Patents by Inventor Ming-Sen Chen

Ming-Sen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time
    Patent number: 7333875
    Abstract: A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: February 19, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen Chuang, Ming-Sen Chen
  • Method of predicting CMP removal rate for CMP process in a CMP process tool
    Publication number: 20060116785
    Abstract: A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 1, 2006
    Inventors: Yen Chuang, Ming-Sen Chen