Patents by Inventor Ming-Sen Tung

Ming-Sen Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lithography process and system with enhanced overlay quality
    Patent number: 10146141
    Abstract: The present disclosure provides a method. The method includes forming a resist layer on a patterned substrate; collecting first overlay data from the patterned substrate; determining an overlay compensation based on mapping of second overlay data from an integrated circuit (IC) pattern to the first overlay data from the patterned substrate; performing a compensation process to a lithography system according to the overlay compensation; and thereafter performing a lithography exposing process to the resist layer by the lithography system, thereby imaging the IC pattern to the resist layer.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: December 4, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Cheng Hung, Wei-Liang Lin, Yung-Sung Yen, Chun-Kuang Chen, Ru-Gun Liu, Tsai-Sheng Gau, Tzung-Chi Fu, Ming-Sen Tung, Fu-Jye Liang, Li-Jui Chen, Meng-Wei Chen, Kuei-Shun Chen
  • Lithography Process and System with Enhanced Overlay Quality
    Publication number: 20160062250
    Abstract: The present disclosure provides a method. The method includes forming a resist layer on a patterned substrate; collecting first overlay data from the patterned substrate; determining an overlay compensation based on mapping of second overlay data from an integrated circuit (IC) pattern to the first overlay data from the patterned substrate; performing a compensation process to a lithography system according to the overlay compensation; and thereafter performing a lithography exposing process to the resist layer by the lithography system, thereby imaging the IC pattern to the resist layer.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 3, 2016
    Inventors: Chi-Cheng Hung, Wei-Liang Lin, Yung-Sung Yen, Chun-Kuang Chen, Ru-Gun Liu, Tsai-Sheng Gau, Tzung-Chi Fu, Ming-Sen Tung, Fu-Jye Liang, Li-Jui Chen, Meng-Wei Chen, Kuei-Shun Chen