Patents by Inventor Ming-Kuo Yu

Ming-Kuo Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6818555
    Abstract: A method for a metal etchback process to form a metal filled semiconductor feature having improved planarity and electrical resistance including a semiconductor wafer having an etched opening lined with a refractory metal containing layer and a blanket deposited metal layer filling the etched opening; spin coating a spin on layer selected from the group consisting of an organic resinous layer and a spin-on glass layer over the metal layer; dry etching in a first etchback process to remove a first portion of the SOL layer to reveal a portion of the metal layer leaving a second portion of the SOL layer overlying the etched opening; dry etching in a second etchback process to remove the metal layer to reveal a portion of the refractory metal containing layer; and, removing the second portion of the SOL layer to form a substantially planar metal filled etched opening.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: November 16, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: How-Cheng Tsai, Hung-Hsin Liu, Chung-Daw Young, Ming-Kuo Yu
  • Publication number: 20040067633
    Abstract: A method for a metal etchback process to form a metal filled semiconductor feature having improved planarity and electrical resistance including a semiconductor wafer having an etched opening lined with a refractory metal containing layer and a blanket deposited metal layer filling the etched opening; spin coating a spin on layer selected from the group consisting of an organic resinous layer and a spin-on glass layer over the metal layer; dry etching in a first etchback process to remove a first portion of the SOL layer to reveal a portion of the metal layer leaving a second portion of the SOL layer overlying the etched opening; dry etching in a second etchback process to remove the metal layer to reveal a portion of the refractory metal containing layer; and, removing the second portion of the SOL layer to form a substantially planar metal filled etched opening.
    Type: Application
    Filed: October 7, 2002
    Publication date: April 8, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: How-Cheng Tsai, Hung-Hsin Liu, Chung-Daw Young, Ming-Kuo Yu
  • Patent number: 6687456
    Abstract: An in-line fluid heater including a heater housing that contains a parabolic lamp vessel which houses an infrared lamp. A parabolic reflection vessel in the heater housing is separated from the parabolic lamp vessel by a convex lens. A quartz plate seals the heater housing, and at least one, and typically, multiple leak detectors may be provided in the heater housing. The interior reflective surface of the reflection vessel reflects the heat energy in parallel rays through the quartz plate and to the fluid to be heated. The leak detectors may be connected to an RC circuit which operates a controller to actuate a buzzer or alarm and terminate operation of the heater upon leakage of fluid into the heater housing.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: February 3, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tien-Hsing Woo, Ruei-Hung Jang, Chih-Lin Ying, Ming-Kuo Yu, Shih-Shiung Chen
  • Patent number: 6685842
    Abstract: A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: February 3, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ruei-Hung Jang, Chih-Lin Ying, Tien-Hsing Woo, Shan-Hua Wu, Ming-Kuo Yu
  • Publication number: 20040008981
    Abstract: An in-line fluid heater including a heater housing that contains a parabolic lamp vessel which houses an infrared lamp. A parabolic reflection vessel in the heater housing is separated from the parabolic lamp vessel by a convex lens. A quartz plate seals the heater housing, and at least one, and typically, multiple leak detectors may be provided in the heater housing. The interior reflective surface of the reflection vessel reflects the heat energy in parallel rays through the quartz plate and to the fluid to be heated. The leak detectors may be connected to an RC circuit which operates a controller to actuate a buzzer or alarm and terminate operation of the heater upon leakage of fluid into the heater housing.
    Type: Application
    Filed: July 15, 2002
    Publication date: January 15, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-Hsing Woo, Ruei-Hung Jang, Chih-Lin Ying, Ming-Kuo Yu, Shih-Shiung Chen
  • Patent number: 6601986
    Abstract: A static mixer comprises a mixing chamber with an inlet mixing module, fluids to be mixed being fed into the module to undergo swirling and jet collision, at least one intermediate mixing module connected to the inlet mixing module and provided with means for splitting liquid flow into a plurality of jet flows with subsequent recombination of said jets and mixing action of vortices formed around the jet flows, and an outlet mixing module connected to the intermediate mixing module and provided with means for further swirling premixed fluids.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: August 5, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ruei-Hung Jang, Tien-Hsing Woo, Chih-Lin Ying, Tsung-Chi Hsieh, Ming-Kuo Yu
  • Publication number: 20030121869
    Abstract: A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.
    Type: Application
    Filed: December 31, 2001
    Publication date: July 3, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ruei-Hung Jang, Chih-Lin Ying, Tien-Hsing Woo, Shan-Hua Wu, Ming-Kuo Yu
  • Patent number: 6571607
    Abstract: Fluid leak detection through thermal sensing is disclosed. A sensor includes one or more flexible, thermally conductive, fluid isolating layers, and a thermally sensitive detector situated within the flexible, thermally conductive, fluid isolating layers. The detector is responsive to a temperature change resulting from leaking fluid coming in contact with the sensor. The sensor may also including an affixing mechanism, such as glue, on the isolating layers, to affix the sensor to a potential fluid leak source, such as a tank or a piping line. The sensor may further include connectors located at its ends. The detector may be a thermally sensitive resistor, such as platinum or nickel, and the, fluid isolating layers may be capton.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: June 3, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ruei-Hung Jang, Chih-Lin Ying, Tien-Hsing Woo, Ming-Kuo Yu
  • Publication number: 20030043689
    Abstract: A static mixer comprises a mixing chamber with an inlet mixing module, fluids to be mixed being fed into the module to undergo swirling and jet collision, at least one intermediate mixing module connected to the inlet mixing module and provided with means for splitting liquid flow into a plurality of jet flows with subsequent recombination of said jets and mixing action of vortices formed around the jet flows, and an outlet mixing module connected to the intermediate mixing module and provided with means for further swirling premixed fluids.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 6, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ruei-Hung Jang, Tien-Hsing Woo, Chih-Lin Ying, Tsung-Chi Hsieh, Ming-Kuo Yu
  • Publication number: 20020189326
    Abstract: Fluid leak detection through thermal sensing is disclosed. A sensor includes one or more flexible, thermally conductive isolating layers, and a thermally sensitive detector situated within the flexible, thermally conductive isolating layers. The detector is responsive to a temperature change resulting from leaking fluid coming in contact with the sensor. The sensor may also including an affixing mechanism, such as glue, on the isolating layers, to affix the sensor to a potential fluid leak source, such as a tank or a piping line. The sensor may further include connectors located at its ends. The detector may be a thermally sensitive resistor, such as platinum, and the isolating layers may be capton.
    Type: Application
    Filed: June 13, 2001
    Publication date: December 19, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ruei-Hung Jang, Chih-Lin Ying, Tien-Hsing Woo, Ming-Kuo Yu