Patents by Inventor Ming Lau
Ming Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9070683Abstract: An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically coupled to one another to define a conduction path between the first and second contact pads. Each of the outer and inner guard rings includes an Ohmic metal layer having a plurality of gaps and further includes conductive bridges across the gaps. The gaps of the outer guard ring are laterally offset from the gaps of the inner guard ring such that the Ohmic metal layers of the outer and inner guard rings laterally overlap.Type: GrantFiled: June 20, 2013Date of Patent: June 30, 2015Assignee: Freescale Semiconductor, Inc.Inventors: Jason R. Fender, Ngai Ming Lau
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Publication number: 20140375341Abstract: An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically coupled to one another to define a conduction path between the first and second contact pads. Each of the outer and inner guard rings includes an Ohmic metal layer having a plurality of gaps and further includes conductive bridges across the gaps. The gaps of the outer guard ring are laterally offset from the gaps of the inner guard ring such that the Ohmic metal layers of the outer and inner guard rings laterally overlap.Type: ApplicationFiled: June 20, 2013Publication date: December 25, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Jason R. Fender, Ngai Ming Lau
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Patent number: 8671323Abstract: A Low-Density Parity-Check Convolutional Code (LPDCCC) decoder (10) for partial parallel decoding of low-density parity-check convolutional codes, the decoder having: a plurality of pipeline processors (11) to receive channel messages and edge-messages; each processor (11) having: a plurality of block processing units (BPUs) (13), each BPU (13) having a plurality of check node processors (CNPs) (14) to process check nodes that enter into the processor (11) and a plurality of variable node processors (VNPs) (15) to process variable nodes that are about to leave the processor (11); and a plurality of Random Access Memory (RAM) blocks (30) for dynamic message storage of the channel messages and the edge-messages; wherein in each processor (11), the VNPs (15) are directly connected to corresponding RAM blocks (30), and the CNPs (14) are directly connected to corresponding RAM blocks (30) such that the connections from the VNPs (15) and CNPs (14) to the corresponding RAM blocks (30) are pre-defined and fixed accorType: GrantFiled: February 10, 2012Date of Patent: March 11, 2014Assignee: The Hong Kong Polytechnic UniversityInventors: Chiu Wing Sham, Xu Chen, Chung Ming Lau, Yue Zhao, Wal Man Tam
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Publication number: 20130212450Abstract: A Low-Density Parity-Check Convolutional Code (LPDCCC) decoder (10) for partial parallel decoding of low-density parity-check convolutional codes, the decoder comprising: a plurality of pipeline processors (11) to receive channel messages and edge-messages; each processor (11) having: a plurality of block processing units (BPUs) (13), each BPU (13) having a plurality of check node processors (CNPs) (14) to process check nodes that enter into the processor (11) and a plurality of variable node processors (VNPs) (15) to process variable nodes that are about to leave the processor (11); and a plurality of Random Access Memory (RAM) blocks (30) for dynamic message storage of the channel messages and the edge-messages; wherein in each processor (11), the VNPs (15) are directly connected to corresponding RAM blocks (30), and the CNPs (14) are directly connected to corresponding RAM blocks (30) such that the connections from the VNPs (15) and CNPs (14) to the corresponding RAM blocks (30) are pre-defined and fixed aType: ApplicationFiled: February 10, 2012Publication date: August 15, 2013Inventors: Chiu Wing SHAM, Xu Chen, Chung Ming Lau, Yue Zhao, Wai Man Tam
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Patent number: 8389926Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.Type: GrantFiled: August 16, 2010Date of Patent: March 5, 2013Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20130013090Abstract: The invention, in one embodiment, is directed to a controller apparatus for controlling an electronic device by sensing and processing a user's interactions with an object and, particularly, for controlling and interacting with a media guidance application implemented on an interactive user equipment device. The controller apparatus may include a platform, a liquid container, and a stirring rod. The platform may include sensors of various kinds for detecting a user's interactions with any one of the components of the user interface system. The controller apparatus may also include sensors for sensing environmental conditions and use the sensed conditions to interact with the media guidance application or any other applications or electronic devices.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Applicant: UNITED VIDEO PROPERTIES, INC.Inventors: Kam Ming Lau, Chi Kwong So, Man Fai Tam
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Patent number: 8341669Abstract: The invention, in one embodiment, is directed to a controller apparatus for controlling an electronic device by sensing and processing a user's interactions with an object and, particularly, for controlling and interacting with a media guidance application implemented on an interactive user equipment device. The controller apparatus may include a platform, a liquid container, and a stirring rod. The platform may include sensors of various kinds for detecting a user's interactions with any one of the components of the user interface system. The controller apparatus may also include sensors for sensing environmental conditions and use the sensed conditions to interact with the media guidance application or any other applications or electronic devices.Type: GrantFiled: May 26, 2010Date of Patent: December 25, 2012Assignee: United Video Properties, Inc.Inventors: Kam Ming Lau, Chi Kwong So, Man Fai Tam
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Patent number: 8196012Abstract: An approximated lower-triangle structure for the parity-check matrix of low-density parity-check (LDPC) codes which allows linear-time-encoding complexity of the codes is disclosed, and the parity part of the parity-check matrix is semi-deterministic which allows high flexibility when designing the LDPC codes in order to provide higher error-correction capabilities than a typical dual-diagonal structure.Type: GrantFiled: October 5, 2009Date of Patent: June 5, 2012Assignee: The Hong Kong Polytechnic UniversityInventors: Chung Ming Lau, Wai Man Tam, Chi Kong Tse
