Abstract: A fabrication method of a side-view LED package is provided. A chip carrier is provided. An opaque housing is bonded with the chip carrier. An LED chip electrically connects the chip carrier by performing a chip-bonding process and the opaque housing has a cavity for accommodating the LED chip. A transparent encapsulant is disposed in the cavity wherein the transparent encapsulant has a side-view light output surface uncovered by the opaque housing and light emitted from the LED chip is output via the side-view light output surface. A portion of the opaque housing and a portion of the transparent encapsulant are removed for reducing an overall thickness of the opaque housing such that a top surface of the transparent encapsulant is uncovered by the opaque housing beside the side-view light output surface. An opaque protective layer is formed on the top surface of the transparent encapsulant and the opaque housing.

Abstract: A solvent-resisting holographic film is a plastic film combined with an UV resin film, the UV resin film has a holographic pattern thereon, the outer surface of the holographic pattern is combined with a evaporation plating layer with a high refractive index material, each of another sides of said plastic film and said evaporation plating layer is combined with a well chemical-resisting UV resin film. The present invention can save production cost and attains a faster speed in manufacturing a holographic film. And, the film is well resistant to every king of solvent and capable of solving the problems of the bad solvent resistance of a general holographic film product at present causing the holographic pattern thereof to disappear easily.