 13, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Li-Chao Yin, Hung-Bin Lin, Hsin-Hsien Wu, Chih-Ming Ke, Chyi Shyuan Chern, Ming-Hua Lo
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Publication number: 20240162109Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.Type: ApplicationFiled: January 10, 2023Publication date: May 16, 2024Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
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Patent number: 11954824Abstract: An image pre-processing method and an image processing apparatus for a fundoscopic image are provided. A region of interest (ROI) is obtained from a fundoscopic image to generate a first image. The ROI is focused on an eyeball in the fundoscopic image. A smoothing process is performed on the first image to generate a second image. A value difference between neighboring pixels in the second image is increased to generate a third image.Type: GrantFiled: April 21, 2021Date of Patent: April 9, 2024Assignee: Acer Medical Inc.Inventors: Yi-Jin Huang, Chin-Han Tsai, Ming-Ke Chen
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Publication number: 20230378003Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.Type: ApplicationFiled: August 4, 2023Publication date: November 23, 2023Inventors: Li-Chao YIN, Hung-Bin LIN, Hsin-Hsien WU, Chih-Ming KE, Chyi Shyuan CHERN, Ming-Hua LO
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Patent number: 11662658Abstract: A photo-mask and a semiconductor process are provided. The photo-mask includes a substrate and a non-printable pattern on the substrate. A pattern size of the non-printable pattern is smaller than a critical resolution of a lithography equipment using the photo-mask to perform a lithography process.Type: GrantFiled: December 21, 2020Date of Patent: May 30, 2023Assignee: UNITED MICROELECTRONICS CORP.Inventor: You-Ming Ke
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Patent number: 11656391Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.Type: GrantFiled: May 22, 2020Date of Patent: May 23, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Chih Hsieh, Kai Wu, Yen-Liang Chen, Kai-Hsiung Chen, Po-Chung Cheng, Chih-Ming Ke
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Patent number: 11513444Abstract: The present disclosure provides a system. The system includes a metrology tool configured to collect overlay errors from a patterned substrate; and a controller module coupled to the metrology tool and configured to generate an overlay compensation from the collected overlay errors, wherein the generating of the overlay compensation includes identifying a portion of the overlay errors as a set of outliers, identifying inside the set of outliers overlay errors not due to reticle effects, thereby creating a set of noise, excluding the set of noise from overlay errors, thereby creating a set of filtered overlay errors, and calculating the overlay compensation based on the set of filtered overlay errors.Type: GrantFiled: June 15, 2020Date of Patent: November 29, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Weimin Hu, Yang-Hung Chang, Kai-Hsiung Chen, Chun-Ming Hu, Chih-Ming Ke
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Publication number: 20220301111Abstract: An image pre-processing method and an image processing apparatus for a fundoscopic image are provided. A region of interest (ROI) is obtained from a fundoscopic image to generate a first image. The ROI is focused on an eyeball in the fundoscopic image. A smoothing process is performed on the first image to generate a second image. A value difference between neighboring pixels in the second image is increased to generate a third image.Type: ApplicationFiled: April 21, 2021Publication date: September 22, 2022Applicant: Acer Medical Inc.Inventors: Yi-Jin Huang, Chin-Han Tsai, Ming-Ke Chen
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Publication number: 20220301153Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for computer aided diagnosis of a medical image. One of the methods includes processing the medical image through a machine learning (ML) model to provide a first feature representation of the medical image, wherein the ML model includes an input layer and a pooling layer, wherein the first feature representation is an output from the pooling layer, generating, by the ML model, a sequence of second feature representations of the medical image from the first feature representation of the medical image, wherein each second feature representation in the sequence of the second feature representations having a lower dimension than the first feature representation, and generating, by the ML model, an output as a last second feature representation in the sequence of the second feature representations.Type: ApplicationFiled: June 22, 2021Publication date: September 22, 2022Applicant: Acer Medical Inc.Inventors: Ming-ke Chen, Chin-Han Tsai
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Publication number: 20220246509Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.Type: ApplicationFiled: April 25, 2022Publication date: August 4, 2022Inventors: CHIN-HER CHIEN, PO-HSIANG HUANG, CHENG-HUNG YEH, TAI-YU WANG, MING-KE TSAI, YAO-HSIEN TSAI, KAI-YUN LIN, CHIN-YUAN HUANG, KAI-MING LIU, FONG-YUAN CHANG, CHIN-CHOU LIU, YI-KAN CHENG
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Patent number: 11387177Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.Type: GrantFiled: June 17, 2019Date of Patent: July 12, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chin-Her Chien, Po-Hsiang Huang, Cheng-Hung Yeh, Tai-Yu Wang, Ming-Ke Tsai, Yao-Hsien Tsai, Kai-Yun Lin, Chin-Yuan Huang, Kai-Ming Liu, Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng
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Publication number: 20220146926Abstract: A photo-mask and a semiconductor process are provided. The photo-mask includes a substrate and a non-printable pattern on the substrate. A pattern size of the non-printable pattern is smaller than a critical resolution of a lithography equipment using the photo-mask to perform a lithography process.Type: ApplicationFiled: December 21, 2020Publication date: May 12, 2022Inventor: You-Ming KE
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Publication number: 20210217670Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.Type: ApplicationFiled: October 30, 2020Publication date: July 15, 2021Inventors: Li-Chao Yin, Hung-Bin Lin, Hsin-Hsien Wu, Chih-Ming Ke, Chyi Shyuan Chern, Ming-Hua Lo
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Patent number: 11064618Abstract: The application discloses an electronic device including a motherboard and a housing structure. The motherboard has a first surface and a second surface. The housing structure includes a first casing, a first cushion, a second casing, and a second cushion. The first casing has at least one first fixing member. The first cushion covers the first surface, is accommodated in the first casing and has at least one first through hole. The second casing has at least one second fixing member. The second cushion covers the second surface, is accommodated in the second casing and has at least one second through hole. A peripheral edge of the first cushion is attached to a peripheral edge of the second cushion, and the first fixing member may be fixed to the second fixing member through the first through hole and the second through hole.Type: GrantFiled: April 6, 2020Date of Patent: July 13, 2021Assignee: PEGATRON CORPORATIONInventors: Kuan-Ting Lin, Wen-Cheng Tsai, Jr-Hung Huang, Danny Sun, Ho-Ching Huang, Nien-Yu Chang, Ming-Ke Chou