Abstract: A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.

Abstract: A thin film type common mode noise filter and its fabrication method are disclosed. There are several electric insulation layers, coil lead layers and main coil layers are formed on an insulation substrate by means of processes of Lithography, Physical Vapor Deposition, etching or other chemical process. After that the structure is covered with an electric insulation gluing layer and a magnetic material layer so as to form a thin film type common mode noise filter with a low production cost but an improved filtering characteristic of the common mode noise.

Abstract: A chip supplying apparatus for picking chips from a wafer positioned on an elastic film is disclosed. The chip supplying apparatus includes a shifting device, a clutch device, a film-expanding device, and a chip-picking device. In the present chip supplying apparatus, the input torque provided by the clutching device for driving the film-expanding device to perform a film-expanding operation is orthogonal to the resulting rotation torque of the film-expanding device. Therefore, when the film-expanding operation is performed, the film-expanding device will not shake. In other words, the present chip supplying apparatus can perform stable film-expanding operation.

Abstract: A solder head control mechanism which uses a movable small size and simply structured acoustic coil linear servomotor to directly drive a solder head to perform soldering operation. The solder head links with a position sensor, a controller and a current output actuator to form a closed loop control mechanism which has small inertia, fast response time and great positioning accuracy. The controller may dynamically change amplifying value to actuate the solder head.