Patents by Inventor Ming-Kuei Yeh

Ming-Kuei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE
    Publication number: 20240096822
    Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chia-Kuei HSU, Ming-Chih YEW, Shu-Shen YEH, Che-Chia YANG, Po-Yao LIN, Shin-Puu JENG
  • Fast RFID tag identifying method
    Patent number: 10055622
    Abstract: A fast RFID tag identifying method includes an encoding step for encoding a pair of bits to be expressed by an RFID tag into a silence code to be used in a transmitting step for the RFID tag. The silence code is arranged such that the superposition of a plurality of silence codes from a plurality of RFID tags is decoded into a set of pairs of bits to be expressed by the RFID tags.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 21, 2018
    Assignee: National Central University
    Inventors: Jehn-Ruey Jiang, Ming-Kuei Yeh