Patents by Inventor Ming Lei Ji

Ming Lei Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CURABLE COMPOSITIONS
    Publication number: 20150011681
    Abstract: A curable epoxy resin formulation useful for making an insulator for a high-voltage gas insulated switchgear, the curable formulation including (A) an epoxy resin composition comprising a mixture of: (A1) at least one solid epoxy resin, (A2) at least one novolac epoxy resin, and (A3) at least one cycloaliphatic epoxy resin; (B) at least one anhydride hardener; (C) at least one filler; and (D) optionally, at least one catalyst or at least one accelerator.
    Type: Application
    Filed: March 29, 2012
    Publication date: January 8, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Ming Lei Ji, Yong-jiang Li, Yi Zhang