Abstract: An imaging lens module includes an imaging lens, an adjustable aperture module, a first spacer and a second spacer. The adjustable aperture module is disposed between an object-side lens group and an image-side lens group of the imaging lens and comprises a blade assembly, fixed shafts, a movable component and a driving mechanism. The blade assembly includes at least two light-blocking blades forming a light pass aperture. The driving mechanism is to rotate the movable component in a circumferential direction, allowing the blade assembly to move relative to the fixed shafts for varying an aperture size of the light pass aperture. The fixed shafts are disposed on the first spacer. The second spacer and the first spacer together form an inner space in which the adjustable aperture module is accommodated. The second spacer receives and is in physical contact with the object-side lens group.

Abstract: The present invention relates to a cyber security authentication method. The method includes the following steps: in a user device: randomly generating an ephemeral decryption key, transmitting the ephemeral decryption key to a security server, and retrieving a key index from the security server; encrypting an identity information based on a part of the ephemeral decryption key to generate an electronic digital signature and an authentication token; and combining the key index, the electronic digital signature, and the authentication token to form an ephemeral certificate and transmitting the ephemeral certificate to a non-Internet electronic device; and in the non-Internet electronic device: parsing the ephemeral certificate to obtain the key index; and forwarding the key index to the security server via a transport connection including the user device to retrieve the ephemeral decryption key from the security server based on the key index.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.

Abstract: A sealing disc for vacuum closure suitable for using in reciprocating movement to an open position or a closed position to open or seal a valve port of an all-metal valve is disclosed. A sealing plate of the sealing disc is formed with a first sealing surface. When the sealing disc is in the closed position, the first sealing surface directly abuts against the valve port of the all-metal vacuum valve. A vacuum sealability can be improved and a service lifetime can be prolonged through compensating movement and adjusting movement between two metallic sealing surfaces abutting each other.

Abstract: The present invention relates to a baseboard testing interface, which comprises: a baseboard, on which a plurality of first electronic components, a plurality of signal lines, and a first connection interface are configured, and the first electronic components are coupled to the signal lines; a slot disposed on the baseboard for an external interface adapter to plug in; and a debugging adapter that is plugged into the slot, and a plurality of second electronic components and a second connection interface are configured thereon; when the debugging adapter is plugged into the slot and fixed on the baseboard, the second connection interface is contacted with the first connection interface, such that the signals can be transmitted between the baseboard and the debugging adapter. In addition, the present invention further provides a baseboard testing method.

Abstract: Methods for removing a silicon-oxy-nitride layer and wafer surface cleaning are disclosed. The method for removing a silicon-oxy-nitride layer utilizes a solution of ethylene glycol and hydrogen fluoride to completely remove the silicon-oxy-nitride layer from a substrate. Moreover, the method for wafer surface cleaning also uses a solution of ethylene glycol and hydrogen fluoride to remove chemical oxide or native oxide from wafer surfaces and an ethylene glycol solvent to rinse the wafer surfaces.

Abstract: Methods for removing a silicon-oxy-nitride layer and wafer surface cleaning are disclosed. The method for removing a silicon-oxy-nitride layer utilizes a solution of ethylene glycol and hydrogen fluoride to completely remove the silicon-oxy-nitride layer from a substrate. Moreover, the method for wafer surface cleaning also uses a solution of ethylene glycol and hydrogen fluoride to remove chemical oxide or native oxide from wafer surfaces and an ethylene glycol solvent to rinse the wafer surfaces.