Patents by Inventor Ming-Lung Yeh

Ming-Lung Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990493
    Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a front surface, a back surface opposite to the front surface, and a light-sensing region close to the front surface. The image sensor device includes an insulating layer covering the back surface and extending into the semiconductor substrate. The protection layer has a first refractive index, and the first refractive index is less than a second refractive index of the semiconductor substrate and greater than a third refractive index of the insulating layer, and the protection layer conformally and continuously covers the back surface and extends into the semiconductor substrate. The image sensor device includes a reflective structure surrounded by insulating layer in the semiconductor substrate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Chieh Fang, Ming-Chi Wu, Ji-Heng Jiang, Chi-Yuan Wen, Chien-Nan Tu, Yu-Lung Yeh, Shih-Shiung Chen, Kun-Yu Lin
  • Patent number: 11948837
    Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Fu Yeh, Chin-Lung Chung, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee
  • Publication number: 20080112270
    Abstract: A water-proof watch case and a method for manufacturing the same are disclosed. First, a design of a case and a bottom lid is decided, and a mold according to the design is fabricated accordingly. Next, a hard plastic material is injected into the mold to form the case and the bottom lid. Next, a soft plastic material is injected at an outer rim of the case to form at least one button, and a soft plastic material is injected at a conjunction between the case and the bottom lid to form a water-proof gasket. Finally, the hard and soft plastic materials are heated to adhere the button and the water-proof gasket to the outer rim of the case and the conjunction between the bottom lid and the case respectively.
    Type: Application
    Filed: November 15, 2006
    Publication date: May 15, 2008
    Applicant: GLOBALSAT TECHNOLOGY CORPORATION
    Inventors: Ming-Lung Yeh, Ming-Jian Su
  • Patent number: D564366
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: March 18, 2008
    Assignee: Globalsat Technology Corporation
    Inventors: Ming-Lung Yeh, Ming-Jian Su