Abstract: In an example, a component caddy may include a bracket to receive a computing component; a ground portion disposed on a first end of the bracket to electrically engage with a ground pad; and a connector lock disposed on the ground portion. The connector lock may vertically attach the component caddy to a vertically-oriented connector disposed adjacent to the ground pad on a system board such that the computing component is operably engaged with the connector in a vertical orientation and electrically grounded to the ground pad through the ground portion on the bracket.

Abstract: An example device includes: A housing is mounted in a bezel. A camera holder is slideably mounted in the housing, the camera holder to slide in the housing between a recessed and an unrecessed position. A camera head is slideably mounted in the camera holder, the camera holder to slide between a downward position, when the camera holder is in the recessed position, and an upward position, when the camera holder is the unrecessed position. The camera head include a camera device angled outward, relative to the display, when the camera head is in the upward position and the camera holder is in the unrecessed position. The camera holder and the housing contains the camera head and the camera device, when the camera head is in the downward position and the camera holder is in the recessed position.

Abstract: In some examples, an electronic device includes an outer housing an outer housing including a recess to receive a peripheral module. In addition, the electronic device includes a mounting assembly to move the peripheral module into and out of the recess of the outer housing. The mounting assembly is moveably coupled to the outer housing. The mounting assembly includes a latch mechanism to removably attach the mounting assembly to the peripheral module. The mounting assembly includes a first electrical connector to removably connect to a second electrical connector of the peripheral module. The latch mechanism includes an arm and a lip to move into and out of engagement with a shoulder of the peripheral module. The lip is disposed along the arm.

Abstract: Examples of an audio-video (AV) apparatus are described herein. In an example, the AV apparatus includes a base member. The AV apparatus further includes an AV unit including an image sensor and an audio sensor. The AV unit being actuated to move, with respect to the base member, either in a first direction and activate the audio sensor or in a second direction and activate the image sensor and the audio sensor.

Abstract: An example electronic device includes an outer housing, and a mounting assembly coupled to the outer housing that is to mount a peripheral module to the outer housing. The mounting assembly is to transition between a first position in which the peripheral module is recessed within the outer housing and a second position in which the peripheral module is extended out of the outer housing. The mounting assembly includes an arm and wherein a rotational position of the arm is to adjust a clearance distance of the peripheral module from the outer housing when the mounting assembly is in the second position.

Abstract: An example electronic device includes an outer housing, a shoulder connected to the outer housing, and a mounting assembly moveably coupled to the outer housing to mount a peripheral module. The mounting assembly has a rotatable arm biased to a first angular position. The rotatable arm is to remain in the first angular position when a first peripheral module is mounted, whereby the mounting assembly is moveable to extend the first peripheral module to a first clearance distance. The rotatable arm is rotatable to a second angular position in response to mounting a second peripheral module, whereby the mounting assembly is moveable to engage the rotatable arm against the first shoulder and to extend the second peripheral module to a second clearance distance that is less than the first distance.

Abstract: An example electronic device includes an outer housing, a shoulder connected to the outer housing, and a mounting assembly moveably coupled to the outer housing to mount a peripheral module. The mounting assembly has a rotatable arm biased to a first angular position. The rotatable arm is to remain in the first angular position when a first peripheral module is mounted, whereby the mounting assembly is moveable to extend the first peripheral module to a first clearance distance. The rotatable arm is rotatable to a second angular position in response to mounting a second peripheral module, whereby the mounting assembly is moveable to engage the rotatable arm against the first shoulder and to extend the second peripheral module to a second clearance distance that is less than the first distance.

Abstract: An example device includes: A housing is mounted in a bezel. A camera holder is slideably mounted in the housing, the camera holder to slide in the housing between a recessed and an unrecessed position. A camera head is slideably mounted in the camera holder, the camera holder to slide between a downward position, when the camera holder is in the recessed position, and an upward position, when the camera holder is the unrecessed position. The camera head include a camera device angled outward, relative to the display, when the camera head is in the upward position and the camera holder is in the unrecessed position. The camera holder and the housing contains the camera head and the camera device, when the camera head is in the downward position and the camera holder is in the recessed position.

Abstract: An example device includes a main housing having a rotation track. The device also includes a camera having a plurality of imaging modules. The camera is attached to the main housing externally. A subset of the plurality of imaging modules is to power on by a rotation of the camera via the rotation track.

