Abstract: A method of manufacturing pre-molded lead frame for packaging is disclosed. A first patterned aluminum metal layer is formed on a temporary carrier. A displacement reaction procedure is performed, in which at least part of the first patterned aluminum metal layer is replaced by copper metal so as to form a first copper metal wiring layer. A first molding compound is formed around the first copper metal wiring layer. The temporary carrier is removed.

Abstract: A projector includes a light source module, a light valve, and a projecting lens. The light source module includes a light-emitting element, a light diffusion assembly, a first structural component, and a first temperature-sensing element. The light-emitting element is adapted to emit an illumination light beam. The light diffusion assembly is adapted to diffuse the illumination light beam. The light diffusion assembly has a front end and a rear end opposite to each other, the front end of the light diffusion assembly faces the light-emitting element, and the rear end of the light diffusion assembly faces the first structural component. The first temperature-sensing element is disposed on the first structural component and corresponds to the light diffusion assembly. The light valve is adapted to convert the illumination light beam from the light source module into an image light beam. The projecting lens is adapted to project the image light beam.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, a first alignment layer and a second electrode layer. A material of the first alignment layer includes rare-earth metal oxide. The ferroelectric layer and the first alignment layer are disposed between the first electrode layer and the second electrode layer, and the first alignment layer is disposed between the ferroelectric layer and the first electrode layer.

Abstract: A gas mixing system for semiconductor fabrication includes a mixing block. The mixing block defines a gas mixing chamber, a first gas channel fluidly coupled to the gas mixing chamber at a first exit location, and a second gas channel fluidly coupled to the gas mixing chamber at a second exit location, wherein the first exit location is diametrically opposite the second exit location relative to the gas mixing chamber and the second gas channel has a bend of 90 degrees or less between an entrance of the second gas channel and the second exit location.

Abstract: A projector device including a device body, a first heat dissipation component, a second heat dissipation component, a third heat dissipation component, and a heat dissipation fan. The device body includes a light emitting element, a wavelength conversion element, a light valve, and a projection lens. The first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are connected to the light emitting element, the light valve, and the wavelength conversion element. The heat dissipation fan has an air outlet surface and is adapted to provide a heat dissipation airflow. The air outlet surface faces at least one of the first heat dissipation component, the second heat dissipation component, and the third heat dissipation component. The first heat dissipation component, the second heat dissipation component and the third heat dissipation component are all located on at least one flow path of the heat dissipation airflow.

Abstract: Disclosed are a super-resolution imaging system (1, 41, 51), a super-resolution imaging method, a biological sample identification system (4, 61) and method, a nucleic acid sequencing imaging system (5) and method, and a nucleic acid identification system (6) and method. The super-resolution imaging system (1, 41, 51) includes an illumination system (A) and an imaging system (B). The illumination system (A) outputs excitation light to irradiate a biological sample to generate excited light, and the imaging system (B) collects and records the excited light to generate an excited light image. The illumination system (A) includes an excitation light source (10, 10a) and a structured light generation and modulation device (11, 11a). The excitation light source (10, 10a) outputs the excitation light, and the structured light generation and modulation device (11, 11a) modulates the excitation light into structured light to irradiate the biological sample to generate the excited light.

Abstract: A package structure includes a package substrate, an interposer module, a package lid, and a heat dissipation structure between the interposer module and the package lid, including a thermal interface material (TIM) layer, and a metal barrier layer between the TIM layer and at least one of the interposer module or the package lid, and configured to inhibit formation of an intermetallic compound (IMC) layer. A method of making the package structure includes forming a metal barrier layer comprising Cu (111) on at least one of an interposer module or a package lid, attaching the interposer module, forming a thermal interface material (TIM) layer over the interposer module, and attaching the package lid to the package substrate so that the interposer module, the TIM layer and the metal barrier layer are disposed between the package lid and the package substrate, and the metal barrier layer contacts the TIM layer.

