Abstract: The present invention, in some embodiments, is a method the includes obtaining a sheet of a non-ferrous alloys as feedstock having a first edge and a second edge, heating the feedstock using a transverse flux induction heating system to form a heat treated product and concomitant with the heating step, cooling at least one of the first edge and the second edge of the feedstock by cross-flowing at least one fluid across the at least one of the first edge and the second edge of the feedstock.

Abstract: The present invention, in some embodiments, is a method the includes obtaining a sheet of a non-ferrous alloys as feedstock having a first edge and a second edge, heating the feedstock using a transverse flux induction heating system to form a heat treated product and concomitant with the heating step, cooling at least one of the first edge and the second edge of the feedstock by cross-flowing at least one fluid across the at least one of the first edge and the second edge of the feedstock.

Abstract: The apparatus for trimming sheet material includes a top knife and an opposing bottom knife for trimming sheet or web material passing between the top and bottom knives. The top knife defines a negative rake angle with a substantially vertical plane passing through a cutting edge of the bottom knife. The negative rake angle may be between about ?10° and ?30° and, more preferably, between about ?12° and ?20°. The top and bottom knives may be disk or block knives.

Abstract: The apparatus for trimming sheet material includes a top knife and an opposing bottom knife for trimming sheet or web material passing between the top and bottom knives. The top knife defines a negative rake angle with a substantially vertical plane passing through a cutting edge of the bottom knife. The negative rake angle may be between about −10° and −30° and, more preferably, between about −12° and −20°. The top and bottom knives may be disk or block knives.

Abstract: The apparatus for trimming sheet material includes a top knife and an opposing bottom knife for trimming sheet or web material passing between the top and bottom knives. The top knife defines a negative rake angle with a substantially vertical plane passing through a cutting edge of the bottom knife. The negative rake angle may be between about −10° and −30° and, more preferably, between about −12° and −20°. The top and bottom knives may be disk or block knives.

Abstract: A method of forming a thick interlevel dielectric layer containing sealed voids, formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings.

Abstract: A method of forming a thick interlevel dielectric layer containing sealed voids formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings.