Abstract: Disclosed are embodiments of rope designs and making and manufacturing of such ropes. In some embodiments, a rope comprises a set of first rope cores, each first rope core of the set of first rope cores comprising a first material; a set of second rope cores, each second rope core of the set of second rope cores comprising a second material, the second material being different from the first material; and a rope sheath configured to encompass the set of first rope cores and the second rope core. In some cases, the rope sheath is braided from a plurality of rope sheath strands.

Abstract: The present invention relates to a compound represented by formula I: and pharmaceutically acceptable salts thereof. The compounds of formula I are inhibitors of diacylglyceride O-acyltransferase 2 (“DGAT2”) and may be useful in the treatment, prevention and suppression of diseases mediated by DGAT2. The compounds of the present invention may be useful in the treatment of hepatic steatosis, diabetes mellitus, obesity, hyperlipidemia, hypercholesterolemia, atherosclerosis, nonalcoholic steatohepatitis (NASH), cardiorenal diseases such as chronic kidney diseases and heart failure and related diseases and conditions.

Abstract: A red light emitting diode including an epitaxial stacked layer, a first and a second electrodes and a first and a second electrode pads is provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and a light emitting layer. A main light emitting wavelength of the light emitting layer falls in a red light range. The epitaxial stacked layer has a first side adjacent to the first semiconductor layer and a second side adjacent to the second semiconductor layer. The first and the second electrodes are respectively electrically connected to the first-type and the second-type semiconductor layers, and respectively located to the first and the second sides. The first and a second electrode pads are respectively disposed on the first and the second electrodes and respectively electrically connected to the first and the second electrodes. The first and the second electrode pads are located at the first side of the epitaxial stacked layer.

Abstract: An assembly includes a front console having an outer surface and a pair of outboard ends spaced along an axis and defining a center therebetween. The assembly includes an airbag supported by the front console at one of the outboard ends and inflatable from an uninflated position elongated transverse to the axis to an inflated position extending along the outer surface toward the center.

Abstract: A light emitting diode and manufacturing method thereof are provided. The light emitting diode includes a first-type semiconductor layer, a light emitting layer, a second-type semiconductor layer, a first metal layer, a first current conducting layer, a first bonding layer and a second current conducting layer. The light emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer. The first metal layer is located on and electrically connected to the first-type semiconductor layer. The first metal layer is located between the first current conducting layer and the first-type semiconductor layer. The first current conducting layer is located between the first bonding layer and the first metal layer. The first current conducting layer is connected to the first-type semiconductor layer by the first current conducting layer and the first metal layer. The first bonding layer has through holes overlapped with the first metal layer.

Abstract: An electronic stylus includes a hollow cylindrical casing having an opening defined in an axial end portion thereof, a core body mounted in the casing and having an axial end portion projecting out of the opening, and a core body protector covering and accommodating therein the axial end portion of the core body, and protecting the core body. The casing has, adjacent to the opening, an abutment surface lying in a direction transverse to an axial direction of the casing and an inner wall surface extending in the axial direction of the casing. The core body protector has a first surface facing the abutment surface of the casing and a second surface facing the inner wall surface of the casing.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: A light emitting diode (LED) including an epitaxial stacked layer, first and second reflective layers which are disposed at two sides of the epitaxial stacked layer, a current conducting layer and first and second electrodes and a manufacturing thereof are provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and an active layer. A main light emitting surface with a light transmittance >0% and ?10% is formed on one of the two reflective layers. The current conducting layer contacts the second-type semiconductor layer. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer via the current conducting layer. A contact scope of the current conducting layer and the second-type semiconductor layer is served as a light-emitting scope overlapping the two layers, but not overlapping the two electrodes.

Abstract: A film for inhibiting corrosion including a polymeric resin and a vapor corrosion inhibitor film additive is described. The vapor corrosion inhibitor film additive includes compounds useful to protect metal surfaces from corrosion, such as ammonium or alkylammonium carboxylates and/or a triazole derivative. The film may include multiple layers.

