Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, semiconductor dies over the package substrate, and an underfill element over the package substrate and surrounding the semiconductor dies. A portion of the underfill element is located between the semiconductor dies. The semiconductor die package also includes lid structures respectively attached to the top surfaces of the semiconductor dies. In plan view, each lid structure is located within the periphery of the top surface of the corresponding semiconductor die. Each lid structure is disconnected from other lid structures, and a gap is formed between adjacent lid structures and located over the portion of the underfill element.

Abstract: An optical device for preventing dew condensation including a housing, a transparent glass and a lens structure is provided. The housing has a first permeable portion capable of communicating between an interior and an exterior of the housing. The transparent glass has an inner surface and is coupled to the housing with the inner surface facing the interior of the housing. The lens structure is accommodated in the housing, and a chamber is formed between the lens structure, the housing and the inner surface of the transparent glass. The chamber and the exterior of the housing are capable of forming an airflow path therebetween, and the airflow path is adjustable to control whether an airflow is able to enter and exit the chamber and the exterior of the housing through the first permeable portion.

Abstract: There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.

Abstract: A light-emitting package, includes: a housing including an opening; a lead frame covered by the housing; a light-emitting device, mounted in the opening and electrically connected to the lead frame, the light-emitting device including: a substrate including: a base with a main surface; and a plurality of protrusions on the main surface, wherein the protrusion and the base include different materials; a semiconductor stack on the main surface, the semiconductor stack including a side wall, and wherein an included angle between the side wall and the main surface is an obtuse angle; wherein the main surface includes a peripheral area not covered by the semiconductor stack, and the peripheral area is devoid of the protrusion formed thereon; and a filling material filling in the opening and covering the light-emitting device.

Abstract: A package structure is provided. The package structure includes a semiconductor die over a redistribution structure, bonding elements below the redistribution structure, and an underfill layer surrounding the bonding elements and the redistribution structure. The semiconductor die has a rectangular profile in a plan view. A pitch of the bonding elements is defined as the sum of a diameter of the bonding elements and a spacing between neighboring two of the bonding elements. A first circular area of the redistribution structure is entirely covered and in direct contact with the underfill layer. The center of the first circular area is aligned with a first corner of the rectangular profile of the semiconductor die. A diameter of the first circular area is greater than twice the pitch of the bonding elements.

Abstract: A fan-out package includes a redistribution structure having redistribution-side bonding structures, a plurality of semiconductor dies including a respective set of die-side bonding structures that is attached to a respective subset of the redistribution-side bonding structures through a respective set of solder material portions, and an underfill material portion laterally surrounding the redistribution-side bonding structures and the die-side bonding structures of the plurality of semiconductor dies. A subset of the redistribution-side bonding structures is not bonded to any of the die-side bonding structures of the plurality of semiconductor dies and is laterally surrounded by the underfill material portion, and is used to provide uniform distribution of the underfill material during formation of the underfill material portion.

Abstract: A machine vision-based sheet defect labeling method and apparatus, a device and a medium are provided. The method includes: performing a defect inspection on a target sheet conveyed to a preset defect inspection position, specifically, the target sheet continues to be conveyed towards a preset labeling position after passing the preset defect inspection position by being conveyed; generating a defect label of the target sheet when a defect present in the target sheet is determined, specifically, the defect label carries defect information represented by a two-dimensional barcode symbol including discontinuous dots; and labeling the defect of the target sheet at the preset labeling position with the defect label of the target sheet.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: A light-emitting device including a semiconductor stack generating a first light, and a filter formed on the semiconductor stack, including a first surface facing the semiconductor stack and a second surface opposite to the first surface. The filter includes pairs of layers with different refractive indexes alternately stacked. A portion of the first light is transmitted by the filter. The light emitting device emits a second light including the portion of the first light, and the second light includes a first directional part with a first FWHM and a second directional part with a second FWHM smaller than the first FWHM. The first directional part has a first angle with a normal direction of the second surface in a range of 45-90 degrees and the second directional part having a second angle with the normal direction of the second surface in a range of 0-30 degrees.

Abstract: The present application relates to automatic decision-making for pulling. Multi-dimensional data cleaning is performed and dimensional data warehouse is established by processing, filtering and converting basic source data of pulling nodes in a pulling process for monocrystal pulling-up into data sets easily identified and marked and establishing respective models based thereon. Basic source data of a current pulling nodes are obtained and converted into process parameters. The process parameters are compared with respective models in the dimensional data warehouse to obtain a first determination result. Data analysis is performed on the first determination result to determine whether an abnormality occurs in the current pulling process to obtain a second determination result. Decision is made automatically based on the second determination result.

