Abstract: A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.

Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.

Abstract: A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe. The heat-conducting block is closely positioned on the CPU and the heat-conducting piping is disposed in the heat-conducting block for making liquid to flow therethrough. The heat-conducting piping has its inflow port connected with the inflow pipe and its outflow port connected with the outflow pipe, and the inflow port of the heat-conducting piping is positioned lower than the outflow port. The heat-dissipating unit has one end communicating with the outflow pipe and the other end communicating with the inflow pipe for dissipating the heat and lowering the temperature of the liquid, able to incessantly repeat the cycle of heat dissipation and temperature reduction.

Abstract: A cooler includes a heat conducting member and a heat scattering member. The heat conducting portion is closely attached with a heat source. The heat scattering member has plural hollow cones respectively formed of sintered metallic particles with their size enlarged gradually from the bottom to the top. The metallic particles closer to the surface of the heat conducting member are smaller, having a greater contact area to transmit the heat more effectively. And, plus the ventilation of a fan on the heat scattering member, the air in the hole of the hollow cone is expelled out, so the air outside the hollow cone flows into its center through the porosities between the metallic particles, enabling the metallic particles of the hollow cone to increase the contact area with air for a better thermal release.

Abstract: A heat dissipating device includes a heat dissipating block, a liquid contained in the heat dissipating block, a first conduit joined to one end of the heat dissipating block, a second conduit joined to the other end of the heat dissipating block, a guiding tube, heat dissipating fins on the guiding tube, and a fan right above the heat dissipating fins; both the conduits communicate with the inside of the heat dissipating block; the guiding tube is connected to and communicates with the first and the second conduits at two ends so as to slope; the heat dissipating device is secured in position with the heat dissipating block closely touching an upper side of a CPU; therefore, the heat dissipating device will dissipate heat produced by the CPU with the fan producing wind to carry away heat carried to the heat dissipating fins and the liquid repeating a vaporization-condensation cycle.

Abstract: A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe. The heat-conducting block is closely positioned on the CPU and the heat-conducting piping is disposed in the heat-conducting block for making liquid to flow therethrough. The heat-conducting piping has its inflow port connected with the inflow pipe and its outflow port connected with the outflow pipe, and the inflow port of the heat-conducting piping is positioned lower than the outflow port. The heat-dissipating unit has one end communicating with the outflow pipe and the other end communicating with the inflow pipe for dissipating the heat and lowering the temperature of the liquid, able to incessantly repeat the cycle of heat dissipation and temperature reduction.

Abstract: A cooler includes a heat conducting member and a heat scattering member. The heat conducting portion is closely attached with a heat source. The heat scattering member has plural hollow cones respectively formed of sintered metallic particles with their size enlarged gradually from the bottom to the top. The metallic particles closer to the surface of the heat conducting member are smaller, having a greater contact area to transmit the heat more effectively. And, plus the ventilation of a fan on the heat scattering member, the air in the hole of the hollow cone is expelled out, so the air outside the hollow cone flows into its center through the porosities between the metallic particles, enabling the metallic particles of the hollow cone to increase the contact area with air for a better thermal release.

Abstract: A fin unit for a cooler includes a heat-conducting member, a plurality of helical elongate twisted fins and a fan. The heat-conducting member or a heat generator has its surface fixed with the plurality of helical elongated twisted fins. When the fan is started to operate, air convection is produced among the helical elongated members, forming helical whirls to increase contact and collision of the air with the helical elongated twisted fins, enhancing effect of heat dissipation.

Abstract: A heat dissipating device includes a heat dissipating block, a liquid contained in the heat dissipating block, a first conduit joined to one end of the heat dissipating block, a second conduit joined to the other end of the heat dissipating block, a guiding tube, heat dissipating fins on the guiding tube, and a fan right above the heat dissipating fins; both the conduits communicate with the inside of the heat dissipating block; the guiding tube is connected to and communicates with the first and the second conduits at two ends so as to slope; the heat dissipating device is secured in position with the heat dissipating block closely touching an upper side of a CPU; therefore, the heat dissipating device will dissipate heat produced by the CPU with the fan producing wind to carry away heat carried to the heat dissipating fins and the liquid repeating a vaporization-condensation cycle.

Abstract: A cooling tower has cooling tubes fitted to a water tank with upper portions sticking out from a top side of the tank. The upper portions of the cooling tubes have radiating fins. A frame is disposed on the top of the tank with aerosols being fitted to an inner upper side, and with two opposing fans fitted to two lateral sides. Hot water is sent through the tank to contact the lower portions of the cooling tubes such that same is cooled down by cooling spray distributed onto the radiating fins, and cooling air sent into, and out of the frame by the fans.