Abstract: Examples of an audio-video (AV) apparatus are described herein. In an example, the AV apparatus includes a base member. The AV apparatus further includes an AV unit including an image sensor and an audio sensor. The AV unit being actuated to move, with respect to the base member, either in a first direction and activate the audio sensor or in a second direction and activate the image sensor and the audio sensor.

Abstract: An example device includes a main housing having a rotation track. The device also includes a camera having a plurality of imaging modules. The camera is attached to the main housing externally. A subset of the plurality of imaging modules is to power on by a rotation of the camera via the rotation track.

Abstract: In some examples, an electronic device includes an outer housing an outer housing including a recess to receive a peripheral module. In addition, the electronic device includes a mounting assembly to move the peripheral module into and out of the recess of the outer housing. The mounting assembly is moveably coupled to the outer housing. The mounting assembly includes a latch mechanism to removably attach the mounting assembly to the peripheral module. The mounting assembly includes a first electrical connector to removably connect to a second electrical connector of the peripheral module. The latch mechanism includes an arm and a lip to move into and out of engagement with a shoulder of the peripheral module. The lip is disposed along the arm.

Abstract: A webcam shutter assembly includes a first sub-assembly and second sub-assembly formed independently of each other. The first sub-assembly includes a shutter for selectively covering a camera lens, and the second sub-assembly includes a manually operable actuator. The actuator is biased in a non-engaging arrangement with the shutter and is positioned to releasably engage the shutter for movement of the shutter in a lateral direction.

Abstract: Example implementations relate to establishing communication links with computing devices. As an example, a device stand includes a first member including an attachment feature to couple the device stand to a computing device. The device stand also includes a second member including a rotation track to enable the first member to rotate with respect to the second member to decouple the device stand from the device. The device stand further includes a third member including an opening to receive the attachment feature. The second member is situated between the first member and the third member. The device stand further includes a first sidewall having a first slope and a second sidewall having a second slope that is different from the first slope. The first sidewall and the second sidewall are defined by the first member and the second member.

Abstract: An example shutter assembly for protecting cameras, such as webcams, integrated into computing devices is disclosed. The shutter assembly includes an actuator element and shutter element. The actuator element can rotate an axis to pivot the shutter element into and out of the field of view of the camera assembly. The actuator can extend through or be otherwise accessible through the housing of the computing device so that the shutter can move in a plane parallel to the front surface or bezel of the computing device. Because the shutter element operated from a surface other than the front facing surface, the bezel can include a single surface with a window to protect the camera assembly and allow for a touch control capabilities. The shutter element can be disposed between the bezel and the camera assembly to provide privacy from the camera being inadvertently or maliciously activated.

Abstract: In one example, a webcam shutter assembly includes a first sub-assembly and second sub-assembly formed independently of each other. The first sub-assembly includes a shutter for selectively covering a camera lens, and the second sub-assembly includes a manually operable actuator. The actuator is biased in a non-engaging arrangement with the shutter and is positioned to releasably engage the shutter for movement of the shutter in a lateral direction.

Abstract: In one example, a webcam shutter assembly includes a first sub-assembly and second sub-assembly formed independently of each other. The first sub-assembly includes a shutter for selectively covering a camera lens, and the second sub-assembly includes a manually operable actuator. The actuator is biased in a non-engaging arrangement with the shutter and is positioned to releasably engage the shutter for movement of the shutter in a lateral direction.

Abstract: Example implementations relate to establishing communication links with computing devices. As an example, a device stand includes a first member including an attachment feature to couple the device stand to a computing device. The device stand also includes a second member including a rotation track to enable the first member to rotate with respect to the second member to decouple the device stand from the device. The device stand further includes a third member including an opening to receive the attachment feature. The second member is situated between the first member and the third member. The device stand further includes a first sidewall having a first slope and a second sidewall having a second slope that is different from the first slope. The first sidewall and the second sidewall are defined by the first member and the second member.

Abstract: In one example, a webcam shutter assembly includes a first sub-assembly and second sub-assembly formed independently of each other. The first sub-assembly includes a shutter for selectively covering a camera lens, and the second sub-assembly includes a manually operable actuator. The actuator is biased in a non-engaging arrangement with the shutter and is positioned to releasably engage the shutter for movement of the shutter in a lateral direction.

Abstract: The semiconductor device structures are provided. The semiconductor device structure includes a gate stack structure formed on a substrate and an isolation structure formed in the substrate. The semiconductor device structure further includes a source/drain stressor structure formed between the gate stack structure and the isolation structure and a metal silicide layer formed on the source/drain stressor structure. A portion of the metal silicide layer is below a top surface of the isolation structure.