Patents by Inventor Ming Nien
Ming Nien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240023251Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.Type: ApplicationFiled: August 30, 2022Publication date: January 18, 2024Applicant: UNIMICRON TECHNOLOGY CORP.Inventors: Shao-Chien LEE, Ching-Sheng CHEN, Heng-Ming NIEN, Pei-Wei WANG
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Patent number: 11859302Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.Type: GrantFiled: March 28, 2022Date of Patent: January 2, 2024Assignee: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
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Publication number: 20230389172Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11792918Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: GrantFiled: November 21, 2021Date of Patent: October 17, 2023Assignee: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng
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Patent number: 11785707Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: GrantFiled: October 8, 2021Date of Patent: October 10, 2023Assignee: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11686008Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.Type: GrantFiled: May 16, 2022Date of Patent: June 27, 2023Assignee: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20230124913Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.Type: ApplicationFiled: March 28, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
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Publication number: 20230124732Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.Type: ApplicationFiled: May 16, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20230120741Abstract: Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.Type: ApplicationFiled: March 22, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20220240368Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: ApplicationFiled: November 21, 2021Publication date: July 28, 2022Inventors: Pei-Wei WANG, Heng-Ming NIEN, Ching-Sheng CHEN, Yi-Pin LIN, Shih-Liang CHENG
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Publication number: 20220232694Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: ApplicationFiled: October 8, 2021Publication date: July 21, 2022Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Publication number: 20210373052Abstract: Herein disclosed is an error warning module, installed in an electronic device, comprising a detection unit and a processing unit. The detection unit detects a current or a voltage being transmitted by the electronic device to generate a current detection signal or a voltage detection signal. The processing unit, electrically connected to the detection unit, determines whether a current detection value indicated by the current detection signal exceeds a current setting range, or whether a voltage detection value indicated by the voltage detection signal exceeds a voltage setting range. When the current detection value exceeds the current setting range or the voltage detection value exceeds the voltage setting range, the processing unit generates a warning signal.Type: ApplicationFiled: May 20, 2021Publication date: December 2, 2021Inventors: Chun-Sheng HUNG, Chien-Hsing HUANG, Chi-Chiao CHENG, Chao-Ming NIEN
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Publication number: 20200365081Abstract: A timing controller device including a processor device and at least one storage device is provided. The processor device is configured to perform a data counting operation on a first image data according to a first look-up table to obtain a decay factor data and perform a compensation operation on a second image data according to the decay factor data and a second look-up table to obtain the first image data. The at least one storage device is configured to store different parts of the decay factor data. The processor device respectively stores the different parts of the decay factor data to the at least one storage device. A method for compensating an image data is also provided.Type: ApplicationFiled: May 16, 2019Publication date: November 19, 2020Applicant: Novatek Microelectronics Corp.Inventors: Hua-Gang Chang, Chen-Ming Nien
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Patent number: 10777135Abstract: A compensation method for pixel aging applicable to controlling circuit of a display device having a display panel is provided. The method includes: receiving a display content; predicting an aging of each of a plurality of pixels of the display panel resulting from the display content in order to obtain an aging prediction; generating a display data to compensate the display panel based on the aging prediction; and outputting the display content. Besides, a controlling circuit using the method for compensating a display device is also provided.Type: GrantFiled: December 5, 2018Date of Patent: September 15, 2020Assignee: Novatek Microelectronics Corp.Inventors: Chen-Ming Nien, Yu-Yi Chien
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Publication number: 20200184887Abstract: A compensation method for pixel aging applicable to controlling circuit of a display device having a display panel is provided. The method includes: receiving a display content; predicting an aging of each of a plurality of pixels of the display panel resulting from the display content in order to obtain an aging prediction; generating a display data to compensate the display panel based on the aging prediction; and outputting the display content. Besides, a controlling circuit using the method for compensating a display device is also provided.Type: ApplicationFiled: December 5, 2018Publication date: June 11, 2020Applicant: Novatek Microelectronics Corp.Inventors: Chen-Ming Nien, Yu-Yi Chien
