Patents by Inventor Ming Li Tan

Ming Li Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microneedles and methods of fabricating
    Patent number: 7785459
    Abstract: Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required.
    Type: Grant
    Filed: May 28, 2006
    Date of Patent: August 31, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ramesh S/O Govinda Raju, Ming-Li Tan, Yusua Agabus, Patricia A. Beck
  • Method of determining stress
    Patent number: 7568396
    Abstract: A micromachined strain gauge comprising a plastically deformable piezoresistive microstructure formed on a surface of a substrate so that deformation of the substrate plastically deforms the microstructure to thereby change the resistance of the microstructure. The stress in the substrate can be determined from the change in the resistance of the microstructure.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: August 4, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jun He, Jun Zhao, Ming Li Tan
  • Microneedles and Method Of Fabricating Thereof
    Publication number: 20060226016
    Abstract: Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required.
    Type: Application
    Filed: May 28, 2006
    Publication date: October 12, 2006
    Inventors: Ramesh S/O Govinda Raju, Ming-Li Tan, Yusua Agabus, Patricia Beck