Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A multi-antenna receiving and processing circuit assembly is disclosed to include multiple antennas for receiving wireless signals, multiple pre-processing units respectively electrically connected to the antennas, a matching circuit electrically connected to the pre-processing units for matching signals from the pre-processing units into a matching signal, a post-processing unit electrically connected to the matching circuit for processing the matching signal from the matching circuit through a single intermediate frequency signal and into a plurality of audio frequency signals respective to each antenna, and an output circuit electrically connected to the post-processing unit for outputting the audio frequency signals to external audio output devices.

Abstract: A tuning structure of a sound mixer is disclosed to include a switch set, formed of sliding switches with a respective switching lever, a face panel, which has sliding slots arranged in parallel for the passing of the switching levers of the switch set, a track set, which is mounted in between the switch set and the face panel and has pairs of ribs for guiding movement of the switching levers of the sliding switches stably along the sliding slots of the face panel, and tuning keys respectively fastened to the switching levers of the switch set and suspending above the face panel.

Abstract: A tuning structure of a sound mixer is disclosed to include a switch set, formed of sliding switches with a respective switching lever, a face panel, which has sliding slots arranged in parallel for the passing of the switching levers of the switch set, a track set, which is mounted in between the switch set and the face panel and has pairs of ribs for guiding movement of the switching levers of the sliding switches stably along the sliding slots of the face panel, and tuning keys respectively fastened to the switching levers of the switch set and suspending above the face panel.

Abstract: A multi-effect processing device for wireless microphone is disclosed to include a radio frequency-to-audio frequency converter module for receiving a radio frequency signal and processing the signal into an audio frequency signal, a DSP (Digital Signal Processor) for processing the audio frequency signal from the radio frequency-to-audio frequency converter module through the processes including at least one function selected from the group consisting of Echo, Reverb, Equalization, Compressor, Limiter, Expander, Feedback controller, and Noise Gate, and an output circuit electrically connected to the DSP for output the processed audio frequency signal from the DSP to external audio output apparatus.

Abstract: A wireless stereo synchronizing transceiver is disclosed to include a receiving processing unit having a mixer circuit, a transmitting processing unit, which has a stereo modulating mixing circuit and a first voltage control oscillator circuit connected to the stereo modulating mixing circuit, and a synchronizing processing unit, which has a second voltage control oscillator circuit connected to the mixer circuit of the receiving processing unit, a frequency synthesizer being electrically connected in parallel to the first voltage control oscillator circuit and the second voltage control oscillator circuit, and a processor electrically connected to the frequency synthesizer.

Abstract: A multi-antenna receiving and processing circuit assembly is disclosed to include multiple antennas for receiving wireless signals, multiple pre-processing units respectively electrically connected to the antennas, a matching circuit electrically connected to the pre-processing units for matching signals from the pre-processing units into a matching signal, a post-processing unit electrically connected to the matching circuit for processing the matching signal from the matching circuit through a single intermediate frequency signal and into a plurality of audio frequency signals respective to each antenna, and an output circuit electrically connected to the post-processing unit for outputting the audio frequency signals to external audio output devices.