Abstract: A heat dissipation device includes a heat pipe, a base and a heat sink. The heat pipe includes an evaporating section and a condensing section. The evaporating section includes a flat outside surface at one side thereof. The base includes a top surface and an opposite bottom surface. The base defines a groove at the bottom surface thereof. The evaporating section is received in the groove with the flat outside surface spaced a distance from the bottom surface of the base. A solidified soldering layer is formed between the flat outside surface of the evaporating section and the bottom surface of the base. A bottom of the solidified soldering layer is coplanar to the bottom surface of the base. The heat sink is arranged on the top surface of the base with the condensing section of the heat pipe extending therethrough.

Abstract: A heat dissipation apparatus (100) includes a fan bracket (20), a fan (10) and a heat sink (40). The fan bracket includes a housing (22), a support portion (242) extending from the housing, and a plurality of arm portions (244) extending from the housing in a direction opposite to the support portion. Each of the arm portions includes an engaging portion (244a) extending outwardly therefrom, engaging with a fastener (30) to mount the heat dissipation apparatus to a printed circuit board (50). At least two arm portions each include a hook (244c) extending inwardly therefrom. The fan is attached to the support portion of the fan bracket. The heat sink is held between the arm portions of the fan bracket with a bottom surface of the heat sink engaging with the hooks.

Abstract: A heat dissipation apparatus (100) includes a fan bracket (20), a fan (10) and a heat sink (40). The fan bracket includes a housing (22), a support portion (242) extending from the housing, and a plurality of arm portions (244) extending from the housing in a direction opposite to the support portion. Each of the arm portions includes an engaging portion (244a) extending outwardly therefrom, engaging with a fastener (30) to mount the heat dissipation apparatus to a printed circuit board (50). At least two arm portions each include a hook (244c) extending inwardly therefrom. The fan is attached to the support portion of the fan bracket. The heat sink is held between the arm portions of the fan bracket with a bottom surface of the heat sink engaging with the hooks.

Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.

Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.