Patents by Inventor Ming-Ling Lee

Ming-Ling Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8376524
    Abstract: A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: February 19, 2013
    Assignee: International United Technology Company, Ltd.
    Inventors: Francis Chee-Shuen Lee, Wei-Fu Lai, Ming-Ling Lee
  • Patent number: 7740341
    Abstract: An inkjet printhead including a substrate, a plurality of heaters, multiple pairs of leads, an ink chamber layer, and a nozzle plate is provided. The substrate has a top surface and a plurality of ink channels through the substrate in the direction substantially vertical to the top surface. The heaters, the multiple pairs of leads, and the ink chamber layer are disposed on the surface of the substrate. The multiple pairs of leads are electrically coupled to the corresponding heaters respectively, and the heaters are respectively adjacent to the corresponding ink channels. The ink chamber layer has a plurality of ink chambers which respectively expose the corresponding heaters and the corresponding ink channels. The nozzle plate is disposed on the ink chamber layer and has a plurality of nozzles through the nozzle plate.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: June 22, 2010
    Assignee: International United Technology Co., Ltd.
    Inventors: Francis Chee-Shuen Lee, Ming-Ling Lee, Wei-Fu Lai, Jia-Lin Chen
  • Publication number: 20090141087
    Abstract: A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.
    Type: Application
    Filed: October 10, 2008
    Publication date: June 4, 2009
    Inventors: Francis Chee-Shuen LEE, Wei-Fu Lai, Ming-Ling Lee
  • Publication number: 20070268336
    Abstract: An inkjet printhead including a substrate, a plurality of heaters, multiple pairs of leads, an ink chamber layer, and a nozzle plate is provided. The substrate has a top surface and a plurality of ink channels through the substrate in the direction substantially vertical to the top surface. The heaters, the multiple pairs of leads, and the ink chamber layer are disposed on the surface of the substrate. The multiple pairs of leads are electrically coupled to the corresponding heaters respectively, and the heaters are respectively adjacent to the corresponding ink channels. The ink chamber layer has a plurality of ink chambers which respectively expose the corresponding heaters and the corresponding ink channels. The nozzle plate is disposed on the ink chamber layer and has a plurality of nozzles through the nozzle plate.
    Type: Application
    Filed: January 16, 2007
    Publication date: November 22, 2007
    Applicant: INTERNATIONAL UNITED TECHNOLOGY CO., LTD.
    Inventors: Francis Chee-Shuen Lee, Ming-Ling Lee, Wei-Fu Lai, Jia-Lin Chen
  • Patent number: 6378978
    Abstract: An inkjet printhead chip structure and a method of estimating the working life through the detection of any defect on the chip structure. The method includes laying a metallic layer such as a tantalum layer over the chip and then shaping the metallic layer into a protective layer circuit. A portion of the metal protective layer covers the heating elements embedded in the chip. In printing, the heating elements heat up the ink to produce jets of ink. However, a portion of the heat is transferred to the metal protective layer thereby raising its temperature. Heat on the metal protective layer combined with any strayed residual ink bubbles that impinge upon the surface of the metal protective layer causes the metal to age. Since resistance of the metal protective layer will increase proportionally to the amount of aging, a measurement of the resistance is capable of estimating how much longer a given chip is suitable for use.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: April 30, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Charles C. Chang, Chieh-Wen Wang, Ming-Ling Lee, Jhih-Ping Lu, Chen-Yue Cheng, Yuan-Liang Lan
  • Publication number: 20020048943
    Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.
    Type: Application
    Filed: August 3, 1998
    Publication date: April 25, 2002
    Inventors: CHIEH-WEN WANG, MING-LING LEE, YUAN-LIANG LAN, YI-YUNG WU, HUI-FANG WANG
  • Publication number: 20020020921
    Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.
    Type: Application
    Filed: April 19, 2001
    Publication date: February 21, 2002
    Inventors: Chieh-Wen Wang, Ming-Ling Lee, Yuan-Liang Lan, Yi-Yung Wu, Hui-Fang Wang
  • Publication number: 20010048452
    Abstract: A method for fabricating a high-density ink-jet print head that utilizes a common high-density nozzle plate as a base for aligning a multiple of ink-jet printing modules. The high-density nozzle plate has wide body, high-density, high-resolution nozzles. The nozzle plate is fabricated using conventional electrochemical machining or laser machining techniques. The nozzle plate is able to provide not only a base for aligning each ink-jet printing module, but also the alignment necessary for the whole group of the ink-jet printing modules so that all modules are aligned properly. Therefore, the alignment operation can be carried out without the need for sophisticated alignment equipment and the alignment accuracy is high.
    Type: Application
    Filed: April 13, 1998
    Publication date: December 6, 2001
    Inventors: YUAN-LIANG LAN, YI-YUNG WU, CHIEH-WEN WANG, MING-LING LEE, YI-HSUAN LAI
  • Patent number: 6322193
    Abstract: A magnetoelectric apparatus for measuring the droplet frequency response at a printhead by applying a method comprising a metallic detecting plate and a magnetic ring, and a method using the foregoing apparatus to determine the maximum droplet frequency response of the printhead. When an ink drop jetted from the nozzle makes contact with the detecting plate, which is perpendicular to the nozzle plate of the printhead, a current flows through the detecting plate immediately, and is detected as a portion of an expected signal. As soon as the ink drop leaves the nozzle completely, the foregoing current no longer exists. However, the magnetic ring generates an induced current that flows in the same direction as that of the foregoing current to complement the absence thereof, wherein the induced current is also detected as another portion of the expected signal. The expected signal is then processed by a signal-processing routine for determining the maximum droplet frequency response of the inkjet printhead.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: November 27, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Ru Lian, Ming-Ling Lee, Yi-Hsuan Lai, Hung-Lieh Hu, Chieh-Wen Wang
  • Patent number: 6209993
    Abstract: A method for fabricating a printhead chip. A silicon substrate having a first surface and a second surface is provided. A plurality of grooves is formed in the first surface by an etching process. A plurality of ink slots are formed in each of the grooves. Overflow grooves are formed in the first surface beside the grooves. A plurality of firing chambers is formed on the second surface. Each of the firing chambers is respectively connected to each of the ink slots.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: April 3, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Chieh-Wen Wang, Yi-Yung Wu, Hung-Lieh Hu, Ming-Ling Lee
  • Patent number: 6126260
    Abstract: A method of prolonging the lifetime of a thermal-bubble-ink-jet print head. A first pulse is provided to a heater of the print head for generating a first bubble to expel an ink drop. A second pulse is provided to the heater after a delay time for generating a second bubble is generated. The second pulse is not large enough to expel another ink drop.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: October 3, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Liang Lan, Ming-Ling Lee, Yi-Yung Wu, Chu-Wen Chen, Ten-Hsing Jaw