Patents by Inventor Ming-Sen Chen

Ming-Sen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THIN FILM TRANSISTOR
    Publication number: 20240136420
    Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
  • Method for transferring signals via transmission interface and communications apparatus utilizing the same
    Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time
    Patent number: 7333875
    Abstract: A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: February 19, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen Chuang, Ming-Sen Chen
  • Method of predicting CMP removal rate for CMP process in a CMP process tool
    Publication number: 20060116785
    Abstract: A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 1, 2006
    Inventors: Yen Chuang, Ming-Sen Chen