Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil.

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil.