Abstract: A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.

Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.

Abstract: A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.

Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.

Abstract: A wearable apparatus and a photoplethysmograph (PPG) sensor unit are provided. The wearable apparatus includes a wearable holder and a physiological information measurement module configured to the wearable holder. The physiological information measurement module includes a circuit board, an electrocardiograph (ECG) sensor unit and a PPG sensor unit. The PPG sensor unit is disposed on the circuit board and adapted to be used in conjunction with the ECG sensor unit electrically connected to a first pad and a second pad on the circuit board. The PPG sensor unit includes a grid having a plurality of accommodating spaces, a lighting element arranged in one of the accommodating spaces, and a photo sensor arranged in another accommodating space. The grid includes an inner conductive contact portion exposed from the wearable holder, facing an inner side of the wearable holder and electrically connected to the second pad.

Abstract: A light-emitting display has a circuit board, a spacer, a phosphor film, and a housing. The circuit board is provided with at least one light source. The spacer is disposed on a top surface of the circuit board. The spacer has a through hole which runs through the spacer from top to bottom and corresponds to the at least one light source and the phosphor film respectively. The housing has a reflecting portion and an accommodating space below the reflecting portion. The reflecting portion is located over the phosphor film. The accommodating space accommodates the circuit board, the spacer, and the phosphor film. The present disclosure also provides a method for forming the light-emitting display.

Abstract: The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.

Abstract: A light-emitting display has a circuit board, a spacer, a phosphor film, and a housing. The circuit board is provided with at least one light source. The spacer is disposed on a top surface of the circuit board. The spacer has a through hole which runs through the spacer from top to bottom and corresponds to the at least one light source and the phosphor film respectively. The housing has a reflecting portion and an accommodating space below the reflecting portion. The reflecting portion is located over the phosphor film. The accommodating space accommodates the circuit board, the spacer, and the phosphor film. The present disclosure also provides a method for forming the light-emitting display.

Abstract: A wearable apparatus and a photoplethysmograph (PPG) sensor unit are provided. The wearable apparatus includes a wearable holder and a physiological information measurement module configured to the wearable holder. The physiological information measurement module includes a circuit board, an electrocardiograph (ECG) sensor unit and a PPG sensor unit. The PPG sensor unit is disposed on the circuit board and adapted to be used in conjunction with the ECG sensor unit electrically connected to a first pad and a second pad on the circuit board. The PPG sensor unit includes a grid having a plurality of accommodating spaces, a lighting element arranged in one of the accommodating spaces, and a photo sensor arranged in another accommodating space. The grid includes an inner conductive contact portion exposed from the wearable holder, facing an inner side of the wearable holder and electrically connected to the second pad.

Abstract: The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.

Abstract: The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.

Abstract: An LED device includes a substrate, a number (N) of flip-chip LED die(s), an electrical conductive structure and a lens structure. The substrate has upper and lower surfaces and is formed with multiple through holes. A ratio of LED die(s) surface area to an area of the upper surface of the substrate ranges from 22.7% to 76.2%. The electrical conductive structure includes a number (N) of upper bonding pad assembly (assemblies), a number (N+1) of lower bonding pads and a number (2N) of interconnectors. Each upper bonding pad assembly includes two upper bonding pads electrically connected to the LED die(s). The interconnectors are disposed in the through holes and interconnect the upper and lower bonding pads. The lens structure covers the LED die(s).

Abstract: An LED device includes a substrate, a number (N) of flip-chip LED die(s), an electrical conductive structure and a lens structure. The substrate has upper and lower surfaces and is formed with multiple through holes. A ratio of LED die(s) surface area to an area of the upper surface of the substrate ranges from 22.7% to 76.2%. The electrical conductive structure includes a number (N) of upper bonding pad assembly (assemblies), a number (N+1) of lower bonding pads and a number (2N) of interconnectors. Each upper bonding pad assembly includes two upper bonding pads electrically connected to the LED die(s). The interconnectors are disposed in the through holes and interconnect the upper and lower bonding pads. The lens structure covers the LED die(s).

Abstract: A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask.

Abstract: The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.

Abstract: A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.

Abstract: A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask.

Abstract: A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.