Patents by Inventor Ming-Shun Chan

Ming-Shun Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing high-density multilayer printed circuit boards
    Patent number: 6119338
    Abstract: A method for making high-density multilayer printed circuit boards is disclosed.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: September 19, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Tsung-Hsiung Wang, Man-Lin Chen, Chuang-Shin Chiou, Ming-Shun Chan, Pei-Wen Ding