Abstract: A linear actuator and an identification method thereof are characterized in that a memory unit of the embedding device stores the parameter data of the linear actuator, such as the parameters and the axial position of the elongated shaft, and the microprocessor determines whether the sensing device is activated, and through the process of parameter analysis, data transmission, and algorithm calculation, the calculation control device performs an instantaneous calculation to determine the state of the linear actuator, thereby improving the disadvantage of a single function of the conventional technology, avoiding the problem that the unidentified linear actuator causes the abnormality of the sensing device, and effectively finding the problem of abnormal function of the linear actuator.

Abstract: A linear actuator and an identification method thereof are characterized in that a memory unit of the embedding device stores the parameter data of the linear actuator, such as the parameters and the axial position of the elongated shaft, and the microprocessor determines whether the sensing device is activated, and through the process of parameter analysis, data transmission, and algorithm calculation, the calculation control device performs an instantaneous calculation to determine the state of the linear actuator, thereby improving the disadvantage of a single function of the conventional technology, avoiding the problem that the unidentified linear actuator causes the abnormality of the sensing device, and effectively finding the problem of abnormal function of the linear actuator.

Abstract: The present invention provides a method for forming a bonding pad having a low contact resistance. The method includes steps of: a) forming a bonding pad structure on a substrate having a metal layer by forming a passivation layer over said metal layer and etching the passivation layer with a fluorine-containing gas by which a fluorine-containing layer is formed on a surface of said bonding pad structure; and b) removing the fluorine-containing layer for reducing a contact resistance of said bonding pad structure.