Abstract: A pixel structure including a flexible substrate, an active device, a pixel electrode, a capacitance electrode, a first insulation layer, a second insulation layer, and a padding layer is provided. The pixel electrode is electrically connected to the active device and has pixel electrode openings. The capacitance electrode is disposed overlapping the pixel electrode and has capacitance electrode openings corresponding to the pixel electrode openings. The first insulation layer is disposed between the pixel electrode and the flexible substrate. The second insulation layer is disposed between the pixel electrode and the capacitance electrode. The active device is disposed between the second insulation layer and the flexible substrate. The padding layer includes padding pillars and a padding pattern covering over the active device. The padding pillars are located in the pixel electrode openings respectively. The pixel electrode partially covers the padding pattern and exposes the padding pillars.

Abstract: A surface treatment method for a flexible substrate is provided. A flexible insulation substrate is provided. A surface of the flexible insulation substrate has at least one defect. A plasma etching is performed on the flexible insulation substrate to smooth a profile of the defect.

Abstract: A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.

Abstract: A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Abstract: A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and then illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. After that, the second substrate is peeled off from the first substrate.

Abstract: A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

Abstract: A manufacturing method for a flexible display apparatus is provided. A rigid substrate is provided. A flexible substrate having a supporting portion and a cutting portion surrounding the supporting portion is provided. A first adhesive material is formed between the rigid substrate and the cutting portion of the flexible substrate, so that the flexible substrate is adhered onto the rigid substrate by the first adhesive material. The first adhesive material does not locate on the supporting portion of the flexible substrate. At least a display unit is formed on the supporting portion of the flexible substrate. The supporting portion and the cutting portion of the flexible substrate are separated so as to separate the rigid substrate and the flexible substrate, wherein the flexible substrate and the display unit thereon form a flexible display apparatus. In the method, the flexible substrate and the rigid substrate can be easily separated.

Abstract: An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening The display module is disposed in the shell and faces the opening The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.

Abstract: A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

Abstract: A display apparatus includes a display panel, at least one anisotropic conductive adhesive and at least one chip. The display panel has a peripheral circuit region, and the anisotropic conductive adhesive is adhered in the peripheral circuit region. The chip is disposed on the anisotropic conductive adhesive, and the chip has an electric coupling region on a surface facing the anisotropic conductive adhesive. The electric coupling region is equipped with a plurality of electric coupling parts, and the electric coupling parts are electrically coupled to the peripheral circuit region by the anisotropic conductive adhesive. An interval is existed between a boundary of the electric coupling region and a boundary of the chip, and the electric coupling region is located in a bonding region of the anisotropic conductive adhesive. The bonding region of the anisotropic conductive adhesive is located in the boundary of the chip. The display apparatus has better reliability.

Abstract: A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.

Abstract: The structure of a trans-reflective liquid crystal display panel includes stacks in longitudinally and two areas in transversely, which are reflective area and transmissive area. A thin-film-transistor layer and a dielectric layer are formed on a substrate in sequential. For the transmissive area, a transparent conductive film, such as a pixel electrode, is formed. For the reflective area, a reflective film with multi-layer is formed on the dielectric layer and then the thin-film-transistor layer. After assembling, the trans-reflective liquid crystal display is complete. The materials of the reflective film with multi-layer and the dielectric layer are similar to have greater adhesion. Each layer of the reflective film with multi-layer includes two sublayers, the first reflective sublayer and the second reflective sublayer, which have the different refractive indexes. By modifying the temperature, pressure, gas flow and power of emitting in manufacturing process can make the refractive indexes of both layers.

Abstract: An electronic ink display device with a frontplane laminate and a TFT array substrate is provided. In the TFT array substrate, a first metal layer and a dielectric layer are disposed on a first substrate. The dielectric layer covers the first metal layer. A second metal layer is disposed on the dielectric layer. The first metal layer includes scan lines and gates, and the second metal layer includes data lines and sources/drains. The first substrate is divided into multiple pixel areas by the data lines and the scan lines. The gates and the sources/drains are disposed inside the pixel areas. A channel layer is disposed on the dielectric layer between the gates and the sources/drains. Pixel electrodes are disposed inside the pixel areas and connected to the drains. An electronic ink material layer of the frontplane laminate is disposed between a transparent electrode layer and the TFT array substrate.

Abstract: An electronic ink display device with a frontplane laminate and a TFT array substrate is provided. In the TFT array substrate, a first metal layer and a dielectric layer are disposed on a first substrate. The dielectric layer covers the first metal layer. A second metal layer is disposed on the dielectric layer. The first metal layer includes scan lines and gates, and the second metal layer includes data lines and sources/drains. The first substrate is divided into multiple pixel areas by the data lines and the scan lines. The gates and the sources/drains are disposed inside the pixel areas. A channel layer is disposed on the dielectric layer between the gates and the sources/drains. Pixel electrodes are disposed inside the pixel areas and connected to the drains. An electronic ink material layer of the frontplane laminate is disposed between a transparent electrode layer and the TFT array substrate.