Abstract: A package structure includes a package substrate, a chip on the package substrate, a package lid on the chip, and a structure between the chip and the package lid. The structure may include a thermal interface material (TIM) layer, and a metal layer between the TIM layer and at least one of the chip or the package lid and configured to inhibit formation of an intermetallic compound (IMC) layer. A method of making the package structure includes forming a metal layer including a high-texture structure on at least one of a chip or a package lid, attaching the chip to a package substrate, forming a thermal interface material (TIM) layer over the chip, and attaching the package lid to the package substrate over the chip so that the chip, the TIM layer and the metal layer are disposed between the package lid and the package substrate.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Abstract: The present invention discloses a fully bio-based, highly filled lignin-rubber masterbatch, a method for preparing same, and use thereof. The lignin-rubber masterbatch is prepared by a method comprising: (1) reacting a lignin, acetic acid, and oleic acid in the presence of a catalyst to give a modified lignin; and (2) blending the modified lignin and a rubber, and granulating to give the lignin-rubber masterbatch. The highly filled lignin-rubber masterbatch prepared by the present invention can replace the conventional reinforcing agent carbon black and provide a better reinforcing effect and higher mechanical properties for rubber materials. The present invention can also reduce the rubber content of the rubber composite materials while retaining the mechanical properties, thus featuring cost-efficiency.

Abstract: A semiconductor device package is provided. The semiconductor device package includes a substrate, a first package component, a second package component, and at least one dummy die. The first and second package components are disposed over and bonded to the substrate. The first and second package components are different types of electronic components that provide different functions. The dummy die is disposed over and attached to the substrate. The dummy die is located between the first and second package components and is electrically isolated from the substrate.

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: Methods of designing integrated circuits incorporating an analog ECO flow are provided. An example method comprises receiving an initial design and performing an auto-marker process. The auto-marker process comprises performing a first auto-marker process to surround a first plurality of active cells of the design with first computer-aided design (CAD) layers corresponding to a first plurality of engineering change order (ECO) cells, performing an enhanced auto-marker process to cover irregular shapes of the design with second CAD layers corresponding to a second plurality of ECO cells, and performing a second auto-marker process to fill empty areas of the design with third CAD layers corresponding to a third plurality of ECO cells. The method further includes filling the design with the first plurality of ECO cells, the second plurality of ECO cells, and the third plurality of ECO cells.

Abstract: A lens module including an integrated lens holder and a lens group is provided. The lens holder is composed of a fixed piece and a lens frame. The lens frame is connected to the fixed piece. The lens frame includes an accommodating cavity and a bearing surface located in a periphery of the accommodating cavity. The lens group is disposed in the accommodation cavity and is supported on the bearing surface.

Abstract: A method of manufacturing a semiconductor device includes forming M_1st segments in a first metallization layer including: forming first and second M_1st segments for which corresponding long axes extend in a first direction and are substantially collinear, the first and second M_1st segments being free from another instance of M_1st segment being between the first and second M_1st segments; and (A) where the first and second M_1st segments are designated for corresponding voltage values having a difference equal to or less than a reference value, separating the first and second M_1st segments by a first gap; or (B) where the first and second M_1st segments are designated for corresponding voltage values having a difference greater than the reference value, separating the first and second M_1st segments by a second gap, a second size of the second gap being greater than a first size of the first gap.

Abstract: An unreal engine graphic construction method includes the following steps: receiving data to be displayed; determining a number N of basic graphics contained in a graphic to be constructed according to the data to be displayed, wherein, N>1; calling an underlying function at a blueprint layer to draw N of the basic graphics in sequence, wherein the underlying function is used for creating the basic graphics.

Abstract: A metallization structure electrically connected to a conductive bump is provided. The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad, and an under bump metallurgy covering the conductive via, wherein the conductive bump is disposed on the UBM. Furthermore, a package structure including the above-mentioned metallization structures is provided.

Abstract: The present disclosure provides a method of making a semiconductor device. The method includes forming a semiconductor stack on a substrate, wherein the semiconductor stack includes first semiconductor layers of a first semiconductor material and second semiconductor layers of a second semiconductor material alternatively stacked on the substrate; patterning the semiconductor stack and the substrate to form a trench and an active region being adjacent the trench; epitaxially growing a liner of the first semiconductor material on sidewalls of the trench and sidewalls of the active region; forming an isolation feature in the trench; performing a rapid thermal nitridation process, thereby converting the liner into a silicon nitride layer; and forming a cladding layer of the second semiconductor material over the silicon nitride layer.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.