Patents by Inventor Ming-Shien TSAI

Ming-Shien TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRELESS VIRTUAL REALITY (VR) DEVICES
    Publication number: 20190165457
    Abstract: The present subject matter relates to wireless VR devices. In an example implementation of the present subject matter, wireless VR devices are described. In an example, a wireless VR device includes a first array antenna disposed on a headband of the wireless VR device to communicate wirelessly. The wireless VR device also includes a second array antenna disposed on a display unit of the wireless VR device to wirelessly communicate with the docking station. In an example implementation, the first array antenna and the second array antenna have an omni-directional radiation pattern.
    Type: Application
    Filed: July 29, 2016
    Publication date: May 30, 2019
    Inventors: MING-SHIEN TSAI, YK HSIEH, CHUNG-CHUN CHEN, LEO JOSEPH GERTEN, DAVID HSIEH
  • FREQUENCY BAND SELECTION
    Publication number: 20190149181
    Abstract: Frequency band selection for tuning an antenna are disclosed. In one example, one of a Received Signal Strength Indicator (RSSI) value and an echo value of a plurality of frequency bands is obtained. Based on one of the RSSI values or the echo values of the frequency bands, a frequency band is selected. The selected frequency band is transmitted to a tuning component to tune the antenna of the electronic device.
    Type: Application
    Filed: August 4, 2016
    Publication date: May 16, 2019
    Inventor: MING-SHIEN TSAI
  • Sensor pad to capacitively couple to an antenna module
    Patent number: 9865927
    Abstract: An example computing system may include a proximity sensor including a sensor pad with a tail and an antenna to capacitively couple to the tail to increase a bandwidth of the antenna.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: January 9, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Ming-Shien Tsai
  • Sensor Pad to Capacitively Couple to an Antenna Module
    Publication number: 20170062905
    Abstract: An example computing system may include a proximity sensor including a sensor pad with a tail and an antenna to capacitively couple to the tail to increase a bandwidth of the antenna.
    Type: Application
    Filed: April 3, 2014
    Publication date: March 2, 2017
    Inventor: Ming-Shien TSAI