Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: A bathtub overflow pipe includes an overflow pipe, an adapter and a over. The overflow pipe includes an extending section with an outlet. The adapter is connected to the end face of the extending section of the overflow pipe by bolts. The adapter includes a sleeve and a tab extending radially from one end of the sleeve. The sleeve includes a passage and is inserted into the outlet of the overflow pipe. The tab has a recess formed to its lower edge and communicating with the outlet for drainage. The cover includes a pillar and a rim which has a recessed area. The pillar extends axially from one of two sides of the cover and has a rib. The pillar extends through the passage of the adapter, the rib is slidably engaged with the recessed rail. The cover, the adapter and the overflow pipe can be precisely and easily assembled.

Abstract: An electronic device includes a first substrate, a second substrate, a circuit layer, a diode element, and a conductive wire. The first substrate has a first surface, a second surface opposite to the first surface, and a first side surface connected between the first surface and the second surface. The second substrate has a third surface, a fourth surface opposite to the third surface, and a second side surface connected between the third surface and the fourth surface, wherein the fourth surface is disposed away from the first surface. The circuit layer and the diode element are disposed on the first surface. The diode element and the conductive wire are electrically connected to the circuit layer. A first portion of the conductive wire is disposed on the first side surface, and a second portion of the conductive wire is disposed on the second side surface.

Abstract: A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A display device is provided, and includes a substrate and a first light shielding layer disposed on the substrate and defining a plurality of first openings. The display device includes a first light filter layer disposed in one of the first openings and a plurality of light-emitting diodes disposed on the substrate. The display device includes a second light shielding layer disposed between the substrate and the first light shielding layer, and having a plurality of second openings. The at least part of the light-emitting diodes are disposed in the second openings respectively. The display device also includes a spacer element disposed between the first light shielding layer and the second light shielding layer, wherein from a cross-section view, a shape of the spacer element is arc-shaped, and a shape of the second light shielding layer is arc-shaped.

Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first air flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second air flow dissipating heat from the second fin set. The first air flow and the second air flow are separated from each other, and the second air flow passes through the bracket and the graphic card module.

Abstract: An information handling system includes a hardware processor, a memory device, and a PMU to provide power to the hardware processor and memory device. A TEC chip refrigeration liquid cooling system to cool a heat-generating component device includes a cold plate thermally coupled to the heat-generating component device to transfer heat from the heat-generating component device into a cold side tank thermally coupled between the cold tank and a hot side tank, a TEC chip to, when a voltage is applied to the TEC chip increase a rate of thermal transfer of heat from the cold side tank of a first liquid cooling loop to the hot side tank of a second liquid cooling loop, and a radiator thermally coupled to the hot side tank in the second liquid cooling loop to dissipate heat transferred to the radiator out of the information handling system.

Abstract: An electronic device including a first substrate, an isolating layer, a porous structure, a light conversion unit, and a color filter unit is provided. The isolating layer is disposed on the first substrate and has an opening. The porous structure is disposed in the opening and has a plurality of pores arranged irregularly. The light conversion unit is disposed in the pores. The color filter unit is disposed between the first substrate and the porous structure, and the color filter unit comprises a color filter pattern overlapped with the light conversion unit in a normal direction of the first substrate.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.

Abstract: A method for controlling fans arranged in different working areas comprises: presetting a plurality of fan operation frequencies, receiving a fan operation request and adjusting a frequency of a pulse width modulation (PWM) controller to a first objective frequency based on the fan operation request, and sending the first objective frequency to the fans arranged in different working areas, to drive a first fan arranged in a first objective working area to run. Each of the plurality of fan operation frequencies corresponds to different working areas, the first objective frequency is one of the plurality of fan operation frequencies, and the first objective working area is one of the plurality of working areas corresponding to the first objective frequency. A system for controlling fans and an electronic device are also disclosed.

Abstract: Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a circuit region and a seal ring region surrounding the circuit region. The seal ring region includes a first active region extending lengthwise in a first direction and a first gate structure disposed on the first active region. The first gate structure extends lengthwise in a second direction that is tilted from the first direction. The first direction and the second direction form a tilted angle therebetween.

Abstract: A method includes forming a p-well and an n-well in a substrate. The method further includes forming a stack of interleaving first semiconductor layers and second semiconductor layers over the p-well and the n-well, the first semiconductor layers having a first thickness and the second semiconductor layers having a second thickness different than the first thickness. The method further includes annealing the stack of interleaving semiconductor layers. The method further includes patterning the stack to form fin-shaped structures including a first fin-shaped structure over the n-well and a second fin-shaped structure over the p-well. The method further includes etching to remove the second semiconductor layers from the first and second fin-shaped structures, where the first semiconductor layers have a different thickness within each of the first and second fin-shaped structures after the etching. The method further includes forming a metal gate over the first and second fin-shaped structures.

Abstract: Disclosed is a light emitting device including a first substrate, a light blocking element, and a light emitting diode. The light blocking element is disposed on the first substrate, in which the light blocking element has a first opening and a second opening adjacent to the first opening, and the first opening and the second opening have different areas. At least a portion of the light emitting diode is disposed in the first opening.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

Abstract: A water tank configured to store water from a water supply includes an inlet configured to receive water from the water supply, and an outlet configured to dispense water. The water tank includes a reflective coating positioned on an inner surface of the tank, and an end wall including a light emitting diode oriented toward the outlet. The light emitting diode and the reflective coating are operable to disinfect water from the water supply.

Abstract: The present disclosure provides a display device and a method for operating the display device. The display device includes a night vision mode and a normal mode, and the display device includes a plurality of visible light display units and a plurality of invisible light display units. The method includes driving the visible light display units and turning off the invisible light display units in the normal mode, and driving the invisible light display units and turning off the visible light display units in the night vision mode.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a single diffusion break (SDB) structure in the fin-shaped structure to divide the first fin-shaped structure into a first portion and a second portion, and more than two gate structures on the SDB structure. Preferably, the more than two gate structures include a first gate structure, a second gate structure, a third gate structure, and a fourth gate structure disposed on the SDB structure.