Abstract: A projector includes a casing, a lens, a bracket, a support member, a first spacer and a first fixing member. The lens is connected to the casing. The bracket is connected to the casing and has a through hole formed thereon. The support member is inserted into the through hole and abuts against the lens. The first spacer is disposed on the support member and has a first curved surface and the first curved surface faces the through hole. The first fixing member is disposed on the support member and pushes the first spacer towards the bracket, such that the first curved surface contacts a periphery of the through hole.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.

Abstract: An electronic device includes a casing, a circuit board, an electronic component and a fixing member. The casing includes a fixing pillar and at least one rib. The rib is connected to a periphery of the fixing pillar. The circuit board includes a through hole. The fixing pillar is disposed in the through hole. The circuit board abuts against a second top surface of the rib. A thickness of the circuit board is smaller than a height between a first top surface of the fixing pillar and the second top surface of the rib. The electronic component includes a first metal member. A first ground end of the first metal member is disposed on the first top surface of the fixing pillar. A gap exists between the first ground end and the circuit board. The fixing member fixes the first ground end to the fixing pillar.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: A human-machine interface (HMI) system comprises a local operation device, a display device, a HMI display control device and a communication control device. The local operation device generates a local operation signal. The display device shows a display image corresponding to a display signal. The HMI display control device generates the display signal according to the local operation signal or a remote operation signal. The communication control device comprises a wireless communication connection port for connecting with a remote operation device. The communication control device transmits the local operation signal to the HMI display control device, transmits the display signal to the display device, and selectively transmits the display signal to the remote operation device.

Abstract: A speaker module includes a bracket, a plurality of first cushion members, a speaker and a plurality of second cushion members. The bracket includes a plurality of first pillars. Each of the first cushion members is disposed on one of the first pillars. The speaker is connected to the first cushion members. The second cushion members are connected to a periphery of the bracket.

Abstract: Provided is a light emitting diode (LED) mounted on a carrier substrate and including a semiconductor epitaxial structure and at least one electrode pad structure. The semiconductor epitaxial structure is electrically connected to the carrier substrate. The electrode pad structure includes a eutectic layer, a barrier layer and a ductility layer. The eutectic layer is adapted for eutectic bonding to the carrier substrate. The barrier layer is between the eutectic layer and the semiconductor epitaxial structure. The barrier layer blocks the diffusion of the material of the eutectic layer in the eutectic bonding process. The ductility layer is between the eutectic layer and the semiconductor epitaxial structure. The ductility layer reduces the stress on the LED produced by thermal expansion and contraction of the substrate during the eutectic bonding process, so as to prevent the electrode pad structure from cracking, and maintain the quality of the LED.

Abstract: The present disclosure relates to a radio-frequency identification system for a container, such as a cryogenic container, comprising: a large number of radio-frequency identification tags for cryogenic straws, preferably at least 100 radio-frequency identification tags, each radio-frequency identification tag attachable to or embeddable in a cryogenic straw; an interrogation unit adapted to be placed or integrated inside the cryogenic container; wherein the interrogation unit and radio-frequency identification tags are configured to operate with a frequency of at least 30 MHz.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: A light emitting diode chip including an epitaxy stacked layer, first and second electrodes and a first reflective layer is provided. The epitaxy stacked layer includes first-type and second-type semiconductor layers and a light-emitting layer. The first and second electrodes are respectively electrically connected to the first-type and second-type semiconductor layers. An orthogonal projection of the light-emitting layer on the first-type semiconductor layer is misaligned with an orthogonal projection of the first electrode on the first-type semiconductor layer. The first reflective layer is disposed on the epitaxy stacked layer, the first and second electrodes. An orthogonal projection of the first reflective layer on the second-type semiconductor layer is misaligned with an orthogonal projection of the second electrode on the second-type semiconductor layer. Furthermore, a light emitting diode device is also provided.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.