Abstract: The present application relates to automatic decision-making for welding. Multi-dimensional data cleaning is performed and dimensional data warehouse is established by processing, filtering and converting basic source data of welding nodes in a welding process for monocrystal pulling-up into data sets easily identified and marked and establishing respective models based thereon. Basic source data of a current welding nodes are obtained and converted into process parameters. The process parameters are compared with respective models in the dimensional data warehouse to obtain a first determination result. Data analysis is performed on the first determination result to determine whether the current welding process is abnormal to obtain a second determination result. Decision is made automatically based on the second determination result.

Abstract: The present application provides an optical device and a method of fabricating the same. The optical device include a semiconductor stack structure, an anti-reflective film and a highly-reflective film. The semiconductor stack structure is configured to generate a laser beam and emit the laser beam from its front facet while receiving an electric current. The anti-reflective film is disposed on the front facet of the semiconductor stack structure and configured to increase the transmittance (reduce a reflectivity) of the front facet to the laser beam. The highly-reflective film is disposed on a rear facet of the semiconductor stack structure and is configured to reduce a loss (increase a reflectivity) of the laser beam transmitted to the rear facet. The anti-reflective film and the highly-reflective film respectively have refractive indices greater than 2, and the highly-reflective film has a thickness greater than that of the anti-reflective film.

Abstract: A computer-implemented method of generating a digital polymerase chain reaction (dPCR) result is provided. The method includes detecting a first set of emission data from a plurality of samples, each included in a sample region of a plurality of sample regions, at a first time amplification during an amplification period. The method further includes determining a positive or negative amplification determination for each sample of the plurality of samples based in part on the first set of emission data. A dPCR result is generated based on the positive or negative amplification determinations for the plurality of samples.

Abstract: Disclosed in the present disclosure are a waterproof double-sided liquid crystal screen electronic shelf label and system, including: a main frame, a double-sided screen, a power connection and debugging member, and a fixing member. The double-sided screen is fixed in the main frame. The power connection and debugging member and the fixing member are located at a lateral side of the main frame. The power connection and debugging member is configured to supply power to the double-sided screen and debug the double-sided screen. The fixing member is configured to fix and mount the electronic shelf label. The double-sided screen is configured to display information on both sides of the double-sided screen. The present disclosure can achieve double-sided display by one electronic shelf label.

Abstract: Provided is a joint-free continuous rope and belt having a one rope section, a belt section, and a transition section arranged between the rope section and the belt section. A diameter of the rope section is smaller than a width of the belt section, and the rope section, the belt section and the transition section are continuously woven from the same strands to form an integrated structure.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: A jobsite audio device with multi-source power and multi-port USB interface is proposed, which includes an AC-DC power source, a battery pack, a multi-port USB interface including at least one bidirectional power delivery USB C port, a charging circuit coupled to the AC-DC power source, the battery pack and the multi-port USB interface to provide power delivery paths, an audio module powered by the AC-DC power source or the battery pack to generate audio signals, and a main controller coupled to the charging circuit and the audio module, wherein the main controller monitors power consumption of the audio module and charging process of the charging circuit to automatically adjust charging power.

Abstract: A light sensor includes an optoelectronic device and a light guide element. The light guide element has a first light incident surface and a light exit surface, so as to allow an incident light to enter the light guide element from the first light incident surface and then exit to the optoelectronic device from the light exit surface; wherein at least one of the light incident surface and the light exit surface has a single curved surface.

Abstract: A light source module includes a casing, a first light source disposed in the casing to emit a first light, a first semi-transparent and semi-reflective mirror disposed in the casing and located on an optical path of the first light, and a heat dissipation member disposed in the casing and located on a second axis of the first semi-transparent and semi-reflective mirror. A first part of the first light passes through the first semi-transparent and semi-reflective mirror or is reflected by the first semi-transparent and semi-reflective mirror and then travels along a first axis. A second part of the first light is reflected by the first semi-transparent and semi-reflective mirror or passes through the first semi-transparent and semi-reflective mirror and then travels along a second axis. The first part is more than the second part. The second part of the first light is directed to the heat dissipation member.