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Publication number: 20110292299Abstract: The invention, in one embodiment, is directed to a controller apparatus for controlling an electronic device by sensing and processing a user's interactions with an object and, particularly, for controlling and interacting with a media guidance application implemented on an interactive user equipment device. The controller apparatus may include a platform, a liquid container, and a stirring rod. The platform may include sensors of various kinds for detecting a user's interactions with any one of the components of the user interface system. The controller apparatus may also include sensors for sensing environmental conditions and use the sensed conditions to interact with the media guidance application or any other applications or electronic devices.Type: ApplicationFiled: May 26, 2010Publication date: December 1, 2011Applicant: Rovi Technologies CorporationInventors: Kam Ming Lau, Chi Kwong So, Man Fai Tam
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Patent number: 7998537Abstract: Methods for removing hydrogen from molecules are disclosed. In one embodiment, hydrogen-containing molecules are deposited on a solid substrate and are bombarded with hydrogen projectile particles. The particles may have energies of 5-100 eV, or more preferably 10-50 eV. The hydrogen projectile particles remove hydrogen atoms from the deposited molecules while they are on the substrate, without removing other atoms from the molecules. Dangling bonds are created by the loss of hydrogen and can be used to cross-link the molecules. The resulting product can be a nanometer-thick dense film.Type: GrantFiled: February 25, 2003Date of Patent: August 16, 2011Assignee: The Chinese University of Hong KongInventors: Raymond W. M. Kwok, Woon Ming Lau
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Publication number: 20110083052Abstract: A method for encoding data, the method comprising: creating m parity bits from k data bits based on a parity-check matrix (40), the parity-check matrix (40) including a data portion (41) and a parity portion (42), the parity portion (42) includes sub-block matrices, each sub-block matrix being any one from the group consisting of: zero matrix, identity matrix and permutation matrix; and forming a codeword containing the k data bits and the created m parity bits; wherein an upper diagonal is defined in the parity portion (42) starting from the first sub-block matrix in the second column extending to the second last sub-block matrix in the last column, and each sub-block matrix on the upper diagonal is an identity matrix or a permutation matrix, and the sub-block matrices (44) above the upper diagonal are zero matrices; each column from the second column to the third last column of the parity portion (42) contains one or more identity matrices or permutation matrices below the upper diagonal (45) and the remainType: ApplicationFiled: October 5, 2009Publication date: April 7, 2011Applicant: The Hong Kong Polytechnic UniversityInventors: Chung Ming Lau, Wai Man Tam, Chi Kong Tse
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Publication number: 20110063608Abstract: A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20110062317Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.Type: ApplicationFiled: August 16, 2010Publication date: March 17, 2011Applicant: STAR TECHNOLOGIES INC.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Patent number: 7711116Abstract: Digital communication schemes using chaotic signals as carriers can be broadly classified into two categories. In the first category, the chaotic signals carrying the information have to be synchronously regenerated at the receiver, which may be applicable to low noise environment. The second category requires no synchronous regeneration of the carrying chaotic signals in the receiver. An example of the second category utilizes a specific bit structure, which may not be able to resist unintended reception because the fabricated bit structure can be relatively easily detected. This invention involves systems and methods for transmitting digital messages modulated as chaotic signals, and the demodulation methods. One individual chaotic signal generator having a specific chaotic characteristic value is responsible for generating a chaotic signal for each possible value of the digital message according to a chaotic algorithm.Type: GrantFiled: July 8, 2003Date of Patent: May 4, 2010Assignee: The Hong Kong Polytechnic UniversityInventors: Chi-Kong Tse, Chung-Ming Lau
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Patent number: 7701042Abstract: An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.Type: GrantFiled: September 18, 2007Date of Patent: April 20, 2010Assignee: Stats Chippac Ltd.Inventors: Shao Jian Chen, Wei Qiang Jin, Bhoy Ching, Taw Ming Lau
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Patent number: 7675307Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: GrantFiled: March 18, 2008Date of Patent: March 9, 2010Assignee: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Publication number: 20090237102Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.Type: ApplicationFiled: March 18, 2008Publication date: September 24, 2009Applicant: Star Technologies Inc.Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
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Patent number: 7593531Abstract: A digital communication system based on the use of chaotic carriers is disclosed. For each symbol to be sent, the transmitter sends a reference chaotic signal followed by a transformed version of the reference chaotic signal. For different symbols, different transformations are performed. Also, the transformations are designed such that the transformed versions of the reference chaotic signal do not resemble the original reference chaotic signal. As a consequence, little information can be deduced by inspecting the frequency spectrum of the transmitted signal. Moreover, even if the communication could be detected, it is difficult to decode the messages because there are numerous transformations possible.Type: GrantFiled: May 7, 2004Date of Patent: September 22, 2009Assignee: The Hong Kong Polytechnic UniversityInventors: Chung-Ming Lau, Chi-Kong Tse
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Publication number: 20080073781Abstract: An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.Type: ApplicationFiled: September 18, 2007Publication date: March 27, 2008Inventors: Shao Jian Chen, Wei Jin, Bhoy Ching, Taw Ming Lau
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Patent number: D600006Type: GrantFiled: November 24, 2008Date of Patent: September 15, 2009Inventor: Yiu Ming Lau