Patents by Inventor Ming-Sung HUNG
Ming-Sung HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240388124Abstract: The present disclosure provides a system and method for providing uninterrupted power to an external device. The system and method include a power supply module coupled to an AC power source and to an external device via a power line, a switching module coupled to the power line, a redundant power supply unit coupled to the AC power source and to the switching module. The switching module is configured to detect an electrical state of the power line and connect the redundant power supply unit to the power line for providing redundant power to the external device based upon the detected electrical state.Type: ApplicationFiled: July 30, 2024Publication date: November 21, 2024Inventors: Hui-Huan HUANG, Chia-Lun CHEN, Ming-Sung HUNG
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Patent number: 12088141Abstract: The present disclosure provides a system and method for providing uninterrupted power to an external device. The system and method include a power supply module coupled to an AC power source and to an external device via a power line, a switching module coupled to the power line, a redundant power supply unit coupled to the AC power source and to the switching module. The switching module is configured to detect an electrical state of the power line and connect the redundant power supply unit to the power line for providing redundant power to the external device based upon the detected electrical state.Type: GrantFiled: October 21, 2020Date of Patent: September 10, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hui-Huan Huang, Chia-Lun Chen, Ming-Sung Hung
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Publication number: 20240087878Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Chia-Lun CHEN, Po-Jen SHIH, Ming-Sung HUNG, Wen-Hung HSU
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Patent number: 11854793Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.Type: GrantFiled: April 16, 2021Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Lun Chen, Po-Jen Shih, Ming-Sung Hung, Wen-Hung Hsu
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Publication number: 20230411190Abstract: The present disclosure provides a system and method for determining condition of wafers during processing of the wafers. The system and method include detecting vibrations of a wafer transfer robot, generating signals based upon the vibrations, and processing the signals for determining a condition of the wafers held by the wafer transfer robot.Type: ApplicationFiled: August 4, 2023Publication date: December 21, 2023Inventors: Ming-Sung HUNG, Chia-Lun CHEN, Cheng-Hao KUO
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Patent number: 11817336Abstract: The present disclosure provides a system and method for determining condition of wafers during processing of the wafers. The system and method include detecting vibrations of a wafer transfer robot, generating signals based upon the vibrations, and processing the signals for determining a condition of the wafers held by the wafer transfer robot.Type: GrantFiled: December 4, 2020Date of Patent: November 14, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Sung Hung, Chia-Lun Chen, Cheng-Hao Kuo
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Patent number: 11626300Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: GrantFiled: June 30, 2022Date of Patent: April 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Publication number: 20220336236Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Patent number: 11410857Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: GrantFiled: February 28, 2018Date of Patent: August 9, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Publication number: 20210233766Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.Type: ApplicationFiled: April 16, 2021Publication date: July 29, 2021Inventors: Chia-Lun CHEN, Po-Jen SHIH, Ming-Sung HUNG, Wen-Hung HSU
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Publication number: 20210194273Abstract: The present disclosure provides a system and method for providing uninterrupted power to an external device. The system and method include a power supply module coupled to an AC power source and to an external device via a power line, a switching module coupled to the power line, a redundant power supply unit coupled to the AC power source and to the switching module. The switching module is configured to detect an electrical state of the power line and connect the redundant power supply unit to the power line for providing redundant power to the external device based upon the detected electrical state.Type: ApplicationFiled: October 21, 2020Publication date: June 24, 2021Inventors: Hui-Huan HUANG, Chia-Lun CHEN, Ming-Sung HUNG
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Publication number: 20210193490Abstract: The present disclosure provides a system and method for determining condition of wafers during processing of the wafers. The system and method include detecting vibrations of a wafer transfer robot, generating signals based upon the vibrations, and processing the signals for determining a condition of the wafers held by the wafer transfer robot.Type: ApplicationFiled: December 4, 2020Publication date: June 24, 2021Inventors: Ming-Sung HUNG, Chia-Lun CHEN, Cheng-Hao KUO
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Patent number: 10991570Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.Type: GrantFiled: September 18, 2017Date of Patent: April 27, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Lun Chen, Po-Jen Shih, Ming-Sung Hung, Wen-Hung Hsu
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Publication number: 20190164786Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: ApplicationFiled: February 28, 2018Publication date: May 30, 2019Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Publication number: 20190088468Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.Type: ApplicationFiled: September 18, 2017Publication date: March 21, 2019Inventors: Chia-Lun CHEN, Po-Jen SHIH, Ming-Sung HUNG, Wen-Hung HSU
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Patent number: 9659794Abstract: An apparatus includes a susceptor, a first piping, a second piping, a liquid source, a third piping and a gas source. The susceptor is suitable for placing a wafer, and the first piping is configured to dispense a chemical to the wafer on the susceptor. The second piping communicates with the first piping. The liquid source is configured to deliver a cleaning liquid to the first piping through the second piping to wash a portion of the first piping. The third piping communicates with the first piping. The gas source is configured to flow a purge gas to the first piping through the third piping to purge the portion of the first piping.Type: GrantFiled: August 8, 2014Date of Patent: May 23, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Sung Hung, Yu-Kuei Lee, Cheng-Nan Kao, Hung-Hsin Liang
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Publication number: 20160040286Abstract: An apparatus includes a susceptor, a first piping, a second piping, a liquid source, a third piping and a gas source. The susceptor is suitable for placing a wafer, and the first piping is configured to dispense a chemical to the wafer on the susceptor. The second piping communicates with the first piping. The liquid source is configured to deliver a cleaning liquid to the first piping through the second piping to wash a portion of the first piping. The third piping communicates with the first piping. The gas source is configured to flow a purge gas to the first piping through the third piping to purge the portion of the first piping.Type: ApplicationFiled: August 8, 2014Publication date: February 11, 2016Inventors: Ming-Sung HUNG, Yu-Kuei LEE, Cheng-Nan KAO, Hung-Hsin LIANG