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Patent number: 10526438Abstract: Method for producing flexographic printing plates from a photopolymerizable flexographic printing plate with a dimensionally stable support, photopolymerizable, relief-forming layer(s), and a digitally imagable layer. The method comprises (a) producing a mask by imaging the digitally imagable layer, (b) exposing the flexographic printing plate with a plurality of UV-LEDs on a UV-LED strip through the mask with actinic light, and photopolymerizing the image regions of the layer, and (c) developing the photopolymerized layer. In the UV-LED strip or in a separate strip, at least one ultrasonic sensor is arranged for determining the thickness of the flexographic printing plate for exposure. Depending on the measured thickness of the flexographic printing plate, the exposing of the flexographic printing plate is controlled in respect of: (i) number of exposure steps, exposure intensity, energy input per exposure step, duration of the individual exposure steps, and/or overall duration of exposure.Type: GrantFiled: July 19, 2017Date of Patent: January 7, 2020Assignee: Great Eastern Resins Industrial Co., Ltd.Inventors: Shenghong A. Dai, Ching Hsuan Lin, Wei Ming Nien, Wen Chen Pan, Kevin Liao
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Publication number: 20180186918Abstract: The present invention relates to a multi-functional carbamate having a soft segment, which can be used as a raw material in the preparation of a polyisocyanate having a special siloxane soft segment in its structure by a non-phosgene method; to a polyisocyanate having a special siloxane soft segment prepared by a non-phosgene method; to a urethane prepolymer having a special siloxane soft segment, prepared from a polyisocyanate having a special siloxane soft segment and a polyol; and also to a elastomeric urethane having a special siloxane soft segment, prepared by reacting a polyisocyanate having a special siloxane soft segment with a polyol and an optional chain extender. The present invention also relates to a synthesis method for the above-mentioned substances.Type: ApplicationFiled: July 19, 2017Publication date: July 5, 2018Inventors: SHENGHONG A. DAI, Ching Hsuan Lin, Wei Ming Nien, Wen Chen Pan, Kevin Liao
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Patent number: 8091606Abstract: An operating wand has a handle, an upper rod connected by an intermediate rod having one end pivotably attached to the upper end of the handle and the opposite end pivotably attached to the lower end of the upper rod. A sleeve slides along the upper rod between a first position and a second position. When in the first position the sleeve covers a portion of the upper rod, the handle, and the intermediate rod, keeping the handle, intermediate rod and upper rod in a co-linear alignment. When the sleeve is in the second position, the handle and intermediate rod are fully exposed allowing the intermediate rod to be moved relative to the handle and the upper rod so that the intermediate rod is normal to the handle and normal to the upper rod. With the sleeve in the second position the wand can be operated like a crank.Type: GrantFiled: August 25, 2004Date of Patent: January 10, 2012Assignee: Nien Made Enterprise Co., Ltd.Inventors: Ming Nien, Yu-Che Wen
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Patent number: 7984666Abstract: A Window covering cutter has its base board installed with a first clamping device for clamping a Window covering, and a knife device that is positioned next to the first clamping device, having a cutting opening, a driving plate movably fixed at a side of the cutting opening, and a knife fixed on the driving plate to reciprocate transversely to cut the Window covering. A measuring device is set at one side of the knife device for stably positioning the Window covering and measuring a length between its blocking plate and the cutting opening, providing a swift and precise measurement for cutting. So, the invention can be easily operated to esthetically cut a Window covering.Type: GrantFiled: February 17, 2008Date of Patent: July 26, 2011Assignee: Nien Made Enterprise Co., Ltd.Inventors: Ming Nien, Wen-Yeu Lee
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Publication number: 20100317761Abstract: A window covering has at least an element made of polyethylene terephthalate mixed with a filler, wherein the polyethylene terephthalate has a melt strength greater than 500 Pa·s, and a ratio of the filler is between 2% and 40% by weight, and the polyethylene terephthalate is mixed with the filler in an environment with the temperature between 200 and 350. The mixture is put into an extruder for extrusion to have a long member, and then the long member is cooled for solidification and is cut to make the window covering element. The element of the window covering has a well rigidity, heat resistant, and light fastness property, and most of all, it is recyclable.Type: ApplicationFiled: September 16, 2009Publication date: December 16, 2010Applicant: NIEN MADE ENTERPRISE CO., LTD.Inventors: Ming Nien, Tung-